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obtained by fixing the failure time to a specific value,
say 10,OOO
h.
The relation exhibits a strong dependence
on the Weibull modulus.
Curves of constant time to failure, 10,OOO h, were
determined for both the crack growth failure regime and
the creep regime, assuming 0.5% strain to failure for the
creep regime and actual rupture time for the crack
growth regime, Fig
8.
In the creep regime, the
allowable stress and temperature for the 10,OOO h
lifetime are degraded by a modest amount. For 100
MPa applied stress, the decrease in temperature needed
to assure a failure probability of less than 0.0001 is
about 25 "C. For SN88 the maximum temperature
allowed for a strain of less than 0.5% and at a
probability of less than O.OOO1 is less that 1300 "C.
The effect of the Weibull modulus,
m,
on the
allowable stress is very strong, as can be seen
from
Fig.
8,
where 10,000
h
curves for a failure probability
of
0.0001 have been drawn for Weibull modulus of 10
and 20. These values cover the range usually reported
for silicon nitride. At a temperature of about 900 "C, a
Weibull modulus of 20 reduces the allowable stress
from the median value of about 450 MPa to about 350
MPa. For a Weibull Modulus of 10, the allowable stress
is reduced to less than 200 MPa. These results
demonstrate how important
m
is to component
performance, since an allowable stress of less than
200 MPa lies very close to the design stresses in some
ceramic components. The higher value of
m
yields a
much greater flexibility for safe design.
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