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Chapter 5

Additive Processes for Piezoelectric Materials:

Piezoelectric MEMS

Ronald G. Polcawich and Jeffrey S. Pulskamp

Abstract Piezoelectricity has been underutilized in the MEMS world. Fabrication

process compatibility, complexity, and the limited availability of repeatable and reli-

able piezoelectric thin ﬁlms have limited t he incorporation of piezoelectric thin ﬁlms

in MEMS. Advances in materials processing and a move toward system-in-package

(SIP) concepts have pushed piezoelectric thin ﬁlm devices toward mainstream

acceptance. The advances in piezoelectric aluminum (AlN) thin ﬁlms for ﬁlm bulk

acoustic resonators (FBAR) [1] have encouraged using piezoelectric transduction as

an alternative to electrostatic actuation in RF (radio frequency) MEMS applications.

The FBAR devices have tremendous performance advantages and smaller size over

conventional bulk-machined quartz surface acoustic wave devices (SAWs) making

them ideal for cellular phones. To date, FBAR devices have exceeded the perfor-

mance of electrostatically driven MEMS resonator and ﬁlters operating in cellular

phone frequency bands (nominally 0.7–6 GHz). In addition to FBAR technology,

piezoelectric actuation/sensing is being examined for a host of applications includ-

ing RF MEMS, small-scale robotics, resonant mass sensors, and energy harvesting

[2, 3]. This chapter focuses on materials selection, material processing, and inte-

gration of piezoelectric thin ﬁlms with conventional MEMS fabrication processes.

The ﬁrst sections introduce the reader to the fundamentals of both ferroelectricity

and piezoelectricity. The remainder of the chapter addresses processing of the key

ferroelectric and piezoelectric materials, namely lead zirconate titanate (PZT), AlN,

and zinc oxide (ZnO).

5.1 Introduction to Piezoelectric Thin Films

Piezoelectric materials enable direct electromechanical coupling either with the

development of an electric charge under an applied external stress or the generation

R.G. Polcawich (B)

Micro & Nano Electronic Materials & Devices Branch, US Army Research Laboratory, Adelphi,

MD, USA

e-mail: ronald.g.polcawich@us.army.mil

273

R. Ghodssi, P. Lin (eds.), MEMS Materials and Processes Handbook,

MEMS Reference Shelf, DOI 10.1007/978-0-387-47318-5_5,

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Springer Science+Business Media, LLC 2011