6.2 Recrystallization annd Grain Growth 537
is mechanically stable. By heat treatment sufficient thermal energy is intro-
duced into the crystal to destabilize the dislocation arrangement. In principle,
there are two ways to remove the dislocations, or at least to reduce the stored
strain energy associated with the dislocations, namely recovery and recrystal-
lization. While recovery comprises all processes, which result in an annihilation
or rearrangement of dislocations in low energy dislocation structures, recrys-
tallization proceeds by generation and motion of grain boundaries, which are
capable of removing the swept-up dislocations. Therefore, while recovery will
locally rearrange and reduce the dislocation density, recrystallization will com-
pletely destroy the dislocation structure and rebuild a new strain-free crystal
arrangement. In the context of grain boundary migration, we shall focus on
recrystallization phenomena in the following.
Usually recrystallization proceeds from an abundance of recrystallization
nuclei and, therefore, the completely recrystallized material contains a high
density of grain boundaries. Owing to insufficient configuration entropy, grain
boundaries — like dislocations— also are not structural essentials of ther-
modynamic equilibrium and thus liable to be removed. As a consequence,
fine-grained recrystallized microstructures undergo grain growth, driven by
the increase in grain boundary energy. Grain growth can proceed in a contin-
uous or discontinuous way. During continuous grain growth, some grains will
shrink while others will grow, but the average grain size will grow while the
grain size distribution remains self-similar, i.e. normalized with the average
grain size the grain size distribution will not change upon continuous grain
growth (Fig. 6.21a). In contrast, during discontinuous grain growth, few grains
grow at the expense of the other non-growing grains. The microstructural evo-
lution bears a resemblance to the process of recrystallization and, therefore, is
referred to as secondary recrystallization. During discontinuous grain growth
a bimodal grain size distribution will develop and, thus, the self-similarity of
the grain size distribution is not maintained in this process (Fig. 6.21b).
There is a confusing variety of terms for the various microstructural changes
during heat treatment of deformed materials. The typical recrystallization pro-
cess during heat treatment of a cold worked metal is referred to as static pri-
mary recrystallization or short recrystallization. Sometimes it is also referred
to as discontinuous recrystallization, since it proceeds locally and thus does
not affect the entire volume concurrently. In contrast, continuous recrystalliza-
tion is not a real recrystallization process, but rather describes the phenomena
of very strong recovery, which also may result in the generation of large angle
grain boundaries. The term static recrystallization is used to distinguish the
two-step process, namely cold work and subsequent heat treatment, from the
recrystallization phenomena occurring concurrently with deformation at ele-
vated temperatures, which is referred to as dynamic recrystallization.
In contrast to the atomistic mechanisms of recrystallization the energetic
causes of recrystallization are relatively well understood. There is always a
driving force on a grain boundary, if — at a constant pressure and tempera-
ture — the displacement of the boundary reduces the Gibbs free energy G of
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