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The mechanical properties of the metallic material are relatively unchanged
because the number of dislocations is not reduced during recovery. However, since
residual stresses are reduced or even eliminated when the dislocations are rearranged,
recovery is often called a stress-relief anneal. In additi on, recovery restores high elec-
trical conductivity to the metal, permitting us to manufacture copper or aluminum wire
for transmission of electrical power that is strong yet still has high conductivity. Finally,
recovery often improves the corrosion resistance of the material.
Recrystallization When a cold worked metallic material is heated above a certain
temperature, rapid recovery eliminates residual stresses and produces the polygonized
dislocation structure. New small grains then nucleate at the cell boundaries of the poly-
gonized structure, eliminating most of the dislocations (Figure 8-15). Because the num-
ber of dislocations is greatly reduced, the recrystallized metal has low strength but high
ductility. The temperature at which a microstructure of new grains that have very low
dislocation density appears is known as the recrystallization temperature. The process of
formation of new grains by heat treating a cold-worked material is known as recrystal-
lization. As will be seen in Section 8-7, recrystallization temperature depends on many
variables and is not a fixed temperature similar to melting temperature of elements and
compounds.
Grain Growth At still higher annealing temperatures, both recovery and recrystalliza-
tion occur rapidly, producing a fine, recrystallized grain structure. If the temperature is
high enough, the grains begin to grow, with favored grains consuming the smaller
grains (Figure 8-16). This phenomenon, called grain growth, is driven by the reduction
in grain boundary area and was described in Chapter 5. Illustrated for a copper-zinc
alloy in Figure 8-14, grain growth is almost always undesirable. Remember that grain
growth will occur in most materials if they are subjected to a high enough temperature
and, as such, is not related to cold working. Thus, recrystallization or recovery are not
needed for grain growth to occur.
You may be aware that incandescent light bulbs contain filaments that are made
from tungsten (W). High temperature causing grain growth and the subsequent reduc-
tion in strength is one of the factors that causes the filament to fail.
Ceramic materials, which normally do not show any significant strain hardening,
show a considerable amount of grain growth. Also, abnormal grain growth can occur
in some materials as a result of a formation of liquid phase during their sintering
(Chapter 15). An example of where grain growth is useful is the application of alumina
ceramics for making optical materials used in lighting. In this application, we want very
Figure 8-15 The effect of annealing temperature on the microstructure of cold-worked metals.
(a) cold-worked, (b) after recovery, (c) after recrystallization, and (d) after grain growth.
8-6 The Three Stages of Annealing 243