Jackson M.J. Micro and Nanomanufacturing

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Micro- and Nanomanufacturing 683

and an understanding of the nature of both the technology and socie-

tal needs. An unexpected urgent demand, for example, for particular

air pollution monitor or a biological sensor may temporarily distort a

market prediction. As terrorism and climate change become more

urgent issues, demands on MNT to deliver new innovative products

will increase. These types of market demands are difficult to predict

in advance.

12.5 Future Developments

The future of nanomanufacturing looks incredibly promising when

one looks at processes such as soft lithography and nanoimprint li-

thography. The deposition of colloids and nanoinks of

self-

assembled monolayers, and the impression of nanostructures on soft

materials ensures that industries such as the semiconductor industry

will be presented with processes that will overcome the problems as-

sociated with the diffraction limit in optical lithographic processes.

The greatest challenge to nanomanufacturers is the development of

manufacturing processes that can be applied to engineering materials

such as metal alloys and ceramics. Manufacturing processes for

these materials appear to be relatively abundant at the microscale but

do not appear to be available at the nanoscale.

Emerging nanomanufacturing processes will almost certainly be

used to produce semiconducting devices using carbon nanotubes,

nanostructured catalysts, lighter and stronger nanomaterials, im-

proved pharmaceuticals with features such as programmed drug de-

livery at desired targets, reliable filters for water decontamination,

efficient solar energy convertors, efficient fuel cells, durable com-

posite materials, high-altitude long endurance space vehicles, nano-

scale sensors, and coatings that will reflect heat and resist oxidation.

684 Micro- and Nanomanufacturing

12.6 Problems

Describe how electroplating produces microcomponents.

How do casting processes produce microcomponents.

Explain how molding processes will be advanced to produce

nanometer scale features.

How are thin layers cast to produce microfluidic devices.

Compare hard molding tools.

6. What is hot embossing?

What are the future developments in micromanufacturing?

8. Describe how semiconductors will be manufactured in the

future.

9. What is soft lithography and how will it aid the manufacture

the semiconductors?

10.

Describe nanomanufacturing by molding.

11.

What is nanoimprint lithography?

12.

How do machining processes generate nanocrystals?

13.

How are nanometal products manufactured?

14.

Describe how micro-and nanotechnology products are com-

mercialized.

References

Jo B et al., J. Microelectromechanical Systems, 9, p.p.

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Narasimhan J and Papautsky I, J. Micromech. Microengg., 12,

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Tseng A, J. Micromech. Microengg., 12, p.p. R15-R34, 2004.

Xia Y and Whitesides GM, Angew. Chem. Int., 37, p.p. 550 -

575,

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6. Love JC, Anderson JR, and Whitesides GM, MRS Bulletin, 26,

p.p.

523-528, July 2001.

Huck W, Int. J. of Nanotechnology, 1, p.p. 119 - 129, 2004.

8. Hamley IW, Nanotechnology, 12, p.p. R39-R54,

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9. Chou SY, MRS Bulletin, 26, p.p. 512 - 517, July 2001.

Micro- and Nanomanufacturing 685

10.

Guo LJ, J. Phys. D.:Appl. Phys., 37, p.p. R123 -

R121,

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11.

Mirken CA, MRS Bulletin, 26, p.p. 535 - 538, July 2001.

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Sirringhaus H, Kawase T, and Friend RH, MRS Bulletin, 26,

p.p.

539-543, July 2001.

13.

Brown TL, Swaminathan S, Chadrasekar S, Compton WD, King

AH, Trumble KP, J. Mater. Res., 17, Number 10, October 2002.

14.

Swaminathan S, Swanson C, Brown TL, Kezar RF,

Chandrasekar RF, Compton WD, Trumble KP, Mat. Res. Soc.

Symp. Proc, 821, P9.5.1-9.5.6., 2004.

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Swaminathan S, Swanson C, Brown TL, Kezar RF,

Chandrasekar RF, Compton WD, Trumble KP, Mat. Res. Soc.

Symp. Proc, 821, P8.27.1-8.27.6., 2004.

16.

Tolfree D and Eijkel K, Reducing Time-to-market for Micro-

Nanotechnology Base Products; Presented at World Nano—

Economic Congress- Europe, London, 6 November

2003.

17.

Walsh ST, Roadmapping a Disruptive Technology. Technology

Forecasting and Social Change, 71, Issue 1-2, January - February

2004.

18.

MANCEF Roadmap, by Micro-Nanotechnology Comerciahsa-

tion Educational Foundation, Published 2002, Naples, Florida, US.

19.

NEXUS -Product Technology Roadmap, Sept

2003,

CEA

Grenoble, France.

20.

NEXUS - 'Market Analysis for Microsystems 2000-2005', Feb-

ruary 2002, CEA Grenoble, France.

Subject Index

Abbe's principle, 221-225

Abrasive materials, 261-266

Absolute machining threshold

velocity, 482-492

Addition phase, 5-10

Adsorption, active species, 99-

102,

337-342

AFM, see Atomic force mi-

croscopy (AFM)

AlSIsteel, 144-149, 154-178

Alignment,

x-ray

mask to sub-

strate, 58-78

Alumina, 261-274, 569-584

Aluminium oxide, 261-274,

569-584

AM-AFM, nanofabrication, 33

American Society of Precision

Engineers, 600

AMTV, see Absolute machin-

ing threshold velocity (AMTV)

Anisotropic etching, 103

ANSYS software, 499-515

Apparatus

diamond nanogrinding,

522,535

mechanical micro-

machining, 208-218

Applications

micromolding, 120

nanocrystalline diamond,

524-527, 535-544

nanometric machining,

592

Archimedes' law, 544-568

Armchair nanotubes, 40

Aspheric surface generation,

299-314

Astigmatic focusing error,

305-310

Atomic force microscopy

(AFM), 30-42, 648-670

carbon nanomaterials,

38-41

laser nanofabrication,

464-467

lithographically induced

self-assembly, 654-664

machining, 1-46

nanofabrication, 2-32

surface texture meas-

urement, 15-40, 612-631

Axsun, LIGA services, 59

Beam characteristics, 387,

388-393

BEG, see Bias-enhanced

growth (BEG)

BEN, see Bias-enhanced nu-

cleation (BEN)

Beryllium mask materials, 83

Bias-enhanced growth (BEG),

345-356

Bias-enhanced nucleation

(BEN) 346-365

CVD diamond technol-

ogy, 345

Deposition routes, 356

Binderless wheels, 299

688 Subject Index

BioMEMS devices, 191

Blades, mechanical micro-

machining, 226-249

Bonding bridges, 496-518

Bonding systems,

240-251,

496-518

Bond materials, 245,496-519

Bottling, high-aspect ratio mi-

crostructures, 100-114

Bottom-up manufacturing, 1-

50,

625

Boundary conditions, me-

chanical micromachining, 179

Boundary region, high-aspect

ratio microstructures, 96

Bowing, high-aspect ratio mi-

crostructures, 100-114

Brittle-to-ductile transition,

434

CAIBE, see Chemical-assisted

ion beam etching (CAIBE)

CAMD, see Center for Advanced

Microstructures and Devices

(CAMD)

Cancellous bone, 220

Carbon nanomaterials, 39-46

Carbon nanotubes, see Carbon

nanomaterials

Casting, 635-646

Center for Advanced Micro-

structures and Devices (CAMD),

Centerless grinding opera-

tions,

275-279

Center of Optics Manufactur-

ing, 629

CFD,

see Computational fluid

dynamics (CFD) approach

CFX software, 217-229

Chemical-assisted ion beam

etching, 115-126

Chemical vapor deposition

(CVD) diamond technology

advantages/disadvantages,

323,

336

basics, V, 323-327

bias-enhanced nucleation,

349

DC plasma-enhanced, 333

filament assembly modifica-

tion, 334

heteroepitaxial growth, 324-

326

historical developments,

326-329

homoepitaxial growth, 324-

328

hot filament, 334

machining, 366-368

mask materials, 336

materials, substrates, 337-

341

metallic (Mo) wires, 356

metastable diamond growth,

329,

350

microdrills, 357-359, 367

microwave plasma-

enhanced, 332

modified hot filament CVD,

354

Mo/Si substrate, 339

nanocrystalline diamond,

377

nucleation and growth, dia-

mond, 348-355

performance studies, 367-

368

plasma-enhanced CVD, 334

Subject Index 689

pretreatment, substrates, 338

process condition, 323-325

process types, 324-326

properties, diamond, 325

RF plasma-enhanced CVD,

324

Si/Mo substrate, 339, 357

substrates, 337

S5aithesis, diamond, 326-329

technology development,

326-336

temperature influence, 351

three-diamond substrates,

356

time-modulated CVD, 372-

380

WC-Co, 339, 342-344, 357

Chip formation

mechanical micro-

machining, 191

nanometric machining,

591

Chiral nanotubes, 46

Chirped pulse amplification,

387-403

Chromatic aberrations, 300

Circumferential damage, 480,

493,495

CIRP,

see International Insti-

tute for Production Engi-

neering Research (CIRP)

Clays and clay-based fluxes,

545-568

Closed-form solution model,

458-460

Closed-loop structural con-

figuration, 612-630

CNC,

see Computer Numeri-

cally Controlled (CNC) ma-

chines,

Coanda effect, 191-192

COC,

see Cyclo-olefin co-

polymer,

Commercialization issues

basics, 672

infrastructure, 673

manufacturing centers,

683

markets, 672-674

product manufacture,

677

product-market interface,

678

supply chain networks,

672-682

Complex molds, nanometric

machining, 592

Computational fluid dynamics

(CFD) approach, 233-251

Computer Numerically Con-

trolled (CNC) machines, 93,

221-225,299-313

COMS2004 conference, 672

Concentration, grinding

wheels, 261

Conducting layers, 1-8

Constant height mode, 1-50

Contour Fine Tooling, 629

Control, nanometric machin-

ing, 594, 613-628

Conventional grinding, 275-

280

Conventional machining com-

parison, 277-280

Coulomb forces, 57-64

CPA, see Chirped pulse am-

plification (CPA)

Cranfield Unit for Precision

Engineering (CUPE), 630

Creep-feed grinding, 275-280

Critical depth, cuts, 255-314

Cropping operations, 278

690 Subject Index

Cubic, boron nitride, 261,

279-288

CUPE, see Cranfield Unit for

Precision Engineering (CUPE)

Cut-off grinding wheels, 280

Cut-off operations, 277

Cutting edge radius, 182-188,

595-611

Cutting tools, 182-186, 195-

208,

323, 625-627

Cyclo-olefin copolymer

(COC),

55-95

Cylindrical grinding opera-

tions,

279

Czochralski process, 1-43

Damping properties, 499, 595-

615

Daresbury synchrotron source,

DC plasma-enhanced CVD,

336

Decomposition, adsorbed spe-

cies,

99-135

Deep reactive ion etching

(DRIE), see also Reactive ion

etching (RIE)

Deep

x-ray

lithography

(DXRL), 58

Deposited doses, 78-87

Design

grinding wheels, 255,

545-567

micromolds, 121-131

water-based machine

tools,

499

Deterministic mechanical

nanometric machining, 592

Diamond, abrasive properties,

255-260, 325, 524

Diamond nanogrinding, see

also Micro- and nanogrinding

apparatus,

basics, 521

bonding bridges and sys-

tems,

496

dissolution models, 549-

559

fracture-dominated wear

model, 534

fusible bonding systems,

545-557

future directions, 589

Jackson and Mills'

model, 500-512

lander's model, 500-512

Krause and Keetman' s

model, 545-556

laser dressing,

nanogrinding tools, 569

loaded nanogrinding

grains, 524-535

Monshi's model, 545-

556

nanogrinding, 521-588

nanogrinding wheels,

545

nomenclature, 524

piezoelectric nanogrind-

ing, 522

porous nanogrinding

tools,

545

procedure, 524-529

quartz, 545-555

refractory bonding sys-

tems,

554

stress analysis, 545-553

x-ray

diffraction, 545-

550

Diamond technology, CVD

Subject Index 691

advan-

tages/disadvantages, 323,334

basics, 323-325

bias-enhanced nuclea-

tion, 349

DC plasma-enhanced

CVD,

333

filament assembly modi-

fication, 338

heteroepitaxial growth,

324-333

historical developments,

326-329

homoepitaxial growth,

298-299

hot filament CVD, 334

materials, substrates,

337-346

metallic (Mo) wires, 356

metastable diamond

growth, 331,322

microdrills, 357-360,

367

microwave plasma-

enhanced CVD, 333

modified hot filament

CVD,

343

Mo/Si substrate, 339

nucleation and growth,

diamond, 340-347

performance studies,

367-370

pretreatment, substrates,

338

process conditions, 323-

327

process types, 324-325

properties, diamond, 324

RF plasma-enhanced

CVD,

329

Si/Mo substrate, 339,349

substrates, 337

330

sythesis, diamond, 325-

technology development.

325-336

temperature influence,

351

three-dimensional sub-

strates, 356

WC-Co, 339, 341-343,

357

Dicing operations, 278

Diode lasers, 387-473

Dip pens, 35-50, 648

Dirac delta function, 499-501

Direct-current (DC) plasma-

enhanced CVD, 324

Displacement, nanometric

machining, 612-620

Disruption mechanisms, etch-

ing, 1-20, 99-107

Dissolution models, 546-563

Double-disk grinding, 278

DRIE, see Deep reactive ion

etching (DRIE)

Drives, nanometric machining,

591

Dry etching, 99

Ductile regime, 255, 294-308

DXRL, see Deep

x-ray

lithog-

raphy (DXRL)

Dynamic stress intensity fac-

tor, 482

EDM, see Electric discharge

machining (EDM)

Elastic structural loop minimi-

zation, 591-632

692 Subject Index

Electric discharge machining

(EDM), 53

Electrolytic in-process dress-

ing (ELID) 299-324

cutting tools, 300

micro- and nanogrinding,

255-305,

521-598

ultraprecision surface

grinding, 299-303

Electroplating, 635

Electrostatic forces, 635-645

ELID,

see Electrolytic in-

process dressing (ELID)

EMC,

see Electromagnetic

compatibility (EMC) standards

EMI, see Electromagnetic in-

terfacing (EMI) standards

Etching,

1-46,99-118

basics, 1-8, 99-100, 103

bottling, 115

bowing, 114-115

disruption mechanisms,

111

effects, 113

inhibitor depletion, 119

ions,

118-119

micrograss, 119

radical depletion, 119

reflection, 118-119

RIE, 100-102

TADTOP, 117

tilting, 114

trenches, 99-110

volume transport, 108

Excimer lasers, 402

Experimental approaches

mechanical micro-

machining, 191

pulsed water drop mi-

cromachining, 475

Exposure,

x-ray

lithographic

microfabrication, 95

Fanuc, 591

Far point, 255

Fast axial flow lasers, 387

Fast Tool Servo (FTS) system,

613

FEA, see Finite element

analysis (FEA) model

FEM codes and calculations,

499-503

Femtosecond laser pulses,

460-473

Femotsecond pulse microfab-

rication, 456-464

Field effect transistors (FETs)

1-46

microfabrication, 1

nanofabrication, 30-45

Filament assembly modifica-

tion, 332

Fillet surfaces, 255

Film formation, 323-353

Finite element analysis (FEA)

model, 498

Finite element model, 499-503

Five-axis CNC jig grinders,

279

Five-axis CNC machining

centers, 279-282

Flow topology, 191

Fluid flow analysis, 191-200,

226-252

Fluid-like flow, 143-188

Fluid models, 226-252

FM-AFM, 1-45

Fracture-dominated wear

model, 534

Free-form optics, 300-305

Frequency response function

(FRF),

500-504

Subject Index 693

Fresnel number, 255-306

FRF,

see Frequency response

function (FRF)

FTS,

see Fast Tool Servo

(FTS) system

Fusible bonding systems, 545-

567

Fusion bonding, 1-15

Future directions

basics, 51

casting, 683

diamond nanogrinding,

587

dip pen nanomanufactur-

ing, 683

electroplating, 683

lithographically induced

self-assembly, 683

machining, 138, 182,

253,518,632,683

mechanical micro-

machining, 252

micromanufacturing, 687

molding, 138, 686

nanoimprint lithography,

49,

688

nanomanufacturing, 687

semiconductor manufac-

turing, 51, 687

soft lithographic manu-

facturing, 687

x-ray

lithographic micro-

fabrication, 95

Hagen-Poiseuille pressure

drop effects, 191

Hard turning, 255

HARMST conference, 672-

687

HEMA, see Hydroxyethyl-

methacrylate (HEMA)

Heteroepitaxial growth, 323-

327,

345

HFCVD, see Hot filament

CVD (HFCVD)

High-aspect ratio microlitho-

graphy, 99

High-aspect ratio microstruc-

tures 99-136

High-speed multi-axis CNC

controllers, 612

High-speed air turbines, 226,

231-242

High-speed rotors 233-251

High structural loop stiffness,

221,499-508,612-620

Historical developments, CVD

diamond technology, 326

Hot embossing, 1-50

Hot filament CVD (HFCVD)

330,

363

Housing, mechanical micro-

machining, 225

Hydroxyethylmethacrylate

(HEMA), 83

Grades, grinding wheels, 261

Griffith's criterion, 534

Grit size, grinding wheels, 261

Growth, diamond, 344

lADF,

see Ion angular distri-

bution function (lADF)

IBARE, see Ion bean-assisted

radical etching (IBARE)