Ghodssi R., Lin P., MEMS Materials and Processes Handbook
Подождите немного. Документ загружается.
744 D.R. Hines et al.
17. G.M. Whitesides, E. Ostuni, S. Takayama, X.Y. Jiang, D.E. Ingber: Soft lithography in
biology & biochemistry, Annu. Rev. Biomed. Eng. 3, 335 (2001)
18. G.M. Whitesides, Y. Xia: Soft lithography, Annu. Rev. Mater. Sci. 28, 153–184 (1998)
19. J.L. Wilbur, A. Kumar, E. Kim, G.M. Whitesides: Microfabrication by microcontact printing
of self assembled monolayers, Adv. Mater. 6, 600–604 (1994)
20. Y. Xia, G.M. Whitesides: Soft lithography review, Angew. Chem. Int. Ed. 37, 550–575
(1998)
21. X.-M. Zhao, Y. Xia, G.M. Whitesides: Soft lithographic methods for nano-fabrication, J.
Mater. Chem. 7, 1069–1074 (1997)
22. P. Calvert: Inkjet printing for materials and devices, Chem. Mater. 13, 3299–3305 (2001)
23. E. Sachs, M. Cima, P. Williams, D. Brancazio, J. Cornie: 3-Dimensional printing – Rapid
tooling & prototypes directly from a CAD mode, J. Eng. Ind. – Trans. ASME 114, 481
(1992)
24. C. Wu: Ink jets not just for the printed page, Sci. News 151, 205 (1997)
25. Photomask Basics. Available: http://www.photonics.com/about/basics.jsp. Photonics Media,
Laurin Publishing (1996–2010)
26. Contact Mask Design Principles. Available: www.amfitzgerald.com, A.M. Fitzgerald &
Associates, LLC. (2008–2010)
27. M.J. Madou: Fundamentals of Microfabrication: The Science of Miniaturization, 2nd edn.
(CRC Press, Boca Raton, FL, 2002)
28. C.-M. Shiah, Y.-Y. Hsu, Y.-C. Tung, H.-Y. Liao, K.-T. Tsai, J.-B. Wang: Alternating phase
shift mask, US Patent No. 6,977,127, 12/20/05 (2005)
29. Z. Krivokapic, C.A. Spence: Attenuated phase shift mask, US Patent No. 5,928,813,
07/27/1999 (1999)
30. SU-8: Thick Photo-Resist for MEMS. Available: http://memscyclopedia.org/su8.html
31. Microlithography. Available: http://www.cnf.cornell.edu/cnf5_courses.html. Cornell Nano
Scale Science and Technology Facility (2009)
32. M.S. Hibbs: System Overview of Optical Steers and Scanners, Chapter 1, In J.R. Sheats,
B.W. Smith (Eds.): Microlithography Science and Technology (Marcel Dekker, New York,
NY, 1998)
33. E.J. Walker: Reduction of photoresist standing-wave effects by post-exposure bake, IEEE
Trans. Electron. Dev. 22, 464–466 (1975)
34. J.M. Shaw; M. Hatzakis: Performance characteristics of diazo-type photoresists under e-
beam and optical exposure, IEEE Trans. Electron. Dev. 25, 425–430 (1978)
35. M.S. Hibbs: System Overview of Optical Steers and Scanners (Marcel Dekker, New York,
NY, 1998)
36. B.W. Smith: Resist Processing (Marcel Dekker, New York, NY, 1998)
37. J.J. Sagura, J.V.A. Allan: Azide sensitized resin photographic resist, US Patent No.
2,940,853, June 14 (1960)
38. J.M. Shaw, J.D. Gelorme, N.C. LaBianca, W.E. Conley, S.J. Holmes: Negative photoresists
for optical lithography, IBM J. Res. Dev. 41, 81–94 (1997)
39. J.V. Crivello, J.H.W. Lam: Photoinitiated cationic polymerization by dialkyl phenyl sulfo-
nium salts, J. Polym. Sci. Polym. Chem. Ed. 17, 2877 (1979)
40. J.V. Crivello: Possibilities for photoimaging using onium salts, Proceedings of the SPIE
Regional Technical Conference on Photopolymers, Society of Polymer Engineers, 267
(1982)
41. E. Alling, C. Stauffer: Image reversal of positive photoresist, SPIE Proceedings, 539
Advances in Resist Technology & Processing (1985)
42. M.L. Long, J. Newman: Image reversal techniques with standard positive photoresist,
Proceedings of the Society of Photo-optical Instruments Engineers 469, 189–193, (1984)
43. W.G. Oldham, E. Hieke: IEEE Electron Device Lett. 1, 217–219, (1980)
44. R.B. Darling: Photolithography Tutorial, University of Washington, Center for Applied
Microtechnology
9 MEMS Lithography and Micromachining Techniques 745
45. I.S. Daraktchiev: Process for coating a photoresist composition onto a substrate, US Patent
No. 4,996,080, 2/26/1991 (1991)
46. N.P. Pham, T.L. Scholtes, R. Klerk, B. Wieder, P.M. Sarro, J.N. Burghartz: Direct
Spray Coating of Photoresist for MEMS Applications, Presented at Micromachining and
Microfabrication Process Technology VII, San Francisco, CA, USA (2001)
47. L. Yu, Y. Yeow Lee, F.E.H. Tay, C. Iliescu: Spray coating of photoresist for 3D microstruc-
tures with different geometries, J. Phys. Conf. Ser. 34, 937–942 (2006)
48. E. DiFabrizio, F. Romanato, M. Gentili, S. Cabrini, B. Kaulich, J. Susini, R. Barret: High-
efficiency multilevel zone plates for keV X-rays, Nature, 401, 895–898 (1999)
49. P. Ehbets, H.P. Herzig, D. Prongue, M.T. Gale: High-efficiency continuous surface-relief
gratings for two-dimensional array generation, Opt. Lett., 17, 908–910 (1992)
50. B. Morgan, C. Waits, J. Krizmanic, R. Ghodssi: Development of a deep silicon phase fesnel
lens using gray-scale technology and deep reactive ion etching, J. Microelectromech. Sys.
(JMEMS) 13, 113–120 (2004)
51. P. Yao, G.J. Schneider, D. Prather: Three-dimensional lithography fabrication for microchan-
nels, J. Microelectromech. Sys. (JMEMS) 14, 799–805 (2005)
52. P. Yao, G.J. Schneider, D. Prather, E. Wetzel, D. O’Brein: Fabrication of three-dimensional
photonic crystals with multilayer photolithography, Opt. Express 13, 2370–2376 (2005)
53. V. Kudryashov, X.-C. Yuan, W.-C. Cheong, K. Radhakrishnan: Grey scale structures
formation in SU-8 with e-beam and UV, Microelectron. Eng. 67–68, 306–311 (2003)
54. Y.-T. Lu, C.-S. Chu, H.-Y. Lin: Characterization of the gray-scale photography with high-
resolution gray steps for the precise fabrication of diffractive optics, Opt. Eng. 43, 2666–
2670 (2004)
55. B. Morgan, R. Ghodssi: Vertically-shaped tunable MEMS resonators, J. Microelectromech.
Sys. (JMEMS) 17, 85–92 (2008)
56. B. Morgan, X. Hua, T. Iguchi, T. Tomioka, G. Oehlein, R. Ghodssi: Substrate interconnect
technologies for 3-D MEMS packaging, Microelectron. Eng. 81, 106–116 (2005)
57. B. Morgan, J. McGee, R. Ghodssi: Automated 2-axis optical fiber alignment using gray-scale
technology, J. Microelectromech. Sys. (JMEMS) 16, 102–110 (2007)
58. B. Morgan, C.M. Waits, R . Ghodssi: Compensated Aspect Ratio Dependent Etching
(CARDE) using gray-scale technology, Microelectron. Eng. 77, 85–94 (2005)
59. B.C. Morgan: Electrostatic MEMS Actuators Using Gray-Scale Technology, Ph.D. thesis,
University of Maryland, College Park, MD (2006)
60. Y. Olinger, P. Sixt, J.M. Stauffer, J.M. Mayor, P. Regnault, G. Voirin: One-step 3D shaping
using a gray-tone mask for optical and microelectronic applications, Microelectron. Eng. 23,
449–454 (1994)
61. C.M. Waits, A. Modafe, R. Ghodssi: Investigation of gray-scale technology for large area
3-D silicon MEMS stuctures, J. Micromech. Microeng. 13, 170–177 (2003)
62. M. Woytasik, J.-P. Grandchamp, E. Dufour-Gergam, J.-P. Gilles, S. Megherbi, E. Martincic,
H. Maathias, P. Crozat: Two- and three-dimensional microcoil fabrication process for three-
axis magnetic sensors on flexible substrates, Sens. Actuators A Phys. 132, 2–7 (2006)
63. L. Mosher: Double-Exposure Gray-Scale Photolithography, Master’s Thesis, University of
Maryland, College Park, MD (2008)
64. C.-C. Chen, C.-H. Hou, J.-K. Sheu, J.-Y. Chang, M.-H. Li, G.-C. Chi, C. Wu: Gratings in
GaN membranes, Jpn. J. Appl. Phys. 43, 5854–5856 (2004)
65. C.-C.L. Chen, Chien-Chieh, J.Y. Cheng, Y.L. Huang, C.-Y. Chang, M.-H. Li, Y.-S. Huang,
L.-Y. Chien, J.-Y. Chang, G.-C. Chi, W.-T. Cheng, J.-H. Yeh, C. Wu: Microlens and
micromirror for optical MEMS fabricated by e-beam photolithography and ICP etching,
International Conference of Optics in Computing (OC2002), Taipei, Taiwan, 322 (2002)
66. V.P. Korolkov, A.I. Malyshev, A.G. Poleshchuck, V.V. Cherksshin, H.J. Tiziani, C. Pruss,
T. Schoder, J. Westhauser, C. Wu: Fabrication of gray-scale masks and diffractive opti-
cal elements with LDW glass, Proceedings of SPIE – Lithographic and Micromachining
Techniques for Optical Component Fabrication, 4440, 73–84 (2001)
746 D.R. Hines et al.
67. L. Mosher, C.M. Waits, B. Morgan, R. Ghodssi: Double-exposure grayscale photolithogra-
phy, J. Microelectromech. Syst. 18, 308–315 (2009)
68. E. Lee, J. Won Hahn: J. Appl. Phys. 103, 083550 (2008)
69. J. Krizmanic, B. Morgan, R. Streitmatter, N. Gehrels, K. Gendreau, Z. Arzoumanian, R.
Ghodssi, G. Skinner: Development of ground-testable phase frenel lenses in silicon, Exp.
Astron. 20, 299–306 (2005)
70. Y. Chen, R.K. Kupka, F. Rousseaux, F. Carcenac, D. Decanini, M.F. Ravet, H. Launois: 50-
nm x-ray lithography using synchrotron radiation, J. Vac. Sci. Technol. B 12, 3959–3964
(1994)
71. Z. Cui: Micro-Nanofabrication: Technologies and Applications (Higher Education Press,
Beijing, 2005)
72. E.W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, D. Münchmeyer: Microelectron. Eng. 4,
35–56 (1986)
73. W. Ehrfeld, P. Bley, F. Götz, P. Hagmann, D. Münchmeyer, J. Mohr, O.H. Moser,
D. Münchmeyer, W. Schelb, D. Schmidt, E.W. Becker: Fabrication of microstructures
using the LIGA process, Presented at Micro Robots and Teleoperators Workshop, IEEE
(1987)
74. H. Guckel: High-aspect-ratio micromachining via deep X-ray lithography, Proc. IEEE, 86,
1586 (1998)
75. H. Guckel, T.R. Christenson, K.J. Skrobis, T.S. Jung, J. Klein, K.V. Hartojo, I. Widjaja: A
first functional current excited planar rotational magnetic micromotor, Presented at Micro
Electro Mechanical Systems, 1993, MEMS
93, Proceedings an Investigation of Micro
Structures, Sensors, Actuators, Machines and Systems (IEEE 1993)
76. V. Saile, U. Wallrabe, O. Tabata, G.K. Fedder: LIGA and Its Applications, Volume 7 of
Advanced Micro and Nanosystems (Wiley-VCH, Weinheim, Germany, 2008)
77. K. Guckel, K.J. Skrobis, T.R. Christenson, J. Klein, S. Han, B. Choi, E.G. Lovell: Fabrication
of assembled micromechanical components via deep X-ray lithography, Presented at Micro
Electro Mechanical Systems, 1991, MEMS
91, Proceedings an Investigation of Micro
Structures, Sensors, Actuators, Machines and Robots (IEEE, 1991)
78. A.R. Shimkunas, P.E. Mauger, L.P. Bourget, R.S. Post, L. Smith, R.F. Davis, G.M. Wells, F.
Cerrina, R.B. McIntosh: Advanced electron cyclotron resonance chemical vapor deposition
SiC coatings and x-ray mask membranes, J. Vac. Sci. Technol. B: Microelectron. Nanometer
Struct. 9, 3258 (1991)
79. G.M. Wells, S. Palmer, F. Cerrina, A. Purdes, B. Gnade: Radiation stability of SiC and
diamond membranes as potential x-ray lithography mask carriers, J. Vac. Sci. Technol. B
8/6, 1575–1578 (1990)
80. J. Goettert: From Design to LiGA Polymer Chips: A Customer Experience, Presentation
(Louisiana State University, 2005)
81. M. Gad-el-Hak: MEMS: Design and Fabrication, 2 edn. (CRC Press, Boca Raton, FL, 2006)
82. Y. Liu, P. Sheng: Modeling of X-ray fabrication of macromechanical structures, J. Manufact.
Proces 4, 109 (2002)
83. H. Guckel, K.J. Skrobis, J. Klein, T.R. Christenson: Micromechanics via x-ray assisted
processing, J. Vac. Sci. Technol. 12/4, 2559–2564 (1994)
84. R.K. Kupka, F. Bouamrane, C. Cremers, S. Megtert: Microfabrication: LIGA-X and
applications, Appl. Surf. Sci. 164, 97 (2000)
85. H. Guckel: Deep x-ray lithography for micromechanics and precision engineering, Rev. Sci.
Instrum. 67, 3357 (1996)
86. Y. Vladimirsky, J. Maldonado, R. Fair, R. Acosta, O. Vladimirsky, R. Viswanathan, H.
Voelker, F. Cerrina, G.M. Wells, M. Hansen, R. Nachman: Thermal effects in x-ray
masks during synchrotron storage ring irradiation, J. Vac. Sci. Technol. B 7/6, 1657–1661
(1989)
87. A. Flamholz, R. Ristein: X-ray steer exposure system performance and status, J. Vac. Sci.
Technol. B 8/6, 2002–2007 (1990)
9 MEMS Lithography and Micromachining Techniques 747
88. M. Reilly, Q. Leonard, G. Wells, C. Capasso, P. Anderson, J. Taylor, W. Waldo, K. Yamazaki,
G. Chen, K. Simon, F. Cerrina: Performance of the modified Suss XRS 200/2 M X-ray steer
at CXrL, Jpn. J. Appl. Phys. 33, 6899 (1994)
89. H. Guckel, T.R. Christenson, K.J. Skrobis, D.D. Denton, B. Choi, E.G. Lovell, J.W. Lee, S.S.
Bajikar, T.W. Chapman: Deep X-ray and UV lithographies for micromechanics, Presented
at Solid-State Sensor and Actuator Workshop, 1990. 4th Technical Digest, (IEEE 1990)
90. K. Yamazaki: Electron Beam Direct Write (World Scientific, Singapore, 2008)
91. K.L. Ekinci, X.M.H. Huang, M.L. Roukes: Ultraelectromechanical Mass Detection, Appl.
Phys. Lett. 84, 4469 (2004)
92. Y.T. Yang, C. Callegari, X.L. Feng, K.L. Ekinci, M.L. Roukes: Zeptogram-scale nanome-
chanical mass sensing, Nano Lett. 6, 583 (2006)
93. K.L. Ekinci, J. Brugger: Nanofabrication of Nanoelectromechanical Systems (NEMS)
(World Scientific, Singapore, 2008)
94. D.F. Kyser, N.S. Viswanathan: Monte Carlo simulation of spatially distributed beams in
electron-beam lithography, J. Vac. Sci. Technol. 12, 1305–1308 (1975)
95. B.D. Cook, S.-Y. Lee: Fast proximity effect correction: An extension of PYRAMID for
thicker resists, J. Vac. Sci. Technol. B 11, 2762 (1993)
96. J. Jacob, S. Lee, J. McMillan, N. MacDonald: Fast proximity effect correction: An extension
of PYRAMIN for circuit patterns of arbitrary size, J. Vac. Sci. Technol. B 10, 3077–3082
(1992)
97. E. Kratschmer: Verification of a proximity effect correction program in electron beam
lithography, J. Vac. Sci. Technol. 19, 1264–1268 (1981)
98. M.A. McCord, M.J. Rooks: Electron Beam Lithography, PM39: (SPIE Publications,
Bellingham, WA, 1997)
99. I. Utke, P. Hoffmann, J. Melngailis: Gas-assisted focused electron beam and ion beam
processing and fabrication, J. Vac. Sci. Technol. B 26, 1197–1276 (2008)
100. J.H. Orloff, M. Utlaut, L.W. Swanson: High Resolution Focused Ion Beams (Kluwer, New
York, NY, 2003)
101. A.A. Tseng, S. Jou, A. Notargiacomo, T.P. Chen, Recent developments in tip-based
nanofabrication and its roadmap, J. Nanosci. Nanotechnol. 8, 2167–2186, 2008
102. A.A. Tseng: Recent developments in micromilling using focused ion beam technology, J.
Micromech. Microeng. 14, R15–R34, 2004
103. H. Yamaguchi, A. Shimase, S. Haraichi, T. Miyauchi: Characteristics of silicon removal by
fine focused gallium ion beam, J. Vac. Sci. Technol. B 3, 71 (1985)
104. S. Dhara: Formation, dynamics, and characterization of nanostructures by ion beam
irradiation, Crit. Rev. Solid State Mater. Sci. 32, 1–50 (2007)
105. L. Frey, C. Lehrer, H. Ryssel: Nanoscale effects in focused ion beam processing, Appl. Phys.
A: Mater. Sci. Process. 76, 1017–1023 (2003)
106. L.A. Giannuzzi, F.A. Stevie: Introduction to Focused Ion Beams: Instrumentation, Theory,
Techniques and Practice (Springer, New York, NY, 2005)
107. J. Gierak, E. Bourhis, M.N.M. Combes, et al.: Exploration of the ultimate patterning
potential achievable with focused ion beams, Microelectron. Eng. 78–79, 266–278 (2005)
108. R.M. Langford, P.M. Nellen, J. Gierak, et al.: Focused ion beam micro- and nanoengineering,
MRS Bull. 32, 417–423 (2007)
109. S. Matsui, R. Kometani: Three-dimensional nanostructure fabrication by focused-ion-
beam chemical vapor deposition and its applications, IEICE Trans. Electron. E90C, 25–35
(2007)
110. J. Mayer, L.A. Giannuzzi, T. Kamino, et al.: TEM sample preparation and FIB-induced
damage, MRS Bull. 32, 400–407 (2007)
111. J. Melngailis: Focused ion-beam technology and applications, J. Vac. Sci. Technol. B 5,
469–495 (1987)
112. W.J. MoberlyChan, D.P. Adams, M.J. Aziz, et al.: Fundamentals of focused ion beam
nanostructural processing: Below, at, and above the surface, MRS Bull. 32, 424–432 (2007)
748 D.R. Hines et al.
113. P.M. Nellen, V. Callegari, U. Sennhauser: Preparative methods for nanoanalysis of materials
with focused i on beam instruments, Chimia 60, A735–A741(2006)
114. S. Reyntjens, R. Puers: A review of focused ion beam applications in microsystem
technology, J. Micromech. Microeng. 11, 287–300 (2001)
115. A.A. Tseng: Recent developments in nanofabrication using focused ion beams, Small 1,
924–939 (2005)
116. M.D. Uchic, L. Holzer, B.J. Inkson, et al.: Three-dimensional microstructural characteriza-
tion using focused ion beam tomography, MRS Bull. 32, 408–416 (2007)
117. M.A. Volkert, A.M. Minor: Focused ion beam microscopy and micromachining, MRS Bull.
32, 389–395 (2007)
118 Y.Q. Fu, N.K.A. Bryan, Experimental study of microcylindrical lenses fabricated using
focused-ion-beam technology, J. Vac. Sci. Technol. B 19, 4 1259–1263 (2001)
119. S.J. Randolph, J.D. Fowlkes, P.D. Rack: Focused, nanoscale electron-beam-induced deposi-
tion and etching, Crit. Rev. Solid State Mater. Sci. 31, 55–89 (2006)
120. N. Silvis-Cividjian, C.W. Hagen: Electron-Beam-Induced Nanometer-Scale Deposition
Advances in Imaging and Electron Physics, Vol. 143 (Elsevier Academic, San Diego, CA,
2006)
121. A.N. Broers, W.W. Molzen, J.J. Cuomo, et al.: Electron-beam fabrication of 80-A metal
structures, Appl. Phys. Lett. 29, 596–598 (1976)
122. R.W. Christy: Formation of thin polymer films by electron bombardment, J. Appl. Phys. 31,
1680–1683 (1960)
123. H.W.P. Koops, R. Weiel, D.P. Kern, et al.: High-resolution electron-beam induced deposi-
tion, J. Vac. Sci. Technol. B 6, 477–481 (1988)
124. S. Matsui, K. Mori: New selective deposition technology by electron-beam induced surface-
reaction, Jpn. J. Appl. Phys. Part 2-Lett. 23, L706–L708 (1984)
125. S. Matsui, K. Mori, K. Saigo, et al.: Lithographic approach for 100-nm fabrication by
focused ion-beam, J. Vac. Sci. Technol. B 4, 845–849 (1986)
126. W.F. van Dorp, C.W. Hagen: A critical literature review of focused electron beam induced
deposition, J. Appl. Phys. 104, 081301 (2008)
127. P.A. Crozier, C.W. Hagen: High-Resolution Electron-Beam-Induced Deposition, In A.A.
Tseng (Ed.): Nanofabrication Fundamentals and Applications, pp. 399–430 (World
Scientific, River Edge, NJ, 2008)
128. M. Su, V.P. Dravid: Colored ink dip-pen nanolithography, Appl. Phys. Lett. 80, 4434–4436
(2002)
129. A.A. Tseng, A. Notargiacomo: Nanoscale fabrication by nonconventional approaches, J.
Nanosci. Nanotechnol. 5, 683–702 (2005)
130. A. Ivanisevic, C.A. Mirkin: “Dip-Pen” nanolithography on semiconductor surfaces, J. Am.
Chem. Soc. 123, 7887–7889 (2001)
131. H. Zhang, N.A. Amro, S. Disawal, R. Elghanian, R. Shile, J. Fragala: High-throughput dip-
pen-nanolithography-based fabrication of Si nanostructures, Small 3, 81–85 (2007)
132. D. Bäuerle: Laser Processing and Chemistry, 3rd edn. (Springer, Berlin, 2000)
133. G.B. Blanchet, Y.L. Loo, J.A. Rogers, F. Gao, C.R. Fincher: Large area, high resolution,
dry printing of conducting polymers for organic electronics, Appl. Phys. Lett. 82, 463–365
(2003)
134. S.D. Allen: Laser chemical vapor-deposition – A technique for selective area deposition, J.
Appl. Phys. 52, 6501–5605 (1981)
135. C. Duty, D. Jean, W.J. Lackey: Laser chemical vapour deposition: Materials, modeling and
process control, Int. Mater. Rev. 46, 271–287 (2001)
136. M. Stuke, K. Mueller, T. Mueller, K. Williams, R. Oliver, D.A.A. Ohberg, G. Fuhr, R.S.
Williams: Direct-writing of three-dimensional structures using laser-based processes, MRS
Bull. 32, 32–39 (2007)
137. J.C. Andre, A.L. Methaute, O.D. Wittee: Dispositif pour realiser un modeie de piece
industrielle, French Patent No. 8,411,241, July 16 (1884)
9 MEMS Lithography and Micromachining Techniques 749
138. C. Hull: Apparatus for production of three-dimensional objects by stereolithography, US
Patent No. 4,575,330, August 8 (1984)
139. H. Kodama: Automatic method for fabricating a three-dimensional plastic model with
photohardening polymer, Rev. Sci. Instrum. 52, 1770–1773 (1981)
140. V.K. Varadan, X. Jiang, V.V. Varadan: Microstereolithography and Other Fabrication
Techniques for 3D MEMS (Wiley, Chichester, 2001)
141. X. Zhang, X.N. Jiang, C. Sun: Micro-stereolithography of polymeric and ceramic
microstructures, Sens. Actuators 77, 149–156 (1999)
142. W.P. Bichard: Principles and Applications of Photochemistry (Oxford University Press,
Oxford, 1998)
143. S. Kawata, H.-B. Sun, T. Tianaka, K. Takada: Finer features for functional microdevices –
Micromachines can be created with higher resolution using two-photon absorption, Nature
412, 697–698 (2001)
144. J. Serbin, A. Egbert, A. Ostendorf, B.N. Chichkov, R. Houbertz, G. Domann, J. Schulz, C.
Cronauer, L. Frohlich, M. Popall: Femtosecond laser-induced two-photon polymerization
of inorganic-organic hybrid materials for applications in photonics, Opt. Lett. 28, 301–303
(2003)
145. S. Maruo, K. Ikuta, H. Korogi: Force-controllable, optically driven micromachines fabri-
cated by single-step two-photon microstereolithography, J. Micromech. Syst. 12, 7 (2003)
146. S. Maruo, K. Ikuta, H. Korogi: Submicron manipulation tools driven by light in a liquid,
Appl. Phys. Lett. 82, 133–135 (2003)
147. J. Needham: Science and Civilization in China, Vol. 5, Pt 1 Paper and Printing (Cambridge
[Eng.] University Press, Cambridge, 1985)
148. K. Doo-jong: History of Korean printing, Korea J. 3, 22 (1963)
149. P. Hoyer: Semiconductor nanotube formation by a two-step template process, Adv. Mater. 8,
857–859 (1996)
150. P. Hoyer, N. Baba, H. Masuda: Small quantum-sized CdS particles assembled to form a
regularly nanostructured porous film, Appl. Phys. Lett. 66, 2700–2702 (1995)
151. T.E. Huber, L. Luo: Far-infrared propagation in metal wire microstructures, Appl. Phys. Lett.
70, 2502–2504 (1997)
152. P.E.J. Legierse, J.H.T. Pasman: Polymers in Information Storage Technology (Plenum, New
York, NY 1989)
153. H. Masuda, K. Fukuda: Ordered metal nanohole arrays made by a two-step replication of
honeycomb structures of anodic alumina, Science 268, 1466–1468 (1995)
154. W. Michaeli, R. Bielzer: Metal injection molding: Shaping sintered metal parts, Adv. Mater.
3, 260–262 (1991)
155. S.Y. Chou, P.R. Krauss, P.J. Renstrom: Imprint of sub-25 nm vias and trenches in polymers,
Appl. Phys. Lett. 67, 3114–3116 (1995)
156. S.Y. Chou, P.R. Krauss, P.J. Renstrom: Imprint lithography with 25-nanometer resolution,
Science 272, 85–87 (1996)
157. M. Emmelius, G. Pawlowski, H.W. Vollmann: Materialien für die optische
Datenspeicherung, Angew. Chem. Int. E d. Engl. 101, 1475–1501 (1989)
158. M.T. Gale: Micro-Optics: Elements, Systems and Applications (Taylor & Francis, London,
1997)
159. H.W. Lehmann, R. Widmer, M. Ebnoether, A. Wokaun, M. Meier, S.K. Miller: Fabrication
of sub-micron crossed square-wave gratings by dry etching and thermoplastic replication
techniques, J. Vac. Sci. Technol. B 1, 1207–1210 (1983)
160. C.M. Rodia, Precision electroforming for optical disk manufacturing, Proc. SPIE Int. Soc.
Opt. Eng. 529, 69–75 (1985)
161. K.-H. Schlereth, H. Bötther: Embossed grating lead chalcogenide distributed-feedback
lasers, J. Vac. Sci. Technol. B 10, 114–117 (1992)
162. F.P. Shvartsman: Diffractive and Miniaturized Optics (SPIE Optical Engineering Press,
Bellingham, WA, 1993)
750 D.R. Hines et al.
163. J.S. Winslow: Mastering and replication of reflective videodiscs, IEEE Trans. Consum.
Electron. 22, 318–326 (1976)
164. H.C. Haverkorn van Rijsewijk, P.E.J. Legierse, G.E. Thomas: Manufacture of laservision
discs by a photopolymerization process, Philips Tech. Rev. 40, 287–297 (1982)
165. J.G. Kloosterboer, G.J.M. Liits, H.C. Meinders: Photopolymerizable lacquers for
LaserVision video discs, Philips Tech. Rev. 40, 198–309 (1982)
166. B.D. Te rris, H.J. Mamin, M.E. Best, J.A.L. Rugar: Nanoscale replication for scanning probe
data storage, Appl. Phys. Lett. 69, 4262–4264 (1996)
167. D.Y. Kim, S.K. Tripathy, L. Li, J. Kumar, Laser-induced holographic surface relief gratings
on nonlinear optical polymer films, Appl. Phys. Lett. 66, 1166–1168 (1995)
168. N. Kramer, M. Niesten, C. Schönenberger: Resistless high resolution optical lithography on
silicon, Appl. Phys. Lett. 67, 2989–2991 (1995)
169. M. Müllenborn, H. Dirac, J.W. Peterson: Silicon nanostructures produced by laser direct
etching, Appl. Phys. Lett. 66, 3001–3003 (1995)
170. U. Reblan, H. Endert, G. Zaal: Laser ablation on the micrometer scale, Laser Focus World
30, 91–96 (1994)
171. M.A. Roberts, J.S. Rossier, P. Bercier, H. Giault: UV laser machined polymer substrates for
the development of microdiagnostic systems, Anal. Chem. 69, 2035–2042 (1997)
172. S.A. Weiss: Think small – Lasers compete in micromachining, Photon. Spectra 29, 108–114
(1995)
173. N.L. Abbott, A. Kumar, G.M. Whitesides: Using micromachining, molecular self-assembly,
and wet etching to fabricate 0.1–1- µm scale structures of gold and silicon, Chem. Mater. 6,
596–602 (1994)
174. T.J. Hirsch, R.F. Miracky, C. Lin: Selective-area electroless copper plating on polyimide
employing laser patterning of a catalytic film, Appl. Phys. Lett. 57, 1357–1359 (1990)
175. V. Malba, A.F. Bernhardt: Laser surface modification for selective electroplating of metal:
A 2.5 m/s laser direct write process, Appl. Phys. Lett. 60, 909–611 (1992)
176. A. Miehr, R.A. Fisher, O. Lehmann, M. Stuke: Laser direct writing of beta-Co/Ga and
Mn/Ga alloy microstructures from organometallic single-source precursors, Adv. Mater.
Opt. Electron. 6, 27–32 (1996)
177. M. Datta: Fabrication of an array of precision nozzles by through-mask electrochemical
micromachining, J. Elecrochem. Soc. 142, 3801–3805 (1995)
178. A. Rose, P.K. Weimer: Physical limits to the performance of imaging-systems, Phys. Today
42, 24–32 (1989)
179. M.R.V. Sahyun: Secrecies of photographic development revealed! ChemTech 22, 418–424
(1992)
180. H. Tabei, S. Nara, K. Matsuyama: Method for forming a printed circuit by photolysis of
silver salt of organic acid, J. Elecrochem. Soc. 121, 67–69 (1974)
181. S. Leävuori, J. Väänänen, M. Lothi, J. Remes, A. Uusimäki: A novel thick-film technique,
gravure offset printing, for the realization of fine-line sensor structures, Sens. Actuators A,
42, 593–596 (1994)
182. H. Moilanen, J. Laalainen, S. Leävuori: Development of piezoelectric micromovement actu-
ator fabrication using a thick-film double-paste printing method, Sens. Actuators A, 43,
357–365 (1994)
183. E. Anczurowski, J. Oliver, R.H. Marchessault: New papers for new printers, ChemTech 16,
304–310 (1986)
184. A.P. Blanchard, R.J. Kaiser, L.E. Hood: High-density oligonucleotide arrays, Biosens.
Bioelectron. 11, 687–690 (1996)
185. M. Döring: Inkjet Printing, Philips Tech. Rev. 40, 192–198 (1982)
186. A.V. Lemmo, J.T. Fisher, H.M. Geysen, D.J. Rose: Characterization of an inkjet chemical
microdispenser for combinatorial library synthesis, Anal. Chem. 69, 543–551 (1997)
187. Q.M. Pai, B.E. Springett: Physics of electrophotography, Rev. Mod. Phys. 65, 163–211
(1993)
9 MEMS Lithography and Micromachining Techniques 751
188. M. Stolka: Hard copy materials, ChemTech 19, 487–495 (1989)
189. T.M. Bloomstein, D.J. Ehrlich: Stereo laser micromachining of silicon, Appl. Phys. Lett. 61,
708–781 (1992)
190. O. Lehmann, M. Stuke: Laser-driven movement of three-dimensional microstructures
generated by laser rapid prototyping, Science 270, 1644–1646 (1995)
191. D.C. Neckers: Stereolithography – An introduction, ChemTech 20, 615–619 (1990)
192. F.T. Wallenberger: Rapid prototyping directly from the vapor phase, Science 267, 1274–
1275 (1995)
193. D. Qin, Y. Xia, J.A. Rogers, R.J. Jackman, X.-M. Zhao, G.M. Whitesides: Microfabrication,
microstructures and microsystems, Top. Curr. Chem. 194, 1–20 (1998)
194. Y. Xia: Soft lithography: Micro- and nanofabrication based on microcontact printing and
replica molding, Harvard University (1996)
195. H.A. Biebuyck, N.B. Larsen: Lithography beyond light: Microcontact printing with mono-
layer resists, IBM J. Res. Dev. 41, 159 (1997)
196. A. Kumar, G.M. Whitesides: Features of gold having micrometer to centimeter dimen-
sions can be formed through a combination of stamping with an elastomeric stamp and
an alkanethiol “ink” followed by chemical etching, Appl. Phys. Lett. 63, 2002–2004
(1993)
197. Y. Xia, E. Kim, X.-M. Zhao, J.A. Rogers, M. Prentiss, G.M. Whitesides: Complex opti-
cal surfaces formed by replica molding against elastomeric masters, Science 273, 347–349
(1996)
198. X.-M. Zhao, Y. Xia, G.M. Whitesides: Fabrication of three-dimensional micro-structures:
Microtransfer molding, Adv. Mater. 8, 837–840 (1996)
199. E. Kim, Y. Xia, G.M. Whitesides: Polymer microstructures formed by moulding in
capillaries, Nature 376, 581–584 (1995)
200. E. King, Y. Xia, X.-M. Zhao, G.M. Whitesides: Solvent-assisted microcontact molding: A
convenient method for fabricating three-dimensional structures on surfaces of polymers,
Adv. Mater. 9, 651–654 (1997)
201. A. Afzali, C.D. Dimitrakopoulos, T.L. Breen: High-performance, solution-processed organic
thin film transistors from a novel pentacene precursor, J. Am. Chem. Soc. 124, 8812 (2002)
202. J.-F. Chang, B. Sun, D.W. Breiby, M.M. Nielsen, T.I. Sölling, M.G. McCulloch, H.
Sirringhaus: Enhanced mobility of poly(3-hexylthiophene) transistors by spin-coating from
high-boiling-point solvents, Chem. Mater. 16, 4772–4776 (2004)
203. K. Murata: Super-fine ink-jet printing for nanotechnology, Presented at Proceedings of the
International Conference on MEMS, NANO and Smart Systems, Los Alamitos, CA (2003)
204. C.W. Sele, T. von Werne, R.H. Friend, H. Sirringhaus: Lithography-free, self-aligned inkjet
printing with sub-hundred-nanometer resolution, Adv. Mater. 17, 997 (2005)
205. Y.-L. Loo, J.W.P. Hsu, R.L.Willett, K.W. Baldwin, K.W.West, J.A. Rogers: High-resolution
transfer printing on GaAs surfaces using alkane dithiolmonolayers, J. Vac. Sci. Technol. B
20, 2853 (2002)
206. W.R. Childs, R.G. Nuzzo: Decal transfer microlithography: a new soft-lithographic pattern-
ing method, J. Am. Chem. Soc. 124, 13583 (2002)
207. M. Colburn, S. Johnson, M. Stewart, S. Damle, T. Bailey, B.J. Choi, M. Wedlake, T.
Michaelson, S.V. Sreenivasan, J. Ekerdt, C.G. Willson: Step and flash imprint lithogra-
phy: A new approach to high-resolution patterning, Presented at SPIE’s 24th International
Symposium on Microlithography: Emerging Lithographic Technologies III, Santa Clara, CA
(1999)
208. P.S. Hong, J. Kim, H.H. Lee: Contrast modified room-temperature imprint lithography, Appl.
Phys. Lett. 88, 173105 (2006)
209. H. Lee, G.-Y. Jung: Wafer to wafer nano-imprinting lithography with monomer based
thermally curable resin, Microelectron. Eng. 77, 168–174 (2005)
210. S.Y. Chou, C. Keimel, J. Gu: Ultrafast and direct imprint of nanostructures in silicon, Nature
417, 835 (2002)
752 D.R. Hines et al.
211. H.W. Ro, R.L. Jones, H. Peng, D.R. Hines, H.-J. Lee, Eric K. Lin, A. Karim, D.Y. Yoon,
D.W. Gidley, C.L. Soles: The direct patterning of nanoporous interlayer dielectric insulator
films by nanoimprint lithography, Adv. Mater. 19, 2919–2924 (2007)
212. S.Y. Chou, P.R. Krauss, W. Zhang, L. Guo, L. Zhuang: Sub-10 nm imprint lithography and
applications, J. Vac. Sci. Technol. B 15, 2897 (1997)
213. H. Schift: Nanoimprint lithography: An old story in modern times? A review, J. Vac. Sci.
Technol. B 26, 458–480 (2008)
214. X. Cheng, L.J. Guo: A combined-nanoimprint-and-photolithography patterning technique,
Microelectron. Eng. 71, 277–282 (2004)
215. L.J. Guo: Recent progress in nanoimprint technology and its applications, J. Phys. D-Appl.
Phys. 37, R123–R141 (2004)
216. W. Wang, S.A. Soper: Bio-MEMS: Technologies and Applications (CRC Press, Boca Raton,
FL, 2007)
217. Y. Zhang, J. Lu, H. Zhou, T. Itoh, R. Maeda: Application of nanoimprint technology in
MEMS-based micro direct-methanol fuel cell (µ-DMFC), J. Microelectromech. Syst. 17,
1020 (2008)
218. X. Fan, H. Zhang, S. Liu, A. Hu, K. Jia: NIL – A low-cost and high-throughput MEMS
fabrication method compatible with IC manufacturing technology, Microelectron. J. 37, 121
(2006)
219. D.R. Hines: Organic Electronics with Polymer Dielectrics on Plastic Substrates Fabricated
Via Transfer Printing (University of Maryland, College Park, MD, 2007)
220. D.R. Hines, A.E. Southard, A. Tunnell, V. Sangwan, T. Moore, J.-H. Chen, M.S. Fuhrer, E.D.
Williams: Transfer printing as a method for fabricating hybrid devices on flexible substrates,
Proceedings of the SPIE, San Diego, CA (2007)
221. D.R. Hines, S. Mezhenny, M. Breban, E.D. Williams, V.W. Ballarotto, G. Esen, A. Southard,
M.S. Fuhrer: Nanotransfer printing of organic and carbon nanotube thin-film transistors on
plastic substrates, Appl. Phys. Lett. 86, 163101–163103 (2005)
222. D. Janssen, R.D. Palma, S. Verlaak, P. Heremans, W. Dehaen: Static solvent contact angle
measurements, surface free energy and wettability determination of various self-assembled
monolayers on silicon dioxide, Thin Solid Films 515, 1433–1438 (2006)
223. M. Coll, L.H. Miller, L.J. Richter, D.R. Hines, O.D. Jurchescu, N. Gergel-Hackett, C.A.
Richter, C.A. Hacker: Formation of silicon-based molecular electronic structures using
flipchip lamination, J. Am. Chem. Soc. 131, 12451–12457 (2009)
224. K.J. Lee, M.J. Motala, M.A. Meitl, W.R. Childs, R. Menard, A.K. Shim, J.A. Rogers, R.G.
Nuzzo: Large-area, selective transfer of microstructured silicon: A printing-based approach
to high-performance thin-film transistors suorted on flexible substrates, Adv. Mater. 17,
2332–2336 (2005)
225 D.R. Hines, A. Southard, M.S. Fuhrer: Poly(3-hexylthiophene) t hin-film transistors with
variable polymer dielectrics for transfer printed flexible electronics, J. Appl. Phys. 104,
024510 (2008)
226. Photomask Basicsfor Stanford Users: Available http://snf.stanford.edu/Process/Masks/
PhotomaskBasics-General.pdf
227. S. Rizvi: Handbook of Photomask Manufacturing Technology (CRC Press, Boca Raton, FL,
2005)
228. O. Takaoka: Advanced photomask defect repairing technology using FIB and SPM, Int. J.
Autom. Technol. 2 (2008)
229. L. Li, R.R. Gattass, E. Gershgoren, H. Hwang, J.T. Fourkas: Achieving lambda/20 reso-
lution by one-color initiation and deactivation of polymerization, Science 324, 910–913
(2009)
230. C.N. LaFratta, J.T. Fourkas, T. Baldacchini, R.A. Farrer: Multiphoton fabrication, Angew.
Chem. Int. Ed. 46, 6238–6258 (2007)
231. L. Li, J.T. Fourkas: Multiphoton polymerization, Mater. Today 10, 30–37 (2007)
232. L. Li: Multiphoton absorption: Fabrication, functionalization and applications, PhD disser-
tation, University of Maryland, College Park, MD (2009)
9 MEMS Lithography and Micromachining Techniques 753
233. C.N. LaFratta: Multiphoton Absorption Polymerization: Issues and Solutions (University of
Maryland College Park, College Park, MD, 2006)
234. W. Chu, A. Yen, K. Ismail, I. Shepard, H.J. Lezec, C.R. Musil, J. Melngailis, Y.-C. Ku, J.M.
Carter, H.I. Smith: Syb-100-nm x-ray mask technology using focused-ion beam lithography,
J. Vac. Sci. Technol. B: Microelectron. Nanometer Struct. 7, 1583 (1989)
235. M.A. Hartney, D.C. Shaver, M.I. Shephard, J.S. Huh, J. Melngailis: Silyation of focused ion
beam exposed resists, Appl. Phys. Lett. 59, 485 (1991)
236. S. Matsui, Y. Kojima, Y. Ochiai: High-resolution focused ion beam lithography, Appl. Phys.
Lett. 53, 868 (1988)
237. A. Milgram, J. Puretz: A bilevel resist for ion beam lithography, J. Vac. Sci. Technol. B 3,
879 (1985)