6 Materials and Processes in Shape Memory Alloy 363
There have also been many trials to sputter from separate metal targets of tita-
nium, nickel, and other additional elements. TiNiCu alloy films [19] and TiNi alloy
films [20] have been realized by sputtering deposition with separate metal targets.
When individual pure metal targets are sputtered, the substrate passes through each
deposition area of the metal target rapidly. The sputtering rate of each metal is con-
trolled by electric power individually applied to the target to control the composition
of the deposited alloy. Compared to sputtering with a single alloy target, sputtering
with separate multi targets is advantageous for easy adjusting the film composition,
but special sputtering equipment with multi-targets is required. In sputtering with
separate targets, a substrate rotating mechanism is necessary to obtain a uniform
film composition.
6.2.2.2 Evaporation
It is difficult to obtain a uniform composition along film thickness by using conven-
tional evaporation techniques. At the early stage of evaporation, Ni content tends to
be higher than that of Ti because the vapor pressure of Ni is higher than that of Ti.
There is a unique deposition method termed flash-evaporation, by which small
alloy pellets as the evaporation source are supplied from a storage holder to a heated
tungsten boat via a guide pipe one by one [21–23]. To omit the deposition at an
early stage of the evaporation, the deposition starts after a certain closed-shutter
time has elapsed from the start of the pellet vaporization. The evaporation of the
pellets is subsequently repeated, resulting in the deposition of a thick film with a
multi-layered structure.
6.2.2.3 Non-planar Thin Film Deposition
In addition to deposition on the flat surface of substrates, there have been some
studies on SMA deposition on non-planar surfaces, particularly on the cylindri-
cal surface of a core rod or pipe. Figure 6.6 shows a tubular actuator-unit for the
multi-directional bending mechanism [26]. Three meandering-shaped SMA actu-
ators are formed in a TiNi cylindrical film with a thickness of 10 μm, which are
flash-evaporated on a core Cu pipe with an outer diameter of 3 mm. The TiNi film
can be uniformly deposited on a cylindrical surface of the core pipe with rotation
during deposition. After the deposition, the TiNi film on the core pipe surface is pat-
terned by electrochemical etching with a photoresist mask pattern which is formed
by non-planar photolithography. After the core Cu pipe is dissolved selectively in
concentrated HNO
3
, a self-standing tubular TiNi actuator-unit is obtained.
Sputtering has been also used for tubular TiNi film deposition on core material.
TiNi films with a thickness of 10 μm were obtained on Cu wires (50 μm in diameter)
by rotating deposition [27]. TiNi crystalline grains can grow more uniformly by
rotating deposition than two-step deposition on both sides of the core wire. Ion
beam sputtering has also been employed [28]. By using ion beam sputtering with Ni
and Ti targets, a TiNi film with a thickness of 2 μm can be deposited on a Cu shaft
which is rotated during the sputtering.