Ghodssi R., Lin P., MEMS Materials and Processes Handbook

Подождите немного. Документ загружается.

1034 P. Lin e t al.

33. D. Briggs, M. P. Seah (Eds.): Practical Surface Analysis by Auger and X-ray Photoelectron

Spectroscopy (Wiley, New York, NY, 1983)

34. M.R. Houston, R. Maboudian: Stability of ammonium ﬂuoride-treated Si 100, J. Appl. Phys.

78, 3801–3808 (1995)

35. C.L. Hedberg (Ed.): Handbook of Auger E lectron Spectroscopy (Physical Electronics

Publishing, Eden Prairie, MN, 1995)

36. J.I. Goldstein, D.E. Newbury, P. Echlin, D.C. Joy, C.E. Lyman, E. Lifshin, L.C. Sawyer,

J.R. Michael: Scanning Electron Microscopy and X-Ray Microanalysis (Springer, The

Netherlands, 2003)

37. A.F. Benninghoven, G. Rüdenauer, H.W. Werner: Secondary Ion Mass Spectrometry:

Basic Concepts, Instrumental Aspects, Applications, and Trends (Wiley, New York, NY,

1987)

38. F. Giessibl: Advances in atomic force microscopy, Rev. Mod. Phys. 75, 949–983 (2003)

39. A.W. Adamson, A.P. Gast: Physical Chemistry of Surfaces, 6th edn (Wiley, New York, NY,

1997)

40. J.N. Israelachvili: Intermolecular and Surface Forces (Academic, London, 1985)

41. D. Quere: Wetting and roughness, Annu. Rev. Mater. Res. 38, 71–99 (2008)

42. C.H. Mastrangelo, C.H. Hsu: A simple experimental technique for the measurement of

the work of adhesion of microstructures, Proceedings of the IEEE Solid-State Sensor and

Actuator Workshop – Hilton Head’92, Hilton Head, SC, pp. 208–212 (1992)

43. M.R. Houston, R.T. Howe, R. Maboudian: Effect of hydrogen termination on the work

of adhesion between rough polycrystalline silicon surfaces, J. Appl. Phys. 81, 3474–3483

(1997)

44. M.P. de Boer, T.A. Michalske: Accurate method for determining adhesion of cantilever

beams, J. Appl. Phys. 86, 817–827 (1999)

45. M.P. de Boer, J.A. Knapp, T.A. Michalske, U. Srinivasan, R. Maboudian: Adhesion

hysteresis of silane coated microcantilevers, Acta Mater. 48, 4531–4541 (2000)

46. R. Lechtenberg, H.A.C. Tilmans, J. Elders, M. Elwenspoek: Stiction of surface microma-

chined structures after rinsing and drying: model and investigation of adhesion mechanisms,

Sens. Actuators A 43, 230–238 (1994)

47. W.R. Ashurst, M.P. de B oer, C. Carraro, R. Maboudian: An investigation of sidewall

adhesion in MEMS, Appl. Surf. Sci. 212–213, 735–741 (2003)

48. S.J. Timpe, K. Komvopoulos: An experimental study of sidewall adhesion in microelec-

tromechanical systems, J Microelectromech. Syst. 14, 1356–1363 (2005)

49. S. Majumder, N.E. McGruer, G.G. Adams, P.M. Zavracky, R.H. Morrison, J. Krim: Study of

contacts in an electrostatically actuated microswitch, Sens. Actuators A, 93, 19–26 (2001)

50. M.G. Lim, J.C. Chang, D.P. Schultz, R.T. Howe, R.M. White: Polysilicon Microstructures

to Characterize Static Friction, Proceedings of the IEEE Micro-Electro-Mechanical Systems

Workshop, Napa Valley, CA, pp. 82–88 (1990)

51. D.H. Alsem, M.T. Dugger, E.A. Stach, R.O. Ritchie: Micron-scale friction and sliding wear

of polysilicon silicon thin structural ﬁlms in ambient air, J. Microelectromech. Syst. 17,

1144–1154 (2008)

52. E.E. Flater, A.D. Corwin, M.P. de Boer, R.W. Carpick: In-situ wear studies of surface

micromachined interfaces subject to controlled loading, Wear 260, 580–593 (2006)

53. X.B. Tan, A. Modafe, R. Ghodssi: Measurement and modeling of dynamic rolling friction

in linear microball bearings, J. Dyn. Syst. Meas. Control – Trans. ASME, 128, 891–898

(2006)

54. L.S. Fan, Y.C. Tai, R.S. Muller: Integrated movable micromechanical structures for sensors

and actuators, IEEE Trans. Electron Dev. 35, 724–730 (1988)

55. R.L. Alley, P. Mai, K. Komvopoulos, R.T. Howe: Surface roughness modiﬁcation of interfa-

cial contacts in polysilicon microstructures, Proceedings of the 7th International Conference

on Solid-State Sensors and Actuators – Transducers’93, Yokohama, Japan, pp. 288–291

(1993)

13 Surface Treatment and Planarization 1035

56. Y. Yee, K. Chun, J.D. Lee: Polysilicon Surface Modiﬁcation Technique to Reduce Sticking

of Microstructures, Proceedings of the 8th International Conference on Solid-State Sensors

and Actuators – Transducers’95, Stockholm, Sweden, pp. 206–209 (1995)

57. F.W. DelRio, M.L. Dunn, B.L. Boyce, A.D. Corwin, M.P. de Boer: The effect of nanoparti-

cles on rough surface adhesion, J. Appl. Phys. 99, 104304 (2006)

58. F.W. DelRio, M.L. Dunn, M.P. de Boer: Growth of silicon carbide nanoparticles using

tetraethylorthosilicate for microelectromechanical systems, Electrochem Solid-State Lett.

10, H27–H30 (2007)

59. A. Ulman: An Introduction to Ultrathin Organic Films: From Langmuir-Blodgett to Self-

Assembly (Academic, San Diego, CA, 1991)

60. R. Maboudian, W.R. Ashurst, C. Carraro: Self-assembled monolayers as a nti-stiction coat-

ings for MEMS: characteristics and recent developments, Sens. Actuators A 82, 219–223

(2000)

61. R. Maboudian, W.R. Ashurst, C. Carraro: Tribological challenges in MEMS, Tribol. Lett.

12, 95–100 (2002)

62. X.Y. Zhu, J.E. Houston: Molecular lubricants for silicon-based microelectromechanical

systems (MEMS): A novel assembly strategy, Tribol. Lett. 7, 87–90 (1999)

63. X.Y. Zhu, V. Boiadjiev, J.A. Mulder, R.P. Hsung, R.C. Major: Molecular assemblies on

silicon surfaces via Si-O linkages, Langmuir 16, 6766–6772 (2000)

64. W.R. Ashurst, C. Carraro, R. Maboudian, W. Frey: Wafer level anti-stiction coatings with

superior thermal stability, Sens. Actuators A 104, 213–221 (2003)

65. W.R. Ashurst, C. Carraro, R. Maboudian: Vapor phase anti-stiction coatings for MEMS,

IEEE Trans. Dev. Mater. Reliab. 3, 173–178 (2003)

66. T.M. Mayer, M.P. de Boer, N.D. Shinn, P.J. Clews, T.A. Michalske: Chemical vapor depo-

sition of ﬂuoroalkylsilane monolayer ﬁlms for adhesion control in microelectromechanical

systems, J. Vac. Sci. Technol. B 18, 2433–2440 (2000)

67. Applied MicroStructures Inc. http://www.appliedmst.com/products_mvd150.htm (accessed

in 2009)

68. Memsstar Technology, http://www.memsstar.com/products/ (accessed in 2009)

69. E. Bhattacharya, J. Kuang, M. Judy, J. Martin: Stiction in surface micromachined structures,

Proceedings of the International Workshop Physics of Semiconductor Devices, Delhi, India,

pp. 485–489 (2001)

70. E. Bhattacharya, J. Kuang, M. Judy, J. Martin: A three terminal test structure to measure s tic-

tion force using I–V data, Proceedings of SPIE International Symposia on MEMS, Adelaide,

Australia, pp. 252–256 (2001)

71. W. Huang, Z. Ren, C. Nguyen: Nickel vibrating micromechanical disk resonator with

solid dielectric capacitive-transducer gap, Proceedings of the 2006 International Frequency

Control Symposium and Exposition (IFCS’06), Piscataway, NJ, pp. 839–847 (2006)

72. C. Carraro, L. Magagnin, R. Maboudian: Selective metallization of Si micromechanical

devices, Electrochim. Acta 47, 2583–2588 (2002)

73. J. Salber, S. Gräter, M. Harwardt, M. Hofmann, D. Klee, J. Dujic, J.H. Huang, J.D. Ding,

S. Kippenberger, A. Bernd, J. Groll, J.P. Spatz, M. Möller: Inﬂuence of different ECM

mimetic peptide sequences embedded in a nonfouling environment on the speciﬁc adhesion

of human-skin keratinocytes and ﬁbroblasts on deformable substrates, Small 3, 1023–1031

(2007)

74. J.K. Liu, T. Pan, A.T. Woolley, M.L. Lee: Surface-modiﬁed poly(methyl methacrylate) capil-

lary electrophoresis microchips for protein and peptide analysis, Anal. Chem. 76, 6948–6955

(2004)

75. J. Gao, J. Xu, L.E. Locascio, C.S. Lee: Integrated microﬂuidic system enabling pro-

tein digestion, peptide separation, and protein identiﬁcation, Anal. Chem. 73, 2648–2655

(2001)

76. K.L. Prime, G.M. Whitesides: Self-assembled organic monolayers – model systems for

studying adsorption of proteins at surfaces, Science 252, 1164–1167 (1991)

1036 P. Lin e t al.

77. C.D. Bain, H.A. Biebuyck, G.M. Whitesides: Comparison of self-assembled monolayers on

gold – coadsorption of thiols and disulﬁdes, Langmuir 5, 723–727 (1989)

78. J.M. Buriak: Organometallic chemistry on silicon surfaces: Formation of functional mono-

layers bound through Si-C bonds, Chem. Commun. 1051–1060 (1999)

79. M.J. Moorcroft, W.R.A. Meuleman, S.G. Latham, T.J. Nicholls, R.D. Egeland, E.M.

Southern: In situ oligonucleotide synthesis on poly(dimethylsiloxane): A ﬂexible substrate

for microarray fabrication, Nucleic Acids Res. 33, e75 (2005)

80. D.C. Duffy, J.C. McDonald, O.J.A. Schueller, G.M. Whitesides: Rapid prototyping of

microﬂuidic systems in poly(dimethylsiloxane), Anal. Chem. 70, 4974–4984 (1998)

81. P.T. Charles, G.J. Vora, J.D. Andreadis, A.J. Fortney, C.E. Meador, C.S. Dulcey, D.A.

Stenger: Fabrication and surface characterization of DNA microarrays using amine- and

thiol-terminated oligonucleotide probes, Langmuir 19, 1586–1591 (2003)

82. L. Jin, A. Horgan, R. Levicky: Preparation of end-tethered DNA monolayers on siliceous

surfaces using heterobifunctional cross-linkers, Langmuir 19, 6968–6975 (2003)

83. J.S. Lee, E. Um, J.K. Park, C.B. Park: Microﬂuidic self-assembly of insulin monomers into

amyloid ﬁbrils on a solid surface, Langmuir 24, 7068–7071 (2008)

84. J.W. Li, W.J. Xie, N. Fang, E.S. Yeung: Single-molecule immunosorbent assay as a tool for

human immunodeﬁciency virus-1 antigen detection, Anal. Bioanal. Chem. 394, 489–497

(2009)

85. K.L. Davis, B.J. Drews, H. Yue, D.H. Waldeck, K. Knorr, R.A. Clark: Electron-transfer

kinetics of covalently attached cytochrome c/SAM/Au electrode assemblies, J. Phys. Chem.

C, 112, 6571–6576 (2008)

86. C.-Y. Lee, P.-C.T. Nguyen, D.W. Grainger, L.J. Gamble, D.G. Castner: Structure and DNA

hybridization properties of mixed nucleic acid/maleimide-ethylene glycol monolayers, Anal.

Chem. 79, 4390–4400 (2007)

87. J.A. Neff, P.A. Tresco, K.D. Caldwell: Surface modiﬁcation for controlled studies of cell-

ligand interactions, Biomaterials 20, 2377–2393 (1999)

88. M.J. O’Donnell, K. Tang, H. Koster, C.L. Smith, C.R. Cantor: High density, covalent attach-

ment of DNA to silicon wafers for analysis by MALDI-TOF mass spectrometry, Anal.

Chem. 69, 2438–2443 (1997)

89. T. Bocking, K.A. Killan, K. Gaus, J.J. Gooding: Single-step DNA immobilization on

antifouling self-assembled monolayers covalently bound to silicon (111), Langmuir 22,

3494–3496 (2006)

90. E. Eteshola, D. Leckband: Development and characterization of an ELISA assay in PDMS

microﬂuidic channels, Sens. Actuators B, 72, 129–133 (2001)

91. M.F. Templin, D. Stoll, J.M. Schwenk, O. Potz, S. Kramer, T.O. Joos: Protein microarrays:

Promising tools for proteomic research, Proteomics 3, 2155–2166 (2003)

92. D. Peelen, V. Kodoyianni, J. Lee, T. Zheng, M.R. Shortreed, L.M. Smith: Speciﬁc capture of

mammalian cells by cell surface receptor binding to ligand immobilized on gold thin ﬁlms,

J. Proteome Res. 5, 1580–1585 (2006)

93. H.-Y. Hsieh, P.-C. Wang, C.-L. Wu, C.-W. Huang, C.-C. Chieng, F.-G. Tseng:

Effective enhancement of ﬂuorescence detection efﬁciency in protein microarray a ssays:

Application of a highly ﬂuorinated organosilane as the blocking agent on the back-

ground surface by a facile vapor-phase deposition process, Anal. Chem. 81, 7908–7916

(2009)

94. W.T. Johnson: Attaching antibodies to AFM probes with sulfhydryl reactive PEG tether,

NHS-PEG18-PDP, Agilent Technologies Application Note (2007)

95. A. Ebner, L. Wildling, A.S.M. Kamruzzahan, C. Rankl, J. Wruss, C.D. Hahn, M. Hölzl, R.

Zhu, F. Kienberger, D. Blaas, P. Hinterdorfer, H.J. Gruber: A new, simple method for linking

of antibodies to atomic force microscopy tips, Bioconjug. Chem. 18, 1176–1184 (2007)

96. T.V. Ratto, K.C. Langry, R.E. Rudd, R.L. Balhorn, M.J. Allen, M.W. McElfresh: Force spec-

troscopy of the double-tethered concanavalin-A mannose bond, Biophys. J. 86, 2430–2437

(2004)

13 Surface Treatment and Planarization 1037

97. B.T. Houseman, J .H. Huh, S.J. Kron, M. Mrksich: Peptide chips for the quantitative

evaluation of protein kinase activity, Nat. Biotechnol. 20, 270–274 (2002)

98. O. Akbulut, A.A. Yu, F. Stellacci: Fabrication of biomolecular devices via supramolecular

contact-based approaches, C hem. Soc. Rev. 39, 30–37 (2010)

99. Z.Y. Huang, P.-C. Wang, A.G. MacDiarmid, Y.N. Xia, G.M. Whitesides: Selective deposi-

tion of conducting polymers on hydroxyl-terminated surfaces with printed monolayers of

alkylsiloxanes as templates, Langmuir 13, 6480–6484 (1997)

100. E. Menard, M.A. Meitl, Y.G. Sun, J.U. Park, D.J.L. Shir, Y.S. Nam, S. Jeon, J.A. Rogers:

Micro- and nanopatterning techniques for organic electronic and optoelectronic systems,

Chem. Rev. 107, 1117–1160 (2007)

101. M. Geissler, Y.N. Xia: Patterning: Principles and some new developments, Adv. Mater., 16,

1249–1269 (2004)

102. A.P. Quist, E. Pavlovic, S. Oscarsson: Recent advances in microcontact printing, Anal.

Bioanal. Chem. 381, 591–600 (2005)

103. S.A. Ruiz, C.S. Chen: Microcontact printing: A tool to pattern, Soft Matter 3, 168–177

(2007)

104. P.-C. Wang, R.E. Lakis, A.G. MacDiarmid: Morphology-correlated electrical conduction in

micro-contact-printed polypyrrole thin ﬁlms grown by in situ deposition, Thin Solid Films,

516, 2341–2345 (2008)

105. Y.N. Xia, G.M. Whitesides: Soft lithography, Annu. Rev. Mater. Sci. 28, 153–184

(1998)

106. R.S. Kane, S. Takayama, E. Ostuni, D.E. Ingber, G.M. Whitesides: Patterning proteins and

cells using soft lithography, Biomaterials 20, 2363–2376 (1999)

107. C.S. Chen, M. Mrksich, S. Huang, G.M. Whitesides, D.E. Ingber: Geometric control of cell

life and death, Science 276, 1425–1428 (1997)

108. E. Hecht: Optics, 4th edn (Addison Wesley, San Francisco, CA, 2002)

109. W.J. Smith: Modern Optical Engineering, 4th edn (McGraw-Hill, New York, NY, 2008)

110. P.H. Lissberger: Optical applications of dielectric thin ﬁlms, Rep. Prog. Phys. 33, 197–268

(1970)

111. U. Schulz: Review of modern techniques to generate antireﬂective properties on thermoplas-

tic polymers, Appl. Opt. 45(7), 1608–1618 (2006)

112. Georgia State University, Fresnel’s Equations, http://hyperphysics.phy-astr.gsu.edu/Hbase/

phyopt/freseq.html (accessed in 2009)

113. S.J. Wilson, M.C. Hutley: The optical-properties of moth eye antireﬂection surfaces, Opt.

Acta 29(7), 993–1009 (1982)

114. P.B. Clapham, M.C. Hutley: Reduction of lens reﬂection by moth eye principle, Nature

244(5414), 281–282 (1973)

115. T. Ootsuka, Z. Liu, M. Osamura et al.: Studies on aluminum-doped ZnO ﬁlms for transparent

electrode and antireﬂection coating of [beta]-FeSi

optoelectronic devices, Thin Solid Films

476(1), 30–34 (2005)

116. B. MacLeod, G. Sonek: Motheye surfaces reﬂect little light, Laser Focus World 35(8),

109–113 (1999)

117. D.H. Raguin, G.M. Morris: Antireﬂection structured surfaces for the infrared spectral region,

Appl. Opt. 32(7), 1154–1167 (1993)

118. D.H. Raguin, G.M. Morris: Analysis of antireﬂection-structured surfaces with continuous

one-dimensional surface proﬁles, Appl. Opt. 32(14), 2582–2598 (1993)

119. R.B.M. Schasfoort, A.J. Tudos: Handbook of Surface Plasmon Resonance (RSC Publishing,

Cambridge, 2008)

120. E. Kretschmann: Z. Phys. 241, 313 (1971)

121. Lukas Novotny, Bert Hecht: Principle of Nano-optics (University Press, Cambridge, 2006)

122. B. Liedberg, C. Nylander, I. Lundstrom: Sens. Actuators, 4, 299–304 (1983)

123. N. W. Ashcroft and N.D. Mermin: Solid State Physics (Saunders College Publishing,

Philadelphia, PA, 1976)

1038 P. Lin e t al.

124. H. Raether: Surface Plasmons on Smooth and Rough Surfaces and on Gratings, Springer

Tracts in Modern Physics, vol. 11 (Springer, Berlin, Heidelberg, 1988)

125. K.Y. Hung, J.C. Liao: The application of Fresnel equations and anti-reﬂection technology

to improve inclined exposure interface reﬂection and develop a key component needed for

Blu-ray DVD-micro-mirrors, J. Micromech. Microeng. 18(7), 9 (2008)

126. M. Li, P.S. Chung, M.T. Yeung, P.S. Chan, T.K. Liang, C. Shu, K.W.C. Lai, W.J. Li,

F. Tong, H.K. Tsang: Mirror Coating and Packaging for a Horizontal MEMS Optical Switch

Array, Proceedings of the 54th Electronic Components and Technology Conference, vol. 2,

pp. 1400–1405 (2004)

127. H.A. Macleod: Thin-Film Optical Filters (Hilger, Bristol, UK, 1986)

128. Y. Kanamori, K. Hane: Broadband antireﬂection subwavelength gratings for polymethyl

methacrylate fabricated with molding technique, Opt. Rev. 9(5), 183–185 (2002)

129. R. Bilyalov, L. Stalmans, J. Poortmans: Comparative analysis of chemically and electro-

chemically formed porous Si antireﬂection coating for solar cells, J. Electrochem. Soc.

150(3), G216–G222 (2003)

130. C.L. Tseng, M.J. Youh, G.P. Moore et al.: Mechanism for the increased light transmission

through Ni/Au/ZnO contacts on p-GaN for high power optoelectronic devices, Appl. Phys.

Lett. 83(18), 3677–3679 (2003)

131. K.Y. Hung, H.T. Hu, F.G. Tseng: Application of 3D glycerol-compensated inclined-exposure

technology to an integrated optical pick-up head, J. Micromech. Microeng. 14(7), 975–983

(2004)

132. K.Y. Hung, F.G. Tseng, H.P. Chou: Application of 3D gray mask for the fabrication of curved

SU-8 structures, Microsyst. Technol. 11(4–5), 3 (2005)

133. K.Y. Hung, F.G. Tseng, T.H. Liao: Electrostatic-force-modulated microaspherical lens for

optical pickup head, J. Microelectromech. Syst. 17(2), 370–380 (2008)

134. K.Y. Hung, T.H. Liang: Application of inclined-exposure and thick ﬁlm process for high

aspect-ratio micro-structures on polymer optic devices, Microsyst. Technol. 14(9–11),

1217–1222 (2008)

135. B.C. Chakravarty, J. Tripathi, A.K. Sharma et al.: The growth kinetics and optical conﬁne-

ment studies of porous Si for application in terrestrial Si solar cells as antireﬂection coating,

Sol. Energy Mater. Sol. Cells 91(8), 701–706 (2007)

136. T.L. Chu, S.S. Chu, J. Britt et al.: 14.6% efﬁcient thin-ﬁlm cadmium telluride heterojunction

solar cells, IEEE Electron Dev. Lett. 13(5), 303–304 (1992)

137. Z. Chen, P. Sana, J. Salami et al.: A novel and effective PECVD SiO

/SiN antireﬂection

coating for Si solar cells, IEEE Trans. Electron Dev. 40(6), 1161–1165 (1993)

138. P. Menna, G. Di Francia, V. La Ferrara: Porous silicon in solar cells: A review and a

description of its application as an AR coating, Sol. Energy Mater. Sol. Cells 37(1), 13–24

(1995)

139. A. Krotkus, K. Grigoras, V. Pacebutas et al.: Efﬁciency improvement by porous silicon

coating of multicrystalline solar cells, Sol. Energy Mater. Sol. Cells 45(3), 267–273 (1997)

140. D. Bouhafs, A. Moussi, A. Chikouche et al.: Design and simulation of antireﬂection coating

systems for optoelectronic devices: Application to silicon solar cells, Sol. Energy Mater. Sol.

Cells 52, 79–93 (1998)

141. S.G.F. de, S. Alves Jr, B.J.P. da Silva et al.: A novel ﬂuorinated Eu(III) [beta]-diketone

complex as thin ﬁlm for optical device applications, Opt. Mater. 11(1), 23–28 (1998)

142. R.R. Bilyalov, L. Stalmans, L. Schirone et al.: Use of porous silicon antireﬂection coat-

ing in multicrystalline silicon solar cell processing, IEEE Trans. Electron Devices 46(10),

2035–2040 (1999)

143. R.R. Bilyalov, R. Ludemann, W. Wettling et al.: Multicrystalline silicon solar cells with

porous silicon e mitter, Sol. Energy Mater. Sol. Cells 60, 391–420 (2000)

144. B.S. Richards: Single-material TiO

double-layer antireﬂection coatings, Sol. Energy Mater.

Sol. Cells 79, 369–390 (2003)

145. U. Gangopadhyay, K. Kim, D. Mangalaraj et al.: Low cost CBD ZnS antireﬂection coating

on large area commercial mono-crystalline silicon solar cells, Appl. Surf. Sci. 230(1–4),

364–370 (2004)

13 Surface Treatment and Planarization 1039

146. J. Lee: Comparison of CdS ﬁlms deposited by different techniques: Effects on CdTe solar

cell, Appl. Surf. Sci. 252(5), 1398–1403 (2005)

147. G. Crotty, T. Daud, R. Kachare: Front surface passivation of silicon solar cells with

antireﬂection coating, J. Appl. Phys. 61(8), 3077–3079 (1987)

148. U. Schulz, K. Lau, N. Kaiser: Antireﬂection coating with UV-protective properties for

polycarbonate, Appl. Opt. 47(13), C83–C87 (2007)

149. M.H. Lee, J.S. Cho: Better thermochromic glazing of windows with anti-reﬂection coating,

Thin Solid Films 365(1), 5–6 (2000)

150. R.R. Phillips, V. Haynes, D.A. Naylor et al.: Simple method for antireﬂection coating ZnSe

in the 20 μm wavelength range, Appl. Opt. 47(7), 870–873 (2008)

151. U. Schulz: Review of modern techniques to generate antireﬂective properties on thermoplas-

tic polymers, Appl. Opt. 45(7), 1608–1618 (2006)

152. A. Gombert, W. Glaubitt, K. Rose et al.: Subwavelength-structured antireﬂective surfaces on

glass, Thin Solid Films 351, 73–78 (1999)

153. A. Kaless, U. Schulz, P. Munzert et al.: NANO-motheye antireﬂection pattern by plasma

treatment of polymers, Surf. Coat. Technol., 200(1–4), 58–61 (2005)

154. T. Sawitowski, N. Beyer, F. Schulz: Bio-inspired anti-reﬂective surfaces by imprinting

processes, in The Nano-Micro Interfaces, pp. 263–280 (H.-J.Fecht, M. Werner (Eds.)

Wiley-VCH, Weinheim, 2004)

155. M.-H. Chen, Y.-J. Chuang, F.-G. Tseng: Fabrication of superhydrophobic surface by

nanomolding, In Proceedings of μTAS conference, Tokyo, Japan, pp. 161–163 (2006)

156. F. Brumeister, W. Doell, G. Kleer: Method for producing a tool which can be used to create

structures in the sub-micrometer range, EP1307604B1, E. Patent (1998)

157. M.S. Park, Y. Lee, J.K. Kim: One-step preparation of antireﬂection ﬁlm by spin-coating of

polymer/solvent/nonsolvent ternary system, Chem. Mater. 17(15), 3944–3950 (2005)

158. S. Walheim, E. Schaffer, J. Mlynek et al.: Nanophase-separated polymer ﬁlms as high-

performance antireﬂection coatings, Science 283(5401), 520–522 (1999)

159. J. Hiller, J.D. Mendelsohn, M.F. Rubner: Reversibly erasable nanoporous anti-reﬂection

coatings from polyelectrolyte multilayers, Nat. Mater. 1(1), 59–63 (2002)

160. M. Ibn-Elhaj, M. Schadt: Optical polymer thin ﬁlms with isotropic and anisotropic nano-

corrugated surface topologies, Nature 410(6830), 796–799 (2001)

161. H.Y. Koo, D.K. Yi, S.J. Yoo et al.: A snowman-like array of colloidal dimers for antireﬂect-

ing surfaces, Adv. Mater. 16(3), 274 (2004)

162. M.H. Chen, Y.J. Chuang, F.G. Tseng: Self-masked high-aspect-ratio polymer nanopillars,

Nanotechnology 19(50), 7 (2008)

163. M.W. Lin, B. Chao, J. Hao et al.: Simulation and design of planarizing materials for reverse-

tone step and ﬂash imprint lithography, J. Micro/Nanolithography, MEMS MOEMS 7(2),

023008-19 (2008)

164. N. Liu, H. Guo, L. Fu et al.: Three-dimensional photonic metamaterials at optical frequen-

cies, Nat. Mater. 7(1), 31–37 (2008)

165. G. Subramania, S.Y. Lin: Fabrication of three-dimensional photonic crystal with alignment

based on electron beam lithography, Appl. Phys. Lett. 85(21), 5037–5039 (2004)

166. Y.S. Yoon, K.D. Bae, J.H. Kim et al.: A low voltage actuated micromirror with an extra

vertical electrode for 90

◦

rotation, J. Micromech. Microeng. 13(6), 922–926 (2003)

167. C.J. Chen, K.K. Choi, W.H. Chang et al.: Corrugated quantum well infrared photodetec-

tors with polyimide planarization for detector array applications, IEEE Trans. Electron Dev.

45(7), 1431–1437 (1998)

168. M.H. Schuck, D.J. McKnight, K.M. Johnson: Spin-cast planarization of liquid-crystal-on-

silicon microdisplays, Opt. Lett. 22(19), 1512–1514 (1997)

169. E. Breval, M.L. Mulvihill, J.P. Dougherty et al.: Polyimide-silica microcomposite ﬁlms,

J. Mater. Sci. 27, 3297–3300 (1992)

170. V.J. Logeeswaran, M.L. Chan, Y. Bayam et al.: Ultra-smooth metal surfaces generated by

pressure-induced surface deformation of thin metal ﬁlms, Appl. Phys. A: Mater. Sci. Process.

87(2), 187–192 (2007)

1040 P. Lin e t al.

171. M.-C.M. Lee, M.C. Wu: Thermal annealing in hydrogen for 3-D proﬁle transformation

on silicon-on-insulator and sidewall roughness reduction, J. Microelectromech. Syst. 15(2),

338–343 (2006)

172. R.R.A. Syms, A.S. Holmes: Reﬂow and burial of channel waveguides formed i n sol-gel glass

on Si substrates, IEEE Photon. Technol. Lett. 5(9), 1077–1079 (1993)

173. P.B. Mirkarimi, E. Spiller, S.L. Baker et al.: Developing a viable multilayer coating pro-

cess for extreme ultraviolet lithography reticles, J. Microlithography, Microfabrication,

Microsyst. 3(1), 139–145 (2004)

174. F. Frost, R. Fechner, D. Flamm et al.: Ion beam assisted smoothing of optical surfaces, Appl.

Phys. A: Mater. Sci. Process. 78(5), 651–654 (2004)

175. C. Vivensang, L. Ferlazzo-Manin, M.F. Ravet et al.: Surface smoothing of diamond

membranes by reactive ion etching process, Diam. Relat. Mater. 5(6–8), 840–844 (1996)

176. S. Ilias, G. Sen, P. Moller et al.: Planarization of diamond thin ﬁlm surfaces by ion beam

etching at grazing incidence angle, Diam. R elat. Mater. 5(6–8), 835–839 (1996)

177. U. Schulz, N. Kaiser: Vacuum coating of plastic optics, Progr. Surf. Sci. 81(8–9), 387–401

(2006)

178. K. Minami: Optical plastics, in Hanbook of Plastic Optics, pp. 109–147 (S. Baumer (Ed.)

Wiley-VCH, Frankfurt, 2005)

179. H. Chatham: Oxygen diffusion barrier properties of transparent oxide coatings on polymeric

substrates, Surf. Coat. Technol. 78(1–3), 1–9 (1996)

180. F. Samson: Ophthalmic lens coatings, Surf. Coat. Technol. 81(1), 79–86 (1996)

181. S. Pongratz, A. Zoller: Plasma ion-assisted evaporative deposition of surface-layers, Annu.

Rev. Mater. Sci. 22, 279–295 (1992)

182. S.A. Mohan, M.A. Ghanashyam Krishna: A review of ion beam assisted deposition of optical

thin ﬁlms, Vacuum 46(7), 645–659 (1995)

183. P. Munzert, U. Schulz, N. Kaiser: Transparent thermoplastic polymers in plasma-assisted

coating processes, Surf. Coat. Technol. 174–175, 1048–1052 (2003)

184. M. Kuhr, S. Bauer, U. Rothhaar et al.: Coatings on plastics with the PICVD technology, Thin

Solid Films 442, 107–116 (2003)

185. G. Dennler, A. Houdayer, M. Latreche et al.: Studies of the earliest stages of plasma-

enhanced chemical vapor deposition of SiO

on polymeric substrates, Thin Solid Films

382(1–2), 1–3 (2001)

186. A. Hofrichter, A. Constantinescu, S. Benayoun et al.: Study of the mechanical behav-

ior of plasma-deposited silica ﬁlms on polycarbonate and steel, J. Vac. Sci. Technol. 18,

2012–2016 (2000)

187. D. Poitras, L. Martinu: Interphase in plasma-deposited ﬁlms on plastics: Effect on the

spectral properties of optical ﬁlters, Appl. Opt. 39(7), 1168–1173 (2000)

188. R. Kukla, D. Hofmann, G. Ickes et al.: Sputter metallization of plastic parts in a just-in-time

coater, Surf. Coat. Technol. 74–75(1–3), 648–653 (1995)

189. H. Grunwald, R. Adam, J. Bartella et al.: Better aluminum mirrors by integrating plasma

pretreatment, sputtering, and plasma polymerization for large-scale car headlight production,

Surf. Coat. Technol. 111(2–3), 287–296 (1999)

190. C.-L. Wu, M.-H. Chen, F.-G. Tseng: SU-8 hydrophilic modiﬁcation by forming copoly-

mer with hydrophilic epoxy molecule, In Proceedings of μTAS, Squaw Valley, CA,

pp. 1117–1120 (2003)

191. H.S. Khoo, F.-G. Tseng: Morphological controlled growth of three-dimensional self-

assembled methylsiloxane ﬁlms: Their impact on hydrophobic behaviors, Nanotechnology

19, 345603–345612 (2008)

192. F. Garbassi, M. Morra, E. Occhiello: Polymer Surfaces (Wiley-VCH, Weinheim, 1998)

193. F.-G. Tseng, K.-H. Lin, H.-T. Hsu et al.: A surface-tension-driven ﬂuidic network for precise

enzyme batch-dispensing and glucose detection, Sens. Actuators A 111, 107–117 (2004)

194. C.E. Ho, F.G. Tseng, S.C. Lin et al.: Characterization of the surface tension and viscosity

effects on the formation of nano-liter droplet arrays by an instant protein micro stamper,

J. Micromech. Microeng. 15, 2317–2325 (2005)

13 Surface Treatment and Planarization 1041

195. C.-E. Ho, C.-C. Chieng, M.-H. Chen et al.: Rapid micro array system for passive batch-

ﬁlling and in-parallel-printing protein solutions, J. Microelectromech. Syst. 17(2), 309–317

(2008)

196. U. Schulz: Coating on Plastics, in Handbook of Plastic Optics, pp. 149–180 (S. Baumer

(Ed.) Wiley-VCH, Frankfurt, 2005)

197. O. Chiantore, L. Trossarelli, M. Lazzari: Photooxidative degradation of acrylic and

methacrylic polymers, Polymer 41(5), 1657–1668 (2000)

198. G. Schottner, K. Rose, U. Posset: Scratch and abrasion resistant coatings on plastic lenses –

State of the art, current developments and perspectives, J. Sol-Gel Sci. Technol. 27(1), 71–79

(2003)

199. Y.-T. Tseng, C.-S. Yang, Y.-C. Wu, M.-C. Wang, F.-G. Tseng: Gold-nanoparticle enhanced

in-situ immunosensor based on ﬁber-optical fabry-perot interferometry, Nanotechnology 19,

345501–345510 (2008)

200. Yuan-Tai Tseng, Chung-Shi Yang, Fan-Gang Tseng: A perfusion-based micro opto-ﬂuidic

system (PMOFS) for continuously in-situ immune sensing, Lab Chip 9, 2673–2682 (2009)

201. Y.J. Chuang, F.G. Tseng, J.H. Cheng et al.: A novel fabrication method of SU-8 stacked

micro channels by UV dosage control, Sens. Actuators A 103, 64–69 (2003)

202. S.H. Huang, W.H. Tan, F.G. Tseng et al.: A monolithically three-dimensional ﬂow-focusing

device for formation of single/double emulsions in closed/open microﬂuidic systems,

J. Micromech. Microeng. 16(11), 2336–2344 (2006)

203. L. Holland: The Properties of Glass Surfaces (Chapman & Hall, London, 1964)

204. T. Izumitani: Treatise on Materials Science and Technology (Academic, New York, NY,

1979)

205. L.M. Cook: Chemical processes in glass polishing, J. Non-Cryst. Solids 120, 152–171

(1990)

206. H. Dunken: Surface chemistry of optical glasses, J. Non-Cryst. Solids 129, 64–75 (1991)

207. T. Hoshino, Y. Kurata, Y. Terasaki et al: Mechanism of polishing of SiO

ﬁlms by CeO

particles, J. Non-Cryst. Solids 283, 129–136 (2001)

208. J.M. Steigerwald, S.P. Murarka, R.J. Gutmann: Chemical Mechanical Planarization of

Microelectronic Materials (Wiley, New York, NY, 1997)

209. T. Du, D. Tamboli, V. Desai et al.: Mechanism of copper removal during CMP in acidic

H2O2 slurry, J. Electrochem. Soc. 151, G230–G235 (2004)

210. D.H. Eom, I.K. Kim, J.H. Han et al.: The effect of hydrogen peroxide in a citric acid based

copper slurry on Cu polishing, J. Electrochem. Soc. 154, 38–44 (2007)

211. A. Ishikawa, H. Matsuo, T. Kikkawab: Inﬂuence of slurry chemistry on frictional

force in copper chemical mechanical polishing, J. Electrochem. Soc. 152, G695–G697

(2005)

212. K. Ludema: Friction, Wear and lubrication: A Textbook in Tribology (CRC Press, New York,

NY, 1996)

213. B. Bhushan: Introduction to Tribology (Wiley, New York, NY, 2002)

214. F. Preston: The t heory and design of plate glass polishing machines, J. Soc. Glass Technol.

11, 214 (1927)

215. J.J. Brown, P.C. Baker, R.T. Maney: Optical polishing of metals, Proc. SPIE 306, 42–57

(1981)

216. O. Seunghee, S. Jongwon: An integrated material removal model for silicon dioxide layers

in chemicalmechanical polishing processes, Wear 266, 839–849 (2009)

217. J.S. David, L.H. Dale, L.C. Joseph: Investigation of the kinetics of tungsten chemical

mechanical polishing in potassium iodate-based slurries I. Role of alumina and potassium

iodate, J. Electrochem. Soc. 146, 376–381 (1999)

218. Q. Luo, S. Ramarajan, S.V. Babu: Modiﬁcation of the Preston equation for the chemical-

mechanical polishing of copper, Thin Solid Films 335, 160–167 (1998)

219. R. Stribeck: Characteristics of plain and roller bearing, Zeit Ver Deut Ing 46, 1341–1348

(1902)

1042 P. Lin e t al.

220. Z. Li, K. Ina, P. Lefevre et al.: Determining the effects of slurry surfactant, abrasive size,

and abrasive content on the tribology and kinetics of copper CMP, J. Electrochem. Soc. 152,

G299–G304 (2005)

221. Y.C. Wang, T. Shiang: Effects of pad grooves on chemical mechanical planarization,

J. Electrochem. Soc. 154, H486–H494 (2007)

222. A. Philipossian, S. Olsen: Fundamental tribological and removal rate studies of interlayer

dielectric chemical mechanical planarization, Jpn J. Appl. Phys. 42, 6371–6379 (2003)

223. M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials (Springer,

New York, NY, 2004)

224. S. Sivaram, K. Monnig, R. Tolles et al.: Overview of planarization by mechanical polishing

of interlevel dielectrics. Proceedings of the 3rd International Symposium on ULSI Science

and Technology, Pennington, NJ, The Eletrochemical Society Inc., pp. 606–616 (1991)

225. M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials, pp. 285–349

(Springer, New York, NY, 2004)

226. Peter Wolters, Internet web site, http://www.peter-wolters.com/cmp/cmpmultilevel.htm

(accessed in 2009)

227. J.Q. Lu, G. Rajagopalan, M. Gupta, T.S. Cale, R.J. Gutmann: Planarization issues in wafer-

level three-dimensional (3D) integration, MRS Symposium Proceedings, 816, pp. 217–228

(2004)

228. Y.Z. Li: Microelectronic Applications of Chemical–Mechanical Planarization (Wiley, NJ,

2007)

229. S. Armini, C.M. Whelan, M. Moinpour et al.: Copper CMP with composite polymer core–

silica shell abrasives: A defectivity study, J. Electrochem. Soc. 156, H18–H26 (2009)

230. M. Masayuki, K. Nobuo: Method of Chemical Mechanical Polishing, USA, JSR

Corporation, US007153369B2 (2006)

231. J.M. Steigerwald, R. Zirpoli, S.P. Murarka et al.: Pattern geometry effects in the chemical-

mechanical polishing of inlaid copper structures, J. Electrochem. Soc. 141, 2842–2848

(1994)

232. P. Holzapfel, K. Murella, J. Schlueter et al.: VMIC Conference, IMIC, Tampa, p. 307

(1997)

233. M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials, pp. 373–386

(Springer, New York, NY, 2004)

234. C. Oji, B. Lee, D. Ouma et al.: Wafer scale variation of planarization length in chemical

mechanical polishing, J. Electrochem. Soc. 147, 4307–4312 (2000)

235. C.H. Yao, D.L. Feke, K.M. Robinson et al.: Modeling of chemical mechanical polishing

processes using a discretized geometry approach, J. Electrochem. Soc. 147, 1502–1512

(2000)

236. C.H. Yao, D.L. Feke, K.M. Robinson et al.: The inﬂuence of feature-scale surface geometry

on CMP processes, J. Electrochem. Soc. 147, 3094–3099 (2000)

237. R.R. Divecha., B.E. Stine, D.O. Ouma et al.: A novel statistical metrology framework for

identifying sources of variation in oxide chemical-mechanical polishing, J. Electrochem.

Soc. 145, 1052–1059 (1998)

238. A.E. Braun: Copper metrology, gain complexity, capabilities, Semicond. Int. 24, 56–58, 60,

64, & 70 (2001)

239. J.F. Simon, G. Santos, H.L. Guo et al.: Optimization of the chemical mechanical polishing

process for premetal dielectrics, J. Electrochem. Soc. 147, 682–286 (2000)

240. R.L. Rhoades: Rapid low-cost development of a planarized 3-level interconnect module,

Proceeding 9th International CMP-MIC, Los Angeles, CA (Feb. 2004)

241. M.R. Oliver: Chemical-Mechanical Planarization of Semiconductor Materials, pp. 404–407

(Springer, New York, NY, 2004)

242. B. Ziaie, A. Baldi, M. Lei et al.: Hardand soft micromachining for BioMEMS: Review of

techniques and examples of applications in microﬂuidics and drug delivery, Adv. Drug Deliv.

Rev. 56, 145–172 (2004)

13 Surface Treatment and Planarization 1043

243. B.H. Veigl, R.L. Bardell, C.R. Cabrera: Lab-on-a-chip for drug development, Adv. Drug

Deliv. Rev. 55, 349–377 (2003)

244. R.K. Singh, F.C. Chang, S. Tanawade, G. Scheiffele: Effect of pump induced particle

agglomeration on CMP of ultra low k dielectrics, Levitronix CMP Users Conference (2006)

http://www.levitronix.com/Levitronix_Conference_Papers.html

245. J.D. Larios, J. Zhang, E. Zhao et al.: Evaluating chemical mechanical cleaning technology

for post CMP applications, Micro 5, 61 (1997)

246. N. Junji, K. Nobuhiro, Y. Youhei: Inﬂuence of post-CMP cleaning on Cu interconnects and

TDDB reliability, IEEE Trans. Electron Dev. 52, 934–941 (2005)

247. A. Hu, X. Zhang, E. Sachs, P. Penteln: Application of Run by Run Controller to

the Chemical-Mechanical Planarization Process, Part I, IEEE Proceeding of the 15th

International Electronics Manufacturing Technology Symposium, pp. 235–240 (1993)

248. J. Luo, D.A. Dornfeld: Effects of abrasive size distribution in chemical mechanical

planarization: Modeling and veriﬁcation, IEEE Trans. Semicond. Manuf. 16, 469–476

(2003)

249. Y.K. Hong, D.H. Eom, S.H. Lee et al.: The effect of additives in post-Cu CMP cleaning on

particle adhesion and removal, J. Electrochem. Soc. 151, G756–G761 (2004)

250. M.A. Michalicek, J.H. Comtois, C.C. Barren: Design and Characterization of Next-

Generation Micromirrors Fabricated in a Four-Level, Planarized Surface-Micromachined

Polycrystalline Silicon Process, Proceedings of 2nd Annual IEEE International Conference

on Innovative Systems in Silicon, pp. 144–154 (Austin, TX, USA, 1997)

251. J.J. Sniegowski, M.S. Rodgers: Multi-Layer Enhancement to Polysilicon Surface-

Micromachining Technology, International Electron Devices Meeting (IEDM), Technical

Digest, vol. 8, pp. 903–906 (Washington, DC , USA, 1997)

252. H. Lin, A.J. Walton, C.C. Dunare et al.: Test Structures for the Characterization of MEMS

and CMOS Integration Technology, IEEE Transactions on Semiconductor Manufacturing

21, pp. 140–147 (2008)

253. V. Bhatt, S. Chandra: Planar Microstructures in Surface Micromachining Process Using

RF Sputtered ZnO as Sacriﬁcial Layer, Optoelectronic and Microelectronic Materials and

Devices Conference, pp. 129–132 (Perth, Australia, 2006)

254. S. Zairi, G.Y. Tian: Design of Buried Hinge Based 3D Torsional Micro Mirrors, Proceedings

of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging

and Component Failure Analysis, pp. 164–170 (Shanghai, China, 2004)

255. A.A. Yasseen, C. Wu, C.A. Zorman, M. Mehregany: Fabrication and testing of surface

micromachined silicon carbide micromotors, J. Microelectromech. Syst. 644–649 (1999)

256. A.A. Yasseen, C. Wu, C.A. Zorman et al.: A design methodology for a bulk-micromachined

two-dimensional electrostatic torsion micromirror, J. Microelectromech. Syst. 12, 692–701

(2003)

257. U. Krishnamoorthy, L. Daesung, O. Solgaard: Self-aligned vertical electrostatic combdrives

for micromirror actuation, J. Microelectromech. Syst. 12, 458–464 (2003)

258. Q. Ramadan, V.D. Samper, D.P. Puiu et al.: Fabrication of three-dimensional mag-

netic microdevices with embedded microcoils for magnetic potential concentration,

J. Microelectromech. Syst. 15, 624–638 (2006)

259. S. Merzaghi, P. Meyer, Y. Perriard: Development of Planar Microcoils for an

Electromagnetic Linear Actuator Fabricated in Batch-Type Wafer Technology, pp. 1–6

(IEEE, Edmonton, Canada, 2008)

260. Y. Li, K. Baek, M. Gulari et al.: A Drug-Delivery Probe with an In-Line Flowmeter Based

on Trench Reﬁll and Chemical Mechanical Polishing Techniques, IEEE Sensors Conference,

pp. 1144–1147 (Atlanta, GA, 2007)

261. J. Chen, K.D. Wise, J.F. Hetke et al.: A multichannel neural probe for selective chemical

delivery at the cellular level, IEEE Trans. Biomed. Eng. 44, 760–769 (1997)

262. P.R. Dandu Veera, A. Natarajan, S. Hegde et al.: Selective polishing of polysilicon dur-

ing fabrication of microelectromechanical systems devices, J. Electrochem. Soc. 156,

H487–H494 (2009)