Hoffman D.M., Singh B., Thomas J.H. (Eds). Handbook of Vacuum Science and Technology

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816

Index

Argon, 518-519

and diode pump, 223

Argon ion beam etching, 682

ASA (ANSI) flanges

components with, 431

features of, 421

Aspect ratio dependent etching, 639, 650

Atmospheric pressure, pumpdown from, 494

Atomic desorption, 53-54

Auger electron spectroscopy, 735, 737-741

Auger process, 735

Auger spectrum, 735

Auger transition, 734

Automotive industry, sputter technology in, 624

Auxiliary pumps, diaphragm pumps as, 87-88

Avogadro's law, 9-10

Avogadro's number, 10, 41

Axial sources, ion generation, 306

Backing, 116

Backing pumps

diaphragm pumps as, 87-88

molecular drag pumps, 202

and tolerable forepressure, 128-129

turbomolecular pumps, 202

Backstreaming

accidental backstreaming, 140-142

and contamination, 592-593

and fluid films, 143

mechanical pump effects, 142

minimizing, 593

and power failure, 593

primary/secondary, 137-138

and pump speed, 138-139

and pumping fluid loss. 142-143

rate versus pressure, 140-142

surface migration, 140

vapor jet pumps, 137-143

Baffles, vapor jet pumps, 132-133

Bakeout

and outgassing, 507

seal disturbance during, 516

time frame for, 597

Bandgap engineering, 696

Barrel reactors, plasma etching, 644-645

Batch inlet, 302

Bayard-Alpert hot cathode ionization gauges,

273-276

Beaded-edge face-scaled flanges, 411-412

Beam stacking method, 791

Bearings

and feedthrough, 437

impact on process, 437

lifetime, equation for, 436

Bellows, of valves, 400

Beryllium oxide, 458

as thermal conductor, 457-458

Bias sputtering, 623-624

Biochemical analysis, mass analysis, 292

Blowers, vacuum blowers, 97-115

Blowoff,

particulate removal, 569-570

Boat materials, roll-to-roll vacuum coating,

769-770

Bohm sheath criteria, 632-633

Bonnet seals, 402

Boron nitride, 458, 563

Bourdon gauges, 263

Boyle's law, 9, 365

kinetic theory derivation, 14

Branauer-Emmett-Teller (BET), 44, 46, 48, 49

Brass,

in vacuum materials, 461

Brinell hardness, 513

Broad beam ion source, 672-673

Butterfly valves, 397, 398, 407

Butyl rubber, as seal material, 472

Bypass ranging, mass flow controller, 379-380

Bypass valves, vacuum blowers, 109-110

Cadmium, avoiding, 461

Calibration

mass spectrometers, 364-369

of vacuum gauges, 286-287

Camphor, 446

Capacitance gauges, 778

Capillary action, 47-48

Capture pumps, 60

Carbon, 563

Carbon dioxide snow, 570

Cathodic arc deposition, 774

Ceramic bearings, turbomolecular pumps, 192

Ceramics

cleaning, 569

as electrical insulator, 457

microcracks, reducing, 561

outgassing, 501-504

selected properties of, 449

Index

817

Chain blower systems, vacuum blowers, 112-

113

Channel electron multipliers, 324-325

Charge exchange, ion generation process, 350-

351

Charles's law, 9

kinetic theory derivation, 14-15

Chassis ground, mass flow controller, 384

Chelating agents, for cleaning, 575

Chemical depth profiling, electron spectros-

copies, 740

Chemical etching

chemical etchants, types of, 564

for cleaning surfaces, 570-571

for stripping, 563

wet and dry, 571

Chemical finishes, aluminum, 520

Chemical ionization, 308

Chemical kinetics analyzer, 373

Chemical memory, 726-727

Chemical polishing, stainless steel, 557

Chemical shift, electron spectroscopies, 736-

737

Chemical vapor deposition, 624

mass analysis, 372

roll-to-roll vacuum coating, 775

Chemically assisted ion beam etching, 682

Chemically unstable materials, 461

Chemisoiption, 40, 42, 447

Chevron configuration, 325

Chlorinated hydrocarbon nonpolar solvents,

571-572

Chlorofluorocarbon solvents, 572

Circular tube, viscous gas flow, 35-36

Citrinox, 520

Classical scattering, meaning of, 752

Clausing factors, conductance, 38-39

Clausius-Clapeyron plot, 157

Cleaning, 553,

567-601,

598

abrasives, 570

aluminum, 569

and assembly process, 587

ceramics, 569

chelating agents, 575

chemical etching, 570-571

conditioning, 596-598

contaminant films, 570-577

copper, 569

detergent cleaning, 574

and documentation, 599-601

drying, 584-585

external cleaning, 567-586

gases for, 576-577

glass,

569

and handling, 589-590

in situ cleaning, 591-596

liquids for, 575-576

mechanical processes in, 581

monitoring of, 585-586

particulate removal, 569-570

pH adjusters, 575

piranah solution, 575

plasma cleaning, 571, 577

polymers, 569

and processing environment, 587-589

and process-related contamination, 596

reactive cleaning, 575-578

rinsing, 578-580

safety factors, 586

saponifiers for, 572-574

soaking, 580

solvents for, 571-572

spraying, 581

stainless steel, 568-569

and storage/packing, 590-591

and surface tension, 574

and system-related contamination, 592-596

ultrasonic cleaning, 582-584

vapor cleaning,

581

-582

See also Polishing

Cleanrooms, 589

Clothing, for contamination control, 588

Cluster tools, plasma etching tools, 666

Coarse pumps, 60

Coaxial feedthrough, 442

Coefficients

of diffusion, 21

of thermal conductivity, 21

Cold-bore machines, 798-800

development of, 798-800

Cold-caps, vapor jet pumps, 146

Cold-cathode ionization gauges, 276-278

Colossal magneto resistance materials, 706-

707

Combat, 563

Compression ratio

diaphragm pumps, 87

vacuum blowers, 101-102, 107-108

Compressors, cryogenic pumps, 153-155

Concrete, as vacuum material, 460

818

Index

Condensation, 48-49

cryogenic pumps, 159-160

meaning of, 48-49

Conditioning, 596-598

to avoid splashing, 703

desorption, 596-597

sputter cleaning, 598

Conductance

clausing factors, 38-39

conductances in parallel, 33

conductances in series, 33-34

elements of, 32-33

Knudsen's formulation, 37-38

vacuum valves, 402-403

ConFlat flanges, 418-421, 430, 474-476

aluminum, 514-515

Constant speed case, 66-67

Constant temperature method, 266

Constant throughput case, 67

Constrained flanges, 516-517

Construction materials

and absorption, 447

and adsorption, 447

ceramics, selected properties of, 449

and diffusion, 447

for electrical conductors, 455-456

for electrical insulators, 457-458

and evaporation, 446-447

lubricants, 458-460

materials to avoid, 460-461

metals, selected properties of, 450

organic materials, 460

and outgassing, 447

and permeation, 449

polymeric materials, selected properties of,

448

and solubility, 447, 449

for thermal conductors, 457-458

for thermal insulators, 457-458

vacuum chamber materials,

451

-455

Contaminant films, cleaning, 570-577

Contamination

versus clean surface, 567

and cleanrooms, 589

contaminants, types of, 568, 588, 596

from desorption, 596

oil contamination, 594-595

and plasma-enhanced chemical vapor deposi-

tion,

718

and plasma-etching, 640-641

and processing environment, 587-588

process-related contamination, 596

and stainless steel, 568-569

system-related contamination, 592-596

Continuous coating, advantages of, 784

Continuous Electron Beam Accelerator Facility,

800

Control valves, types of, 397-398

Controller error, mass flow controller, 381-382

Convection gauges, 269-270

Convectron, 269

Cool gas feedback blowers, vacuum blowers,

111

Copper

cleaning, 569

in construction of electrical conductors, 455-

456

polishing, 560-561

as seal metal, 481

Corrosion

aluminum, 538-541

reducing rate of, 785-786

thin films, 785-786

Corrosive gases, turbomolecular pumps, 203-

204

Cracks

avoiding and welding, 542-546

cracking patterns, 344

Crisco, 461

Critical dimension (CD control), 639

Critical fluids, 572

Critical temperature, 10

Cross-beam sources, ion generation, 306

Crossover, cryogenic pumps, 163-164

Crossover rating, 164

Crossplume configuration, to avoid splashing,

704

Crucible materials, roll-to-roll vacuum coating,

769-770

Crucible rotation, Czochralski silicon crystal

puller, 441-442

Cryogenic pumps, 149-181

adsorption, 160-162

automated regeneration, 169-171

benefits of, 179-180

capacity of, 164-165

chamber evacuation, 173-174

combined with turbomolecular pumps, 205-

207

components of, 149-151

Index

819

compressors, 153-155

condensation, 159-160

crossover, 163-164

development of, 151-152

8-inch

pump, characteristics of, 156

electrical heaters, 168-169

evaporation systems, 174-175

flow regimes, 156-157

future view of, 181

ion implantation, 177

limitations of, 180

partial regeneration, 171-172

pressure sensors, 168

refrigerator operation, 152-153

regeneration, 165-167

sputtering systems, 176-177

temperature indicators, 167-168

thermal radiation, 162

for ultra-high vacuum, 217-218

used in combination, 776-777

uses of, 155-156

vapor pressure, 157-159

water-vapor specific pumps, 177-178

Cryotraps, 776

C-Stellarator

fusion device, 792

Cubic zirconia, as thermal insulator, 458

Cylinders, aluminum, 533-534

Cylindrical mirror analyzer, 741-742

Cyropumps, 776-777

Czochralski silicon crystal puller, crucible rota-

tion,

441-442

Dalton's law of partial pressure, 10

Dark space, 630

DC bias, plasma etching, 648-649

DC diodes, sputter deposition, 613-614

DC ion source, 674-675

DC tungsten inert gas welding, 547

Decorative products, roll-to-roll vacuum coat-

ing, 764

Degree of vacuum, 4

Deionized water, for rinsing, 578-579

Delta seal, 478

Demountable seals, 512-518

CF flanges, 514-515

constrained flanges, 516-517

diamond-shaped seals, 515

materials, 516

metal C-rings, 515

seal disturbance during bakeout, 516

seal effectiveness, criteria for, 513

unconstrained flanges, 518

wire seals, 515

Densification, 688

Deposit buildup, removal of, 563

Deposit diamondlike carbon, 689-690

Deposition

cathodic arc deposition, 774

chemical vapor deposition, 775

ion-beam-assisted deposition, 687-689

ion beam direct deposition, 689-690

ion beam sputter deposition, 683-687

and magnetron sputtering, 618-620

organic materials, 775

pulsed laser deposition, 694-707

sputter deposition,

611

-624

Desiccants, types of, 591

Desorption, 49-52, 596-597

electron-and ion-stimulated desorption, 53-

54,

597-598

photodesorption, 598

thermal desorption, 50-52, 596-597

ultrasonic desorption, 53, 598

Detergent cleaning, 574

Diamond, as thermal conductor/electrical insu-

lator, 457

Diamond-shaped seals, 515

Diamondlike carbon, and pulsed laser deposi-

tion,

706

Diaphragm gauges, 263-264

Diaphragm pumps, 84-96

as backing/auxiliary pumps, 93-95

multistage pumps, 86

operating principles, 84, 86-87

parts of, 84-85

performance factors, 91-92

pumping speeds, 87-88

single-stage pumps, 85-86

standalone operation, 92-93

state-of-the-art design, 87-91

uses of, 84

Diaphragm valves, 393, 396, 407

Diffusion

coefficient of, 21

and construction materials, 447

to harden surfaces, 565-566

and nonmetallic materials, 490

outgassing by, 497-500

820

Index

Diffusion pumps, 776

for ultra-high vacuum, 217

See also Polymer seals

Elastomers, and outgassing, 488-489,497-501

Electric light sources, mass analysis, 297-298

Electric quadrupole analyzers, 309-319

Electrical conductors, materials for, 455-456

Electrical insulators, materials for, 457-458

Electrical products, roll-to-roll vacuum coating,

764

Electro-optical products, roll-to-roll vacuum

coating, 765

Electron beam heating, for

evaporation,

768-769

Electron bombardment heating, sublimation

from, 247

Electron cyclotron resonance sources, plasma

etching tools, 662-664

Electron energy distribution function, 630

Electron impact, ion generation, 303-307

Electron impact emission spectroscopy, uses of,

296

Electron inelastic mean free path, 735

Electron spectroscopies, 732-745

Auger electron spectroscopy, 735, 737-741

chemical depth profiling, 740

chemical shift, 736-737

cylindrical mirror analyzer, 741-742

elemental depth profiling, 738-740

elemental mapping, 741

hemispherical sector analyzer, 742-744

operational factors, 733-734

qualitative analysis, 734-735

quantitative analysis, 737-738

surface sensitivity mechanism, 735-736

X-ray photoelectron spectroscopy, 732, 733,

736,

737-740

X-ray sources, 744-745

Electron stimulated desorption, 53-54, 597-

598

ion generation process, 348-350

Electronic device fabrication, mass analysis, 296

Electropolishing

aluminum alloys, 559

stainless steel, 556-558

Electrostatic chucks, plasma etching tools, 666

Elemental depth profiling, electron spectros-

copies, 738-740

Elemental mapping, electron spectroscopies,

741

Elhpsometry, plasma diagnostic, 641

End point detection, plasma etching, 666

Etching. See specific etching methods

Evacuation, 22-23

cryogenic pumps, 173-174

evacuation rate, 24

process pumping, 74-75

Evaporation

basics in process of, 767-768

and construction materials, 446-447

cyrogenic pumps, 174-175

heating as source of, 768-769

mass analysis, 371

roll-to-roll vacuum coating, 766-769

Exfoliation, and splashing, 702

Faraday collectors, 323-324

Feedthroughs

magnetic fluid feedthroughs, 433-443

materials used, 439

Index

821

Ferrite magnets, 229

Fickian kinetics, 48

Fick's laws, 50, 51

Field ionization, 308

Filament materials, ion generation, 304

Fillet

joints,

545

Filter geometry, 318

Fine pumps, 60

Fingerprint spectra method, 750

Flanges

ASA (ANSI) flanges, 421

beaded-edge face-sealed flanges, 411-412

comparison of systems, 411

components with ASA (ANSI) type flanges,

431

components with ISO-type flanges, 427-430

components with knife-edge-sealed flanges,

430

constrained flanges, 516-517

JIS flanges, 421-423

knife-edge-sealed flanges, 418-421

O-ring-sealed

flanges, 412-417

rectangular flanges, 425

selecting system, 410

unconstrained flanges, 518

vacuum valves, 402-403

wire-sealed flanges, 423-424

Rat plates, aluminum, 533

Flourel, 465

Fomblin, 474

Forepumping, 116

Forward recoil scattering, 753

Fractionation patterns, 344

Fragmentation, ion generation process, 344-345

Fragmentation analysis, gas identification, 358-

364

Free molecule flow, 29

Free outgassing rate, 485

Freon, 585

Fusion. See Magnetic fusion

Gas analysis, residual gas, 135-136

Gas chromatograph-mass spectrometry, 374

Gas composition/purity analysis, mass analysis,

292-293

Gas correction factor, mass flow controller, 385

Gas flow, 26

description of, 26-27

gas flow, viscous gas flow, 26

gas flow rate, 29-30

intermediate gas flow, 26

molecular gas flow, 26, 29, 37

nature of, 25-26

throughput Q, 30

turbulent gas flow, 26, 27-28

viscous gas flow, 28, 35-36

volumetric flow rate, 30

Gas identification

fragmentation analysis, 358-364

isotope analysis, 355-358

Gas laws

derivation of, 14-15

ideal gas law, 14-15

listing of, 9-10

Gas rarefaction, and magnetron sputtering, 621

Gas release, from surfaces, 54

Gas secondary ion mass spectrometry, 308

Gas stick, mass flow controller, 383

Gas temperature rise, calculation of, 106-107

Gas throughput, 23

Gas transport, throughput, 61-62

Gases

characteristics of, 8-9

for cleaning, 576-577

nonideal gases, 10

in vacuum system, 337

Gaskets, 412

and outgassing, 506-507

Gate valves, 393, 395, 406, 407

Gauges

Bayard-Alpert hot cathode ionization gauges,

273-276

bourdon gauges, 263

calibration of, 286-287

capacitance gauges, 778

cold-cathode ionization gauges, 276-278

convection gauges, 269-270

diaphragm gauges, 263-264

direct reading gauges, 260-264

hot-cathode ionization gauges, 270-276

indirect reading gauges, 265-282

ion gauges, 778

liquid-wall gauges, 260-263

molecular drag gauges, 279-282

Pirani gauges, 265-266

resonance gauges, 278-279

thermal conduction gauges, 778

thermal conductivity gauges, 265-270

822

Index

Gauges (continued)

thermistor gauges, 268

thermocouple gauges, 266-268

triode hot cathode ionization gauges,

271

273

General gas law, 10

Getter pumps, 220, 242-252

getter-ion pumps, 75-76

nonevaporable getter pumps, 220, 247-252

sublimation pumps, 242-247

Gifford-McMahon cycle, 152

Glass

cleaning, 569

in construction of vacuum chamber,

451

452

glass coating, sputter technology in, 624-

625

microcracks, reducing, 561

viewports, 444

Glass industry, mass analysis, 297

Gloves, materials for, 590

Glow bar, 598

Glyptal,451

Gram molecular volume, 9

Graphite, 675

Greases, as lubricant, 458-459

Grid/open/RGA/UHV sources, ion generation,

306

Gridless sources, ion sources, 675

Grit blasting, 563

Handling, and cleaning surfaces, 589-590

Hardening of surfaces, 565-566

Heat of adsorption, 42

Helical inductive couplers, plasma etching tool,

659-660

Helical resonators, plasma etching tool, 660-

661

Helicoflex seal, 477-478, 482

Hemispherical sector analyzer, 742-744

Henkel/Parker Amchem P3 Detergent, 520

Hi-potting, 240

High-curie point permanent magnet, 675

High-pressure diodes, plasma etching, 645-646

High vacuum, 6-7, 71-72, 78-79

sputtering, 609-626

High-vapor-pressure materials, 460-461

Holding pump, 80

Hollow shaft seals, 441

Hollow-anode-enhanced triodes, plasma etching

tool, 654-656

Horizontal introduction system, 756

Hot-cathode ionization gauges, 270-276

Hydrogen, 447, 449, 456

Hydrogen peroxide, for cleaning, 576

Hydrogen plasmas, for cleaning, 577

Hypertests, 785

HYSURF, 568

Ice cubes, 446

Ideal gas law, 14-15

Impedance measures, plasma diagnostic, 641

situ cleaning, 591-596

Indirect reading gauges, 265-282

Indium, as seal metal, 481

Induced DC bias, plasma etching tools, 648-

649

Inductive heating, for evaporation, 768

Inductively coupled plasmas, 658-662

Inlet systems, 300-303

batch inlet, 302

membrane inlet, 303

modulated inlet, 303

pressure reduction, 302

and range of pressure, 301

tee element, 302-303

Inlet throttling systems, vacuum blowers, 109

Intelligent gauge tubes, 286

Intermediate gas flow, 26

International Tokamak Engineering Reactor

(ITER), 790, 810

Intersecting Storage Rings, 793, 794, 798

Intrinsic resputtering, 612

Ion analyzers, 308-323

electric quadrupole analyzers, 309-319

magnetic sector analyzers, 319-322

time-of-flight analyzers, 322-323

Ion beam assisted deposition

cyrogenic pumps, 175

process of, 687-689

Ion beam direct deposition, process of, 689-690

Ion beam etching, 678-683

argon ion beam etching, 682

chemically assisted ion beam etching, 682

cooling of substrate, 679-680

etch rate, 679

Index

823

ion beam etching, 682-683

reactive ion beam etching, 682

Ion beam neutralization, 677-678

methods of, 677-678

Ion beam sputter deposition, 683-687

Ion beam technology, 672-691

broad beam ion source, 672-673

DC ion source, 674-675

development of, 672-673

gridless sources, 675

ion beam assisted deposition, 687-689

ion beam direct deposition, 689-690

ion beam etching, 678-683

ion beam neutralization, 677-678

ion beam sputter deposition, 683-687

Kaufman ion source, 673

RF ion source, 674

Ion bombardment-enhanced etching, 636

Ion detection, 323-325

channel electron multipliers, 324-325

discrete dynode multipliers, 324

Faraday collectors, 323-324

microchannel plate multipliers, 325

Ion detector, partial pressure measurement,

354-355

Ion gauges, 778

Ion generation, 303-308

alpha ionization, 307-308

axial sources, 306

chemical ionization, 308

cross-beam sources, 306

electron impact, 303-307

field ionization, 308

filament materials, 304

grid/open/RGAAJHV sources, 306

ion source configurations, 306

lathane hexaboride-coated base metals, 305-

306

magnetic sector instruments, 307

photo ionization, 307

quadrupole instruments, 307

rhenium, 305

special construction ion sources, 307

thoria-coated cathodes, 305

thoriated tungsten, 305

tungsten, 304-305, 346-347

Ion generation process, 340-351

charge exchange mechanisms, 350-351

electron stimulated desorption, 348-350

fragmentation, 344-345

instrument outgassing, 345-346

ionization efficiency, 342

surface chemistry, 346-347

Ion implantation, cryogenic pumps, 177

Ion peening, 623, 688

Ion scrubbing, 597-598

Ion source configurations, ion generation, 306

Ionized sputter deposition, 626

Iris/blade valves, 407

ISO-K flanges, 412,414

ISO-KF flanges, 412, 415, 417,427,428

ISO-MF flanges, 412,414,415, 417, 427

ISO-0-ring-sealed flanges

components with, 427-430

features of, 412-417

ISO-Universal flanges, 414

Isotherms, 42

Langmuir isotherm, 46

surface adsorption isotherms, 45-47

Isotope analysis, gas identification, 355-358

Isotope ratio analysis, mass analysis, 292

)

JIS flanges, 421-423

Joint design, aluminum, 546-547

Kaufman ion source, 673

Kinetic theory

basic assumptions in, 11

diffusion, 21

gas laws, derivation of, 14-15

molecular motion, 12-13

thermal conductivity, 21

Knife-edge-sealed flanges, 418-421

components with, 430

Knock on effects, sputtering, 609

Knudsen number, 26-27

Knudsen's formulation, conductance, 37-38

Laboratory/engineering (L/E) notebook, 599-

600

Langmuir isotherm, 46

Langmuir probe, plasma diagnostic, 642-643

Large Electron Positron storage ring, 798

Large Hadron Collider, 790, 798

824

Index

Large-scale processes

roll-to-roll vacuum coating, 761-787

ultra-high-vacuum technology, 789-810

Laser absorption spectroscopy, plasma diagnos-

tic,

642

Laser induced fluorescence, plasma diagnostic,

643

Laser reflection interferometry, plasma diagnos-

tic,

641

Lathane hcxaboride-coated base metals, ion

generation, 305-306

Lawson criteria, magnetic fusion. 802

Lead

avoiding, 461

as seal metal, 481

Lead-tin solder, in vacuum materials, 461

Leak/needle valves, 311, 407

Leaks

detection, mass analysis, 293, 370-371

leak rates, 23

and pumpdown time, 67-68

Light-duty feedthroughs, 440

Linearity, mass analysis, 300

Liquid column manometer, 261-262

Liquid nitrogen, fluid films on LN traps, 143

Liquid seal, 481

Liquid sealed blowers, 112

Liquid target, to avoid splashing, 705

Liquid wall gauges, 260-263

Loschmidt's number, 10

Loss electron, 735

Low-carbon steel

cleaning/polishing, 558

porosity of, 558

Low-pressure etching, 636, 646-647, 650-651

Low-vacuum, 5

Low-vapor pressure materials, 446-447

Lubricants, 458-460

criteria in selection of, 458

dry lubricants, 459

metal-on-metal couples, 459-460

oils/greases, 458-459

uses in vacuum systems, 458

Lucite, 460

Macor, 451

Magnesium perchloratc, 591

Magnetic bearings, turbomolecular pumps,

193-194

Magnetic fields, and turbomolecular pumps, 203

Magnetic fluid feedthroughs

characteristics of, 437,439

coaxial feedthrough, 442

comparison to other feedthroughs, 442-443

crucible rotation/Czochralski silicon crystal

puller, 441-442

hollow shaft seals, 441

impact on process, 436-438

light-duty feedthroughs, 440

operating region guidelines, 435

uses of, 434-436

Magnetic fluids, and process environment, 436-

437

Magnetic fusion, 801-810

future view, 810

historical view, 803-804

Lawson criteria, 802

Model C, 804-805

tokamaks, 802, 805-809

Magnetic sector analyzers, 319-322

Magnetic sector instruments, ion generation,

307

Magnetically enhanced reactive ion etcher

(MERIE), 652

Magnetically enhanced triodes, plasma etching

tool, 656-658

Magnetron sputtering, 616-623, 624-625

and deposition, 618-620

and gas rarefaction, 621

plasma etching, 652-653

process of, 616-618

reactive sputtering, 621-623

uses of, 624-625

Manufacturing processing instructions, 600

Martin, 454

Mass and energy sampling, plasma diagnostic,

642

Mass filter, partial pressure measurement, 351,

354

Mass flow controller, 378-387

bypass ranging, 379-380

control system design, 381-382

control valve design, 380-381

controller error,

381

-382

electrical requirements, 383-384

gas line components, 383

Index

825

gas type effects, 385

installation of, 382-383

orientation effects, 385

sensing techniques, 378-379

temperature effects, 384

troubleshooting, 386-387

Mass flow measurement, 376-387

mass flow controller, 378-387

measurement principles, 377-378

units of mass flow, 376-377

Mass flow rate, 30

Mass number, 290

Mass spectrometer calibration, 364-369

orifice flow technique, 367-369

pressure rate-of-rise technique, 366-367

static volume expansion, 365

transfer standards, 370

Mass spectrometers, 282, 290-303

chemical kinetics analyzer, 373

development of, 335-336

dipole type, 318-319

electron impact emission spectroscopy, 296

and expected gases in vacuum system, 336-

340

gas chromatograph-mass spectrometry, 374

gas identification, 355-364

inlet systems, 300-303

ion generation process, 340-351

monopole type, 318

multipole type, 318

partial pressure measurement,

351

-355

performance factors, 299-300

research applications, 372-374

secondary ion mass spectrometry, 308, 373

temperature desorption spectroscopy, 373

time-of-flight mass spectrometry, 299, 373-

374

uses of, 291-299, 336, 370-372

Matching network, plasma etching tools, 648,

662,

664

Material Safety Data Sheets, 586

Maxwell-Boltzmann distribution, 12

Mean free path, 17, 19

meaning of, 4

Measurement

calibration of vacuum gauges, 286-287

gauges, 258-282

ion analyzers, 308-323

ion detection, 323-325

ion sources, 303-308

mass flow measurement, 376-387

mass spectrometers, 282, 290-303

vacuum-measuring instruments, 282-286

Mechanical finishes, aluminum, 518-519

Medical applications, mass analysis, 293

Medium-vacuum, 5

Membrane inlet, 303

MESA flanges, 425

Metal C-rings, 515

Metal films

and pulsed laser deposition, 706

sputter technology for, 625

Metal seals, 464, 474-482

historical view, 474-476

seal metals, 481

situations for use of, 464

and stored energy, 476-478

theoretical factors, 479-481

types of, 474-479

Metal-on-mctal couples, 459-460

Metallurgical applications, mass analysis, 294

Metals

outgassing, 501-504

selected properties of, 450

Metglas, 461

MicroChannel plate multipliers, 325

Microsharpening, 683

Microwave interferometry, plasma diagnostic,

642

Mirror effect, 650-651

Mirror machines, 803

Model C, fusion device, 804-805

Modular scalcup, 724-725

Modulated inlet, 303

Molar mass, 377

Mole, 9

Molecular beam epitaxy, 696

Molecular density, meaning of, 4

Molecular drag gauges, 279-282

Molecular drag pumps, 184, 195-197,200

backing pumps, 202

combined with turbomolecular pumps, 197-

200

design of, 195

trade names for, 200, 201

ultimate pressure, 195-196

Molecular gas flow, 26, 29

equations for, 37