278
the approach is that it allows us to derive explicit relationships between the
thermal stress and relevant physical and geometrical parameters. This is
achieved by using asymptotic expansion
of
the solution in the Biot number,
characterizing the lateral heat flux. The asymptotic solution is obtained
by solving essentially one-dimensional problems. The results show that
the stress induced by radial temperature variation is related to the size of
the crystal (radius) and heat flux through the side surface. On the other
hand, the effect
of
the crystal radius on the stress induced by the axial
temperature variation is much weaker. The heat flux through the side
surface is an important factor for reducing the overall thermal stress inside
the crystal. The other advantages of our semi-analytical approach is that
it can be extended to cases with more complicated models for the melt and
gas flows. For example, the effect
of
the gas flow on the lateral heat flux
between the crystal surface and the gas can be modelled by
a
non-constant
heat exchange coefficient
hgs.
The motion of the melt may be modelled by
a
similar approach, which will be the subject of
a
subsequent paper.
Acknowledgement.
The authors wish to thank Firebird Semiconductors
Inc., MITACS, NSERC (Canada) and
BC
AS1 for their financial support.
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