Jackson M.J. Micro and Nanomanufacturing

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694 Subject Index

IBE, see Ion beam etching

(IBE)

IBM, see International Busi-

ness Machines (IBM)

IC chip manufacturing, 255-

315

lEDF,

see Ion energy distribu-

tion function (lEDF)

Implementation, nanometric

machining, 612

Infrastructure, commercializa-

tion issues, 672-687

Inhibitor depletion, trenches,

98-111

Inhomogeneous strain, 178

Initial chip curl modeling, 195

Injection compression mold-

ing, 119

Injection molding, 119

Ink-jet printers,

1-30,255-308

Inlets,

mechanical micro-

machining, 222

Inspection systems, nanomet-

ric machining, 612-628

Institut fur Mikrostrukturtech-

nik (FZK) Karlsruhe and

Antwenderzentrum

BESSY, 53-96

Internal grinding operations,

255-283

International Business Machines

(IBM),

1-50

International Institute for Pro-

duction Engineering Re-

search (CIRP), 255

International Mezzo, LIGA ser-

vices,

55-91

Ion angular distribution function

(lADF), 103, 111

Ion beam-assisted radical etching

(IBARE),99, 111

Ion beam etching (IBE), 99, 112

Ion energy distribution function

(lEDF), 103, 111

Ions,

high-aspect ratio micro-

structures, 105, 109-112

Jabro Tools, 616

Jackson and Mills' model, 551

lander's models, 550-555

Jig grinding, 280-299

Kapton preabsorber filters, 85-89

Kececioglu's model, 164

Knudsen number, 106

Krause and Keetman's model,

552

Labcard, 1-35

Lab-on-a-chip, 20-28

Large Optics Diamond Turn-

ing Machines (LODTM), 627-

629

Large plastic flow, 154-168

Laser-based micro- and nano-

fabrication 387-473

Laser dressing, nanogrinding

tools,

569-570

Lateral jetting, 480

LEED, see Low-energy elec-

tron diffraction (LEED) study

LIGA process, 55

Subject Index 695

Limitations, micromolding,

131

LISA, 648-671

Lithographically induced

self-

assembly, 648-671

Lithographic method, 1-45,

55-58,

636

Lithographic processes, see

also X-ray lithographic micro-

fabrication

Loaded nanogrinding grains,

524-528

LODTM, see Large Optics

Diamond Turning Machine

(LODTM)

Machining, see also High-

aspect ratio microstruc-

tures

Machining thresholds, modeling,

482

Machining thresholds velocity

(MTV), 482-519

Magnesium fluoride, 494-495

MANCEF, see Micro and

Nanotechnology Commer-

cialisation Educational

Foundation (MANCEF)

Manipulative techniques, nano-

fabrication, 23-47

Manufacturing centers, commer-

cialization issues, 687

Marangoni forces, 387-403

Markets, commercialization is-

sues,

673

Masks, materials, 55-95

Master micromold fabrication,

93-94

MD,

see Molecular dynamics

(MD) simulation

Mechanical micromachining,

191-252

Mechanical structure, nanometric

machining, 592

MEMO, see Methacryloxypropyl

trimethoxy silane (MEMO)

Me-Scope software, 504

Meso machine tools (mMTs)

220-221

Metal cutting chip formation,

143-188,195-207,662-671

Metallic (Mo) wires, 356

Metastable diamond growth,

330,350

Methacryloxypropyl trimethoxy

silane (MEMO), 55-94

Metrology, nanometric machin-

ing, 591-632

Micro- and nanogrinding, see

also Diamond nanogrinding

Micro and Nanotechnology

Commericialisation Educa-

tional Foundation

(MANCEF), 672

Microcrystalline diamond

(MCD) films, 323-340

Microdrills, 3357-362, 366

Microfabrication, see also Laser-

based micro- and nanofabri-

cation

Microfabrication,

x-ray

lithogra-

phy, 55

Microfluidic devices, 191

Microfluidic systems, 192

Micrograss, 119

Micromachining, see also Pulsed

water drop micromachining,

475

Micromachining, mechanical,

191

696 Subject Index

Micromachining, size effect,

143-144

Micromanufacturing, 635

Micromilling, 191-250, 323-

382

Micromolding, 120

Micromolding in capillaries

(MIMIC), 649

Micro-nanotechnology

(MNT), see also Commercializa-

tion issues

Microwave plasma CVD

(MPCVD), 332

MIMIC, see Micromolding in

capillaries.

Minimum undeformed chip

thickness, 192,255,591

Modeling, see also Simulation

Mode shapes, tetrahedral

structures, 504

Modified hot filament CVD,

317

Mounted wheels, 275

MPCVD, see Microwave

plasma CVD (MPCVD)

MTV, see Machining thresh-

old velocity (MTV)

Multiple spin coats, resist ap-

plication, 83-85

Multi-wall carbon nanotubes

(MWCNTs), 30-40

Nanofabrication, see also La-

ser-based micro- and nanofabri-

cation

Nanogrinding, see also Dia-

mond nanogrinding; Mi-

cro-

and nanogrinding

Nanogrinding wheels, 521

Nanoimprint lithography, 1-46

Nanomanufacturing, 648

Nanometric machining 647

Nanometrology, 613

Nd:YAG lasers, 387

Nonaxisymmetric aspheric mir-

rors,

255

Non-mechanical nanometric ma-

chining, 591

North West Development

Agency, 672

Nucleation, 345

Numerical control (NC) jig

grinding, 273-288

Optics, laser-based micro- and

nanofabrication, 387-388

Optimal wavelength, 388-402

Oxychloride, 255-260

Nano-

and microgrinding, see

also Diamond nanogrinding

Nanocrystalline diamond,

297-352

Nanocrystalline diamond

(NCD) films, 323-382

Packaging, commercialization is-

sues,

672

Paraboloids, 255-298

Partial ductile mode grinding,

255-298

PAS,

see Polyalkensulfone

(PAS)

Subject Index 697

PDMS,

see Polydimethylsilox-

ane (PDMS)

Pentium 4 microprocessor, 1-50

Picosecond pulse microfabrica-

tion, 387-473

Piezoelectric nanogrinding, 522

PLG, see Poly(lactide-

coglycolide) (PLG)

PMI, see Polymethacrylimide

(PMI)

PMMA, see Polymethyl-

methacrylate (PMMA)

Pohshing time reduction, 255-

299

Polyalkensulfone (PAS), 62-83

Polyamide (PA), 64-80

Polydimethylsiloxane (PDMS),

3-45,

62-83,

648-685

Poly(lactide-coglycohde) (PLG),

62-83

Polymethacryhmide (PMI), 63-

Polymethylmethacrylate

(PMMA), 62-82

Polyoxymethylene (POM), 61-82

Polysulfone (PSU), 66-87

Polytetrafluoroethylene (PTFE),

61-82

POM, see Polyoxymethylene

(POM)

Porous nanogrinding tools, 545

Practical nanometric machining,

611-633

Precision grinding processes,

277

Precision micro- and nanogrind-

ing, see Micro- and

nanogrinding

Procedures, diamond nanogrind-

ing, 521-588

Product manufacture, 675

Product-market interface, 673

Product-Technology Roadmap

(NEXUS), 672-674

Properties, diamond, 325

PSU, see Polysulfone (PSU),

61-82

PTFE, see Polytetrafluoro-

ethylene (PTFE), 61-82

Pulsed liquid impact theory,

475

Pulsed water drop micro-

machining, 475-485

Pyrex glass, 255-270

Q-switched

lasers, 387

Quality, optical, 390

Quantum corrals, 1-45

Quartz, 255-308, 521-536

Quasi-static stress intensity,

482

Rayleigh surface waves, see

Pulsed water drop micromachin-

ing

Reaction injection molding,

121-128

Reactive ion etching (RIE),

see also Deep reactive ion etch-

ing (DRIE)

Refractory bonding systems,

549-563

Resinoid-bonded wheels, 255-

258

Resinoid materials, 256-257

Resists, 72-82

698 Subject Index

RF plasma-enhanced CVD,

332

RIE, see Reactive ion etching

(RIE)

Robonano, 591

Rubber, 255

Synthesis, diamond, 331

SAEsteel, 144-149, 154-173

SAMIM, 635

SAMs, see Self-assembled

molecules (SAMs)

Scanning tunneling micros-

copy, 1-50

Self-assembled molecules

(SAMs), 1-45

Semiconductor manufacturing,

1-45,648-685

Shellac, 255

Shielding gas, 387-472

"The Significant Structure

Theory," 144-159

Silicate, 265-260

Silicon, pulsed water drop mi-

cromachining, 493-495

Silicon carbide, 255-260

SRS,

see Synchrontron radia-

tion sources (SRS)

Standardization, commerciali-

zation issues, 672-682

Stepped microstructures, 55

Stimulated emission, 387

STM, see Scanning tunneling

microscopy (STM)

Structure, grinding wheels,

255

Synchrontron radiation, 58

Synchrontron radiation

sources (SRS), 58-63

TADTOP, 117

Testing, commercialization is-

sues,

672

Tetra Form C ultraprecision

grinding machine, 591

Tetrahedral desktop machine

tool, 300

Tetrahedral structures, 499-

507

Three-axis ultraprecision

grinding machines, 300

Three-axis ultraprecision mill-

ing machine (UPM 3), 593

Three-dimensional substrates,

336

Threshold curves, 482-493

Tilting, 112

Time-modulated CVD

(TMCVD), 372-381

Tip angles, 233-245

Ti:

sapphire lasers, 404-414

TMCVD, see Time-modulated

CVD (TMCVD)

Tools,

323

Top down manufacturing,

635-684

Topography mode, nanofabri-

cation, 5-31

Trenches, 98-111

Ultraprecision grinding, 299,

521-589

Subject Index 699

Ultraprecision machine tools, Z

221,307,499-516,611-630

Ultrashort picosecond pulses, .,. . ^ . ., . .

ACii.

Af.i Zhang and Bagchi s model,

Vitrified materials, 545-567

Voice coil-actuated mMTs,

221

Volume transport, 106

Water drop impact, 480

Water drop micromachining,

see Pulsed water drop micro-

machining

WC-Co, 323-341

Workpiece material proper-

ties,

143-179

X-ray diffraction, 520-534

X-ray lithographic microfabri-

cation, 57-69

X-ray lithography, 57

X-ray masks, 69-94

Young's modulus, 69, 480

I Dr. Mark J. Jackson

Professor of Mechanical Engineering

College of Technology

Purdue University

Eng., Engineering Council of London, U.K., 1998

M. A. Status, Natural Sciences, University of Cambridge, U.K., 1998

Ph.

D., Mechanical Engineering, Liverpool, U.K., 1995

M. Eng., Mechanical & Manufacturing Engineering, Liverpool, U.K.,

1991

O.N.D., Mechanical Engineering, Halton College, U.K., 1986

O.N.C. Part I, Mechanical Engineering, Halton College, U.K., 1984

Doctor Jackson began his engineering career in 1983 when he studied for

his O.N.C. part I examinations and his first-year apprenticeship-training

course in mechanical engineering. After gaining his Ordinary National

Diploma in Engineering with distinctions and LCI. prize for achievement,

he read for a degree in mechanical and manufacturing engineering at Liv-

erpool Polytechnic and spent periods in industry working for I.C.I. Phar-

maceuticals, Unilever Industries, and Anglo Blackwells. After graduating

with a Master of Engineering (M. Eng.) degree with Distinction under the

supervision of Professor Jack Schofield, M.B.E., Doctor Jackson subse-

quently read for a Doctor of Philosophy (Ph. D.) degree at Liverpool in the

field of materials engineering focusing primarily on microstructure-

property relationships in vitreous-bonded abrasive materials under the su-

pervision of Professor Benjamin Mills. He was subsequently employed by

Unicom Abrasives' Central Research & Development Laboratory (Saint-

Gobain Abrasives' Group) as materials technologist, then technical man-

ager, responsible for product and new business development in Europe,

and university liaison projects concerned with abrasive process develop-

ment. Doctor Jackson then became a research fellow at the Cavendish

Laboratory, University of Cambridge, working with Professor John Field,

O.B.E., F.R.S., on impact fracture and friction of diamond before becom-

ing a lecturer in engineering at the University of Liverpool in 1998. At

Liverpool, Dr. Jackson established research in the field of micromachining

using mechanical tools, laser beams, and abrasive particles. At Liverpool,

he attracted a number of research grants concemed with developing inno-

vative manufacturing processes for which he was jointly awarded an hino-

vative Manufacturing Technology Center from the Engineering and Physi-

cal Sciences Research Council in November 2001. In 2002, he became

associate professor of mechanical engineering and faculty associate in the

Center for Manufacturing Research, and Center for Electric Power at Ten-

nessee Technological University (an associated university of Oak Ridge

National Laboratory), and a faculty associate at Oak Ridge National Labo-

ratory. Dr. Jackson was the academic adviser to the Formula SAE Team at

Tennessee Technological University. In 2004 he moved to Purdue Univer-

sity as Associate Professor of Mechanical Engineering in the College of

Technology.

Doctor Jackson is active in research work concemed with under-

standing the properties of materials in the field of microscale metal cutting,

micro- and nanoabrasive machining, and laser micro machining. He is

also involved in developing next generation manufacturing processes and

biomedical engineering. Doctor Jackson has directed, co-directed, and

managed research grants funded by the Engineering and Physical Sciences

Research Council, The Royal Society of London, The Royal Academy of

Engineering (London), European Union, Ministry of Defense (London),

Atomic Weapons Research Establishment, National Science Foundation,

N.A.S.A., U. S. Department of Energy (through Oak Ridge National Labo-

ratory),

Y12 National Security Complex at Oak Ridge, Tennessee, and In-

dustrial Companies, which has generated research income in excess of $15

million. Dr. Jackson has organized many conferences and currently serves

as General Chair of the International Surface Engineering Congress. He

has authored and co-authored over 150 publications in archived joumals

and refereed conference proceedings, has edited a book on "microfabrica-

tion and nanomanufacturing", is guest editor to a number of refereed jour-

nals,

and is currently editing a book on "surgical tools and medical de-

vices"

and on "commercializing micro- and nanotechnology products". He

is the editor of the newly established "InternationalJournal of Nanomanu-

facturing'', and is on the editorial board of the "International Journal of

Machining and Machinability of Materials'' and the "InternationalJournal

of Manufacturing Research".