Jackson M.J. Micro and Nanomanufacturing

MICRO AND NANOMANUFACTURING

Mark J. Jackson, M.Eng, Ph.D

Purdue University

^ Spri

inger

Mark J. Jackson

Purdue University

West Lafayette, Indiana

USA

Micro and Nanomanufacturing

Library of Congress Control Number: 2006932032

ISBN 0-387-25874-4 e-ISBN 0-387-26132-X

ISBN 978-0387-25874-4 e-ISBN 978-0-387-26132-4

Printed on acid-free paper.

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987654 3 21

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Contents

Principles of IVIicro- and Nanofabrication

1.1

1.2

1.3

1.4

Introduction

Material Removal Rates

Conclusions

Problems

References

IVIicrofabrication Using X-ray Lithograpliy

2.1

2.2

2.3

2.4

2.5

2.6

2.7

Introduction

X- ray Lithography

Synchrotron Radiation

Microfabrication Process

Methods of Resist Application

Exposure

Problems

References

IVIanufacturing High Aspect Ratio iVIicrostructures

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

3.10

3.11

3.12

3.13

3.14

3.15

Introduction

Dry Etching

Plasma Etching Processes

Characteristics of the Plasma

Etching of Microstructures

Micromachining High Aspect Ratio

Microstructures

Micromolding

Micromolding Processes

Micromolding Tools

Micromold Design

Micromolding Applications

Limitations of Micromolding

Fabrication of Moving Microstructures

Conclusions

Problems

References

100

102

103

120

121

128

131

132

138

139

vi Contents

4. Meso-micromachining

4.1

4.2

4.3

4.4

4.5

4.6

4.7

Introduction

Size Effects in

l\/licromaciiining

iVIeciianism for Large Plastic Flow

Inhomogeneous Microstrains

Origins of

thie

Size Effect

Meso-maciiining Processes

Problems

References

5. Mechanical Micromachining

5.1

5.2

5.3

5.4

5.5

5.6

5.7

5.8

5.9

5.10

5.11

Introduction

Microfluidic Systems

Tiieory of Micromachining

Experimental Micromachining

Micromachining Tool Design

High-Speed Air Turbine Spindles

Mechanical Design of Rotors

Discussion

Conclusions

Future Developments

Problems

References

6. Microgrinding

6.1

6.2

6.3

6.4

6.5

6.6

6.7

Introduction

Grinding Wheels

Conventional Grinding Processes

Precision Grinding Processes

Ultra Precision Grinding

Conclusions

Problems

References

7. Diamond IVIicro Cutting Tools

7.1

7.2

7.3

7.4

7.5

Introduction

Properties of Diamond

History of Diamond

CVD Diamond Technology

CVD Diamond Processes

143

144

177

178

180

182

188

191

195

208

221

226

233

250

251

252

253

255

261

275

279

299

314

315

323

325

326

332

7.6

7.7

7.8

7.9

7.10

7.11

7.12

7.13

Contents vii

Treatment of Substrate

Modification of HFCVD Process

Nucleation and Growth

Deposition on 3-D Substrates

Wear of Diamond

Time-i\/lodulated CVD Diamond

Conclusions

Problems

References

8. Laser Micro- and Nanofabrication

8.1

8.2

8.3

8.4

8.5

8.6

Introduction

Laser Fundamentals

Laser Microfabrication

Laser Nanofabrication

Conclusions

Problems

References

Micromachining Using Water Droplets

9.1

9.2

9.3

9.4

9.5

9.6

9.7

9.8

9.9

9.10

9.11

Introduction

Theory of Pulsed Liquid Impact

Impact by Water Drops

Modeling Machining Thresholds

Comparative Results

Material Removal Rates

Design of Water-Based Tools

Analysis of Space Frame

Mode Shapes of Tetrahedral Structure

Conclusions

Problems

References

10.

Diamond Nanogrinding

10.1

10.2

10.3

10.4

10.5

10.6

10.7

10.8

Introduction

Piezoelectric Nanogrinding

Stress Analysis in Nanogrinding Grains

Fracture Dominated Wear Model

Nanogrinding

Porous Nanogrinding Tools

Laser Dressing of Tools

Future Directions

337

343

345

356

364

372

381

382

387

403

464

472

473

475

476

480

482

493

497

499

500

504

516

518

519

521

522

524

534

535

545

569

587

viii Contents

11.

10.9 Problems

References

Nanomachining

11.1 Introduction

11.2 Nanometric machining

11.3 Theoretical Basis of Nanomachining

11.4 Implementation

11.5 Conclusions

11.6 Problems

References

588

589

591

592

595

612

631

632

12.

Micro-and Nanomanufacturing 635

12.1 Introduction 635

12.2 Micromanufacturing 635

12.3 Nanomanufacturing 648

12.4 Commercialization Issues of Micro and

Nanotechnologies 672

12.5 Future Developments 683

12.6 Problems 684

References 685

Subject Index 687

Preface

When Nobel Laureate Richard Feynman presented his vision on minia-

turization at the Cahfomia Institute of Technology in 1959, he promoted a

scientific curiosity in what is now known as "nanotechnology". His revo-

lutionary vision was captured in a paper published in the February 1960 is-

sue of Caltech's journal,

"Engineering

and

Science''.

In this paper, Feyn-

man speaks about controlling and manipulating atoms and constructing

products atom-by-atom, and molecule-by-molecule. Feynman described

the scaling down of lathes and drilling machines, and talks about drilling

holes,

turning, molding, stamping parts, and so forth. Even in 1959,

Feynman described the need for micro- and nanomanufacturing as the ba-

sis for creating a microscopic world that would benefit mankind. Since the

1960s, Feynman's vision has created the basis for the foundation of the

semiconductor industry and within the last decade, has rapidly contributed

to the development of micro electro- mechanical systems (MEMS). At the

same institution. President Bill Clinton talked about the exciting promise

of nanotechnology in January 2000, and later announced an ambitious na-

tional nanotechnology initiative (NNI) that was enacted in 2001 with a

budget of $497 million to promote nanoscale research that would benefit

society. Nanotechnology encompasses technology performed at the nano-

scale that has real-world applications. Nanofabrication includes methods

that manipulate atoms and molecules to produce single artifacts to produce

sub micron-sized components and systems. Nanomanufacturing is a chal-

lenge presented to us to produce single-nanoscale artifacts in a mass pro-

duction fashion that obviously produces the accompanying economies of

scale. Nanotechnology will have a profound effect on our society that will

lead to breakthrough discoveries in materials and manufacturing, electron-

ics,

medicine, healthcare, the environment, sustainability, energy, biotech-

nology, information technology, national security, and prevention of the

spread of global terrorism. Nanotechnology will lead the next industrial

revolution.

The purpose of this book is to present information and knowledge on the

emerging field of micro- and nanomanufacturing. The book is written in

the spirit of scientific endeavor outlined by Richard Feynman, who stated

that one of the greatest challenges to scientists in the field of miniaturiza-

tion is the manufacture of tiny objects using techniques such as tuming,

molding, stamping, and drilling. The book presents information on sub-

jects such as fabrication, molding, lithography, machining, milling, water

drop machining, self assembly, manipulation, cutting, to name but a few.

X Preface

The book should serve as a text for undergraduate and graduate courses in

micro- and nanomanufacturing in subject areas such as mechanical engi-

neering, materials science, physics, chemistry, and electrical and electronic

engineering. The structure of the book is based on matter provided by

many colleagues and the author wishes to thank Professor Waqar Ahmed,

University of Ulster, U.K., Htet Sein, Manchester Metropolitan University,

Grant Robinson, Purdue University, Luke Hyde, Purdue University, David

Tolfree, Daresbury Laboratory, U.K., Emeritus Professor Milton Shaw,

Arizona State University, Professor V. C. Venkatesh, Malaysia University

of Technology, Sam McSpadden, Oak Ridge National Laboratory, Profes-

sor Kai Cheng, Brunei University, U.K., and Dr. Xun Luo, Cranfield Uni-

versity, U.K., for helping construct a source of knowledge and information

on micro- and nanomanufacturing and for granting the author permission

to use such matter.

The author expects that the textbook will stimulate further interest in

this field of nanotechnology and hopes that there still is, "plenty of room at

the bottom".

Mark J. Jackson

Purdue University

Jackson M.J. Micro and Nanomanufacturing

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