Ghodssi R., Lin P., MEMS Materials and Processes Handbook

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1184 Index

Concept

screening, 5, 9, 14, 20, 30, 33

selection, 9, 15, 30

Conductive polymer, 227–235

Conformal coating, 88, 144, 903, 906, 987

Critical point drying, 610, 619–620

Design, methodologies, 3, 6–8, 19, 22, 33

Design for manufacturability (DFM), 11,

1067–1077

Die attach materials

anodic bonding, 897–898

glass-frit bonding, 897

polymer bonding or adhesive bonding,

895–897

Dielectric etch, 462, 484–492

Direct write lithography, 704–716

Dislocation delineation, 633–635

DNA hybridization, 940, 951–952

Dopant-sensitive etch, 630–631, 636

E-beam, 27,

142, 197, 231, 441, 460, 469, 472,

514, 610–611, 623, 670, 676, 702,

704–709, 711, 716, 722, 733–735,

741, 972–973, 986, 993–995,

1119

Electrochemical deposition (ECD), 138–139,

147–169, 231

Electrochemical etch, 76, 199, 363–368,

377, 387, 540–541, 580, 595–599,

603–608, 623–625, 765, 769–770

773, 809, 1142–1144

Electroforming, 147, 158, 171, 936, 1028

Electroless plating, 139–140, 144, 162–169,

395, 900

Electroplating, 123, 139–140, 147–162, 166,

169–177, 186, 195, 198, 213, 218,

245, 367, 377, 382–383, 613, 700,

852, 863, 907, 1031, 1119, 1121,

1124–1125

Encapsulation

acrylic (PMMA), 905

epoxy, 904–905

ﬂuorocarbon (polytetraﬂuoroethylene), 905

liquid crystal polymer, 906

parylene, 905

–906

polydimethylsiloxane (PDMS), 904

polyimide, 903–904

polyurethane, 903

Endoscope, 378–380

Etch accelerator layer, 609, 611–612, 617–618

Etching, 17–18, 25–26, 234, 236, 305, 307,

325, 327, 365–368, 376–377,

403–452, 460–478, 484–623, 691,

992, 1108–1109, 1132

Etch stop, 4, 25, 113, 404–406, 443, 457, 459,

462, 466–468, 492, 579–

608, 614,

765–774, 780, 787, 801, 809, 844,

864, 1076, 1087, 1099, 1106–1107,

1142–1144, 1158

Eutectic bonding, 384, 820–821, 846–847,

855–857, 895, 898, 1104

Evaporation, 65, 114–115, 139–142, 145, 170,

220, 231, 362–363, 375, 460, 463,

469, 690, 780, 842, 972–973, 986,

993–996

, 1089, 1106, 1111, 1119,

1123, 1128, 1131–1132

Fabrication process, 9, 11, 30, 65, 73, 138–140,

173, 177, 182, 214, 225, 305–306,

317, 337, 339, 342–343, 360–377,

389, 395, 669, 672, 818, 820–822,

824, 827–829, 832, 840, 842, 860,

866, 872, 882, 909, 926–927, 929

970, 985, 988, 995, 999, 1029,

1054, 1067–1069, 1073–1074,

1076, 1085, 1095, 1114,

1126, 1145, 1148–1149, 1163,

1166

Failure modes and effects analysis (FMEA), 3,

22, 32–33

Flip-chip bonding, 897–898

controlled collapse chip connection (C4),

897

Fluidic device, 206–208, 242, 387–390, 579,

608, 688, 722, 884, 960, 1023

Focused ion beam (FIB), 213, 247, 313,

475–476, 671, 708–711, 739,

741–

743, 864

Fusion bonding, 4, 820, 838, 846, 856–857,

898, 1104

Gelatin, 216–218

Getter materials, 908

Glass encapsulation, 893

Hermeticity and pressurized packaging, 908

Hot embossing, 239–240, 242, 246–247, 579,

721–722, 987, 992, 1120–1121

Hydrophobicity, 196, 228, 242, 474, 937, 944,

994

Index 1185

Immobilized biomolecules, 955–956, 961,

963–964

Injection molding, 178, 239–240, 247, 718,

992, 1102–1103, 1120

Isotropic etch, 26, 405, 409, 412, 423, 458,

492–495, 610, 765, 1104

Layer delineation, 459, 629–637

Lead zirconate titanate (PZT), 273–274, 279,

281–282, 285, 290–291, 295–300,

318–343, 356, 439–440, 447–449,

538

Lift-off, 28, 231,

365–368, 377, 470, 690,

732–733, 1126, 1152

LIGA, 28, 123, 139, 159, 169–178, 182,

194, 245, 460–461, 579, 614,

699–700, 702, 704, 926, 1051,

1078, 1119–1121, 1133

UV-LIGA, 139, 169–178, 245

Liquid crystal polymer, 238–239, 571–572,

849, 891, 893, 906

Lithography, 27–28, 170, 667–743

Lubrication, 937, 939

, 1005–1006

Metal

alloys, 138, 142, 147, 184, 186

copper, 147, 154, 159, 163, 166–168,

175–176, 395, 484, 526, 544,

546–548, 564, 605, 611, 613–614,

632, 701, 704, 861–862, 866,

899–902, 907, 927, 976, 1002,

1004–1005, 1007, 1011, 1015,

1018, 1020–1023, 1026, 1079,

1121,

1125–1126, 1155–1156

gold, 147–148, 159–160, 163–164, 168,

206, 229–230, 233, 336, 378, 479,

482, 516, 548–549, 571–572, 605,

611, 613, 616, 624, 626, 701,

704, 734, 763, 765, 886, 893–896,

899–901, 915–917, 938, 955–956,

961, 967, 969, 978, 983–984

986, 996–997, 1056–1058,

1079, 1085–1086, 1098,

1104, 1110–1111, 1118–1121,

1124–1126, 1131–1132, 1155–1156

nickel, 65, 123, 147, 153, 158, 161–168,

244–245, 356, 363, 367, 375, 378,

382, 435, 438–439, 484, 554–556,

562, 566, 579, 605, 611, 614, 704,

886, 894,

902, 927, 1078–1079,

1121, 1124–1126

etch, 462, 479, 482, 495–501, 517, 544

-ﬁlled glasses and epoxies, 896

packaging, 886–888, 890, 915

Micro clips, 384–387

Microelectromechanical systems (MEMS)

3D integration, 390

design, 1–34, 54, 182, 910, 1047,

1049–1051

design for Manufacturability, 1067–1077

interleaved Integration, 1066

manufacturing Tolerances, 1073

process, 23, 41, 65, 67, 169, 236, 397,

460–461, 479, 484, 492, 495, 501,

513, 516,

570, 672, 687, 689–690,

801, 820–821, 824, 827–829, 834,

856, 1014, 1045–1177

Microfabrication, 42–43, 55, 67, 138, 158–162,

179, 186, 225, 231, 239, 305–306,

710, 717, 818, 872, 909, 929, 991,

1016, 1056, 1167

Micromachining, 25–27, 111, 113, 364–365,

376, 403–451, 570, 580

, 624,

667–743, 771, 1133

Micro switch, 333

Microsystems, 3–4, 161, 209, 212, 214, 404,

434, 819, 867, 926, 1111, 1130

Monolithic integration, 819, 1156, 1158

Nanoimprint lithography, 28, 671, 679, 705,

720–722, 869

Packaging, 461–462, 879–920, 1062–1063,

1079, 1102, 1132–1134,

1148–1149, 1171–1172

Parylene, 200–201, 212, 218, 221–227,

250,

395, 489, 493, 496, 499, 502,

506, 508–509, 554, 559, 576, 605,

615, 848–849, 905–906, 988–989,

1130–1132

Passivation, 51, 65–67, 69, 91, 95, 121, 174,

183, 221, 236, 244, 410, 416,

420, 422–423, 427–432, 485, 570,

597–599, 609, 636–637, 669, 770

772–774, 842, 852, 909, 962,

988–989, 1003–1004, 1025, 1135,

1143, 1149

Photoassisted etch, 597–603

Photomask, 427–428, 466–467, 469, 472,

666, 670, 672–681, 688, 690,

693–694, 696, 705, 722, 732,

736–740

1186 Index

Photoresist, 225, 233, 405, 442, 459, 469,

485–486, 495, 501–514, 517,

572, 605, 623, 682–688, 690–692,

697–698, 728–733, 1048, 1081,

1106, 1123, 1126, 1131–1132,

1137, 1153

Photoresist removal, 501–513

Physical vapor deposition (PVD), 39, 106,

114–119, 122, 138–147, 223, 301,

317, 542, 561, 969, 987

Piezoelectric, 11–

18, 273–344, 356, 434–440,

1082

Plastic packaging, 842, 1106

Polishing, 86, 175, 177–178, 195, 236, 460,

471, 525, 630, 633, 636–637,

828, 847, 858, 991, 1002–1007,

1011–1024, 1030–1032,

1084–1085, 1087–1089, 1097,

1114, 1116, 1141, 1148, 1158

Polydimethylsiloxane, 198, 201, 573, 720, 904,

942, 996

Polyethylene glycol, 196, 206

, 220–222, 574,

942, 955, 966

Polyimide, 27, 102–103, 115, 171, 173, 175,

179–180, 198–199, 212–216, 236,

238, 250, 365–366, 380, 382,

386–388, 392, 395, 451, 482,

487, 489, 496, 499, 502–504, 506,

508–509, 545, 547–549, 553–555,

557, 559–560, 570,

574–575, 586,

605, 610–611, 614–616, 686, 723,

853–854, 887, 899, 903–904, 991,

1019, 1023, 1027, 1145–1149

Polymer

etch, 517–571

microfabrication, 231

Polymethylmethacrylate (PMMA), 28, 171,

195, 198, 200, 203, 219, 241–242,

377, 425, 441, 518, 570, 575–576,

579, 614, 670, 685–686, 702–704,

706–708,

722–724, 733, 742, 848,

905, 940, 943, 975, 992, 994–995,

1023, 1120–1122

Porous silicon formation, 459, 603, 623–629

Process

deﬁnition, 5

integration, 139, 169, 186, 821, 856–863,

869, 1045–1177

module, 870–871, 1047, 1065, 1076, 1111,

1129, 1133, 1156, 1164–1165

sequence, 66, 463–464, 467, 482, 512,

609, 760, 859, 1047–

1051,

1053–1060, 1063–1067, 1070,

1073–1074, 1076–1134, 1138,

1140, 1144, 1151–1152, 1154,

1157, 1159–1161, 1164–1166, 1176

technology, 430, 1047, 1050–1054, 1058,

1066–1067, 1069, 1079, 1084,

1086, 1088, 1090–1092, 1096,

1098, 1100–1101, 1105–1106,

1108–1111, 1119–1120, 1123,

1126–1127, 1138, 1140

–1144,

1151, 1153–1154, 1157–1159,

1161–1164, 1166, 1168–1174, 1176

Product deﬁnition, 5–6, 9–10, 19, 33

Projection lithography, 674, 696, 703, 730, 739

Quality function deployment(QFD), 5, 7–9,

11–14, 17–20, 22, 33

Refractive index, 54, 63, 474, 494, 972–973,

976, 978, 980–981, 983–984, 993,

997, 1001, 1029

Resonator, 2–

3, 11, 23, 33, 86, 89, 91, 114,

274, 283–284, 294, 300–301,

309–317, 434, 608, 706, 725, 818,

841, 893, 908, 938, 1071–1072,

1078, 1082–1086, 1094–1097,

1115, 1117, 1133, 1153

RF MEMS, 75, 91, 175, 273, 291, 300,

310–314, 333, 337–338, 342–343,

570, 608

, 851, 858, 906, 1078,

1115, 1123, 1154–1156

Robotics, 273, 301, 334–336, 866, 1059

Room-temperature bonding, 830–831, 868,

870–871

Sacriﬁcial layer etch, 470–471, 608–623

Self-assembled monolayer, 198, 610, 620–622,

712, 720, 928, 931, 937, 944,

955–956, 961, 1135–1136

Semiconductor

etch, 479, 518

processing, 1059

Sensors, 1, 3–4, 10, 17, 20, 69, 74,

109,

181–182, 202, 209, 228, 239, 288,

292, 296, 300, 333, 380, 397, 570,

579, 595, 608, 619, 762, 768, 818,

842, 872, 879, 881, 885, 890, 892,

894, 904, 908, 910, 919, 929, 987,

1002, 1029, 1051, 1067, 1072,

1075–1076, 1092, 1100–1102,

1104–1105, 1108–1109, 1115

1127, 1130, 1149–1153, 1162

Index 1187

Short loops, 6–7, 22, 30, 1065, 1164

Silicide etch, 564

Silicon encapsulation, 892–893

Silicone rubber, 578

Solder bonding, 820, 855, 860, 1134

Spin coating, 122, 194, 199, 231, 688–690,

735–736, 847, 849–850, 905, 969,

991, 995, 998

Spray coating, 690

Sputtering, 114–118, 139–140, 142–146,

170, 174, 180, 182, 186, 301–302,

304, 318, 320, 361–363,

365–366,

375, 385, 387, 392, 420, 428–430,

437–438, 440, 446–447, 460,

671, 708–711, 861, 905, 931–932,

986–987, 993–995, 1026, 1152

Stepper, 460, 667, 676, 679–683, 690, 695,

697, 703, 705, 728, 730–731,

738–739, 1010

Stiction, 21, 104, 297, 336, 409, 610, 619

–620,

622, 850, 905, 911, 915, 926–929,

937, 939, 944, 1113, 1115, 1119,

1135–1136, 1138, 1158

SU-8, 123, 171, 173–175, 177, 193–201, 225,

245–246, 250, 570, 576, 578, 616,

687, 702, 818, 893, 897, 940, 949,

953, 960, 988, 992, 998–1002,

1031–1032, 1122, 1132

Surface

energy, 105, 180, 196, 203, 723, 735, 822,

828, 831, 865, 933–937, 993

roughness, 24, 63, 107, 118, 153, 161, 218,

301, 302–305, 375, 410, 435–438,

586, 608, 619, 725, 771–773, 821,

824–827, 830, 847, 854, 857, 862,

897, 936, 970, 990–992, 1002, 1119

treatment, 163, 220,

236, 375, 412, 573,

577, 736, 800, 909, 925–1032

Switch, 21, 157, 291–292, 299, 312–313,

330, 336–343, 390–391, 394, 481,

670, 734, 850, 986, 1078, 1113,

1121–1124, 1154–1156

Tape interconnects, 898–899

Ternary alloy, 113, 357, 373–375, 565

Thermal compression bonding, 836

Thin ﬁlm, 39, 46, 51, 85, 105, 111, 113,

115,

143–146, 179, 180, 182,

212, 223, 227, 275–276, 288,

295–300, 306, 310, 318, 322–323,

329–331, 333–343, 361–364,

371–375, 381, 386–388, 395–397,

460–461, 469, 476, 495, 517,

564, 579–580, 595, 601–605, 619,

689, 713, 725, 761, 774, 781,

783

–785, 803, 807, 810, 818,

857, 884, 890, 905, 910, 978–979,

986–987, 989–990, 992–995, 997,

1008, 1014, 1046–1047, 1053,

1055–1057, 1068, 1070, 1076,

1082–1083, 1149, 1157

Thin plate, 30, 361, 387

Through wafer vias, 579, 821, 857, 860

TiNi alloy, 357–358, 360–361, 363–365,

371–373, 375–377,

393

Transmission, 241, 313, 337–343, 670, 677,

695–696, 739, 842, 850–851, 853,

858, 863–864, 883, 894, 916, 925,

969, 974, 976–977, 982, 986–987,

1000, 1123

Tribology, 104, 800, 905, 939, 1004–1005,

1007

Van der waals force, 610, 822, 824, 927

Vapor etch, 458, 497, 499, 610, 613, 615, 832

Wafer

bonding, 4,

109, 118, 198, 817–873, 892,

908, 1026, 1030, 1051, 1070, 1098,

1033–1034, 1044, 1049

cleaning, 458, 479–482, 501–513, 728,

831, 856, 1046

level packaging, 237, 851, 866, 872,

880–881, 892, 908, 914, 916, 1079,

1095, 1132–1134

processing, 495, 1173

-scale packaging, 1062–1063

Wet etch, process, 176, 457–637

Wire

bonding

aluminum, 763, 899, 901–902

copper, 899, 902

gold, 899–901

X-ray, 28, 117, 160, 169–171, 193–195, 245,

322–323, 579, 666, 672, 698–704,

863–864, 929–931, 942, 975–976,

992, 1120–1122