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344 R.G. Polcawich and J.S. Pulskamp

early issues with process compatibility, complexity, and ﬁlm quality have been

resolved. Although many technical challenges still remain, piezoelectricity is slowly

becoming better utilized in the MEMS community.

Acknowledgment The authors would like to thank Dr. Brett Piekarski and Dr. Paul Amirtharaj of

the U.S. Army Research Laboratory for their support a nd encouragement in writing this chapter.

The authors also acknowledge the effort of their colleagues Dr. Madan Dubey, Daniel Judy, Roger

Kaul, Gabriel Smith, Joel Martin, Richard Piekarz, Brian Power, and Luz Sanchez of the U.S.

Army Research Laboratory and Glen Fox of Glen Fox Consulting in assisting with this chapter.

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