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914 A.G. Darrin and R. Osiander

the TI micro-mirror array, MEMS RF devices, and MEMS microphones, as well as

more special applications such as biomedical and space applications.

12.11.1 MEMS Accelerometer

MEMS inertial systems such as accelerometers and gyroscopes can probably be

considered the MEMS devices with the largest commercial impact. Driven by the

air bag technology, Analog Devices introduced the ADXL50 as the world’s ﬁrst inte-

grated MEMS accelerometer [46, 47]. While the accelerometer is a moving device,

the packaging requirements were relatively standard with respect to electronics

packaging, e.g. providing electronic interconnects, mechanical and environmental

protection, and heat dissipation. A TO5 metal can package, which had demonstrated

good reliability in the semiconductor industry, was chosen for the ADXL50.

One of the challenges for the accelerometer industry was the integration of

electronics. Two fundamental approaches were followed: integrated single chip

solutions using, for example, Analog Device’s iMEMS



process, and two chip

processes, with separate MEMS and electronics die. Motorola has taken the sec-

ond approach, packaging a capped surface micromachined MEMS structure and

an integrated circuit chip in the same plastic package. This is essential since pro-

cessing the MEMS is not compatible with the processing of the microprocessor

control unit. The requirements for the MEMS package are hermetic wafer-level

packaging to provide damping control and to protect the MEMS devices from

the subsequent dicing and testing; to provide mechanical support; and to isolate

stress. In particular, stresses induced by thermal loading due to thermal expansion

coefﬁcient mismatches between different packaging materials must be kept at a

minimum.

Before the accelerometer can be packaged in a conventional leadframe-and-mold

assembly, it must be sealed at the wafer level to be protected. Motorola’s wafer-level

packaging uses frit-glass bonding [48, 49]. A glass frit/epoxy paste is applied via a

screen process, dried and sintered. The cap and the MEMS die are then aligned,

pressed together and simultaneously heated above the softening point of the glass.

This thermo-compression creates a hermetic seal.

After capping the MEMS die, the accelerometer die and the control signal circuit

are mounted to a leadframe ﬂag by standard die bonding techniques and connected

via standard wire bonding. The transducer die is passivated with a thin layer of sili-

cone gel die coat. In a ﬁnal step, the two chips are encapsulated in a standard epoxy

mold compound. During cooling, the die coat shrinks faster than the mold, and a

25 μm air gap is created which isolates the transducer die from the surrounding

stress.

With the increased use of accelerometers and gyroscopes in the automotive and

consumer electronics industry, there was a drive to make smaller devices at a lower

cost. Analog Devices developed a wafer-level capping process for their iMEMS

accelerometers which allows packaging of the device in a very small and thin stan-

dard IC package [50, 51]. Matched with the MEMS wafer, sensor and die cut cavities

12 MEMS Packaging Materials 915

are etched into the bottom of the cap wafer. Then, a seal glass is screen-printed onto

the cap wafer, and the cap wafer is aligned and bonded to the sensor wafer. At that

point, the wafer can be diced and the devices are ready for standard assembly in a

wide variety of packages, such as the small footprint LFCSP. Using back-grinding

of the MEMS wafer, the device can even be packaged in very thin packages [52].

Figure 12.4 shows three methods for packaging an accelerometer.

Fig. 12.4 Schematic for an accelerometer packaged in (from left): a TO5 metal can, as capped

two-chip package, and after wafer-level capping

12.11.2 Micro-mirror Array

One of the biggest success stories in Micro-Opto-Electro-Mechanical Systems or

MOEMS is the Texas Instruments Digital Mirror Display (DMD). First invented

in 1987 and introduced in 2000, the technology now powers more than 1,500,000

projectors [53, 54]. DMD is an array of mirror-switches, each 16 μm squared,

which reﬂect light in and out of the optical path. Major challenges for this sys-

tem to be overcome are reliability related, hinge fatigue and memory, stiction, and

environmental robustness. The package and its optical window in part provide the

environmental robustness. The packages for the TI DMD are metal packages with

a lid with a high quality optical window seam-welded hermetically to the package.

The package itself contains a getter to absorb residual moisture.

For other applications such as optical routers, several ceramic packages such

as high-temperature co-ﬁred ceramic (HTCC) as well as low-temperature co-ﬁred

ceramic (LTCC) are being used. Advantages of the LTCC are the lower ceramic

processing temperatures (850–1000

◦

C), which allows the use of high conductiv-

ity metals instead of refractory metals, as well as the good match of the thermal

expansion coefﬁcient with silicon [55].

When greater hermeticity is required, especially in cases where the MEMS

devices require vacuum seals and high quality windows, some other packages have

been designed attaching windows with a gold/titanium/platinum seal ring on a lead-

less ceramic chip carrier [ 56]. The glass window thickness is determined by the

package size as well as by the allowable diffusion of hydrogen and helium into the

package. Compared to commercial metal–glass covers, these approaches offer better

916 A.G. Darrin and R. Osiander

and undistorted optical transmission and the strains and stresses in the transmission

windows of such packages have been modeled and measured.

For wafer-level packaging, a similar approach can be taken for packaged

accelerometers, using glass frits to bond a cap on the die. For optical transparency,

one proposed approach is to anodic bond a silicon frame onto the cover glass, which

then is used as the cap over the MEMS die. An hermetic package using this approach

has been reported [57].

12.11.3 MEMS Microphone

A commercial MEMS application with special packaging requirements is the

MEMS microphone. The Knowles SiSonic

MEMS microphone is targeted

towards high volume consumer electronic products where cost is a key factor [ 58].

The advantage of MEMS microphones over low cost electret condenser micro-

phones is the ability to withstand lead-free solder reﬂow cycles. This ability permits

the MEMS microphone to be picked and placed like any other component and thus

leads to signiﬁcantly lower manufacturing costs.

The microphone itself is a fully clamped round polysilicon membrane, about

0.5 mm in diameter and 1 μm thick, micromachined on a standard silicon wafer.

The silicon below the membrane has been removed using Deep Reactive Ion

Etch (DRIE). The die size is 1.65×1.65 mm. The electronics for the microphone

consisting of a series of different ampliﬁers is built on a separate CMOS chip.

Both die need to be packaged in a single package. This approach is extremely low

cost, exposes the MEMS die to the environment, and still protects the MEMS and

CMOS die both physically and from unwanted noise. A schematic of the package

is shown in Fig. 12.5. It consists of a base, a wall, and a lid laminated together from

FR4 PCB material. All inside surfaces are plated to provide a Faraday shield against

EMI interference. The MEMS and CMOS die are adhesively bonded to the base and

wire bonded with gold wire together as well as to the base. In order to protect the

CMOS die from corrosion and incident light, the CMOS die is also encapsulated.

A small port, offset from the MEMS die to prevent dirt accumulation or physical

damage to the die, serves as acoustic interface. Packaging is performed on 4



panels containing hundreds of microphones and only standard semiconductor

packaging equipment is used in the assembly of these microphones.

12.11.4 MEMS Shutters

Many MEMS devices are uniquely designed for special systems. Such an exam-

ple is the shutters used for the ST-5 MEMS radiator [59, 60] and the James Webb

Space Telescope [61]. In both of these systems, large MEMS arrays had to be built,

assembled, packaged and tested for space.

For the MEMS package to ﬂy on the New Millennium Program ST-5 Spacecraft

by NASA Goddard Space Flight Center and the Johns Hopkins University Applied

12 MEMS Packaging Materials 917

Fig. 12.5 Microphone package cross section

Physics Laboratory, novel packaging techniques were needed to place MEMS based

thermal control devices on the skin of a satellite for the Variable Emittance Coating

Instrument.

Some unique packaging challenges included the need to protect the shutter ele-

ments from particulate contamination during launch due to exterior mounting; to

consider the spacecraft electrical surface grounding requirements; and to meet the

requirements for thermal operation – high and low emissivities – for the different

substrate/surface materials.

The micro-shutter-array (MSA) radiator is located on the bottom deck of the

spacecraft. The gold-coated shutters open and close over t he substrate and change

the apparent emittance of the radiator. The shutter die, each 12.65 × 13.03 mm,

consists of arrays of 150 μm long and 6 μm wide shutters driven by electrostatic

comb drives, needed to cover as large an area as possible of a 9 cm x10 cm radiator,

in order to expose their low emissivity top surface or, when open, the high emissivity

substrate.

In order to manage the thermal expansion mismatch between Al and Si for the

survival temperature range, – 45 to 65

◦

C, an intermediate carrier made from alu-

minum nitrite was used. Sets of six die, with wire bonds connecting all the common

inputs, were attached to an aluminum nitride substrate with conductive epoxy. Six

of these sets were then themselves attached to the aluminum radiator with epoxy.

The thermal results associated with opening and closing the shutters are measured

by thermistors that are co-located on the underside of the MSA radiator chassis with

a heater to allow control of the radiator temperature. A top-view picture of the radi-

ator is shown in Fig. 12.6 and an exploded view of the MSA radiator assembly is

shown in Fig. 12.7. The package went through a full space qualiﬁcation including

thermal vacuum, vibration, shock, and acoustic testing at NASA Goddard and ﬁn-

ished its mission successfully in 2006, working for the full 3 months of the mission

life.

The MEMS shutters for the James Webb Space Telescope (JWST) are of even

higher complexity and demonstrate a system which had to be designed around the

MEMS device. These shutters expose an infrared spectrometer to different sections

918 A.G. Darrin and R. Osiander

Fig. 12.6 MEMS radiator packaged on six substrates of six chips each

of the image to perform spectroscopy on up to 100 targets simultaneously. One of

the requirements was an open ﬁll-factor of more than 70%. The solution was a shut-

ter array, made of silicon with a magnetic coating on the shutters, which is opened

by a magnet moving across. The shutters are kept open by an electrostatic electrode,

which can be addressed individually for each shutter to keep it open to view or block

a portion of the sky. Each of the four micro-shutter arrays contains 171 × 365 shut-

ters and each shutter is 200 micron-long and 100 micron-wide. Besides achieving

space qualiﬁcation (thermal vacuum, shock, vibration and acoustic testing), these

shutters have to work at cryogenic temperatures (35 K) and have the ability to open

and close more than 100,000 times. One of the challenges, unlike the ST-5 shut-

ters, which are all on a common signal line, is that all shutters on the 38 mm ×

35 mm die need to be individually addressed via rows and columns, which requires

a large number of connections between the shutter die and the mother board. These

connections also need to survive the transition to cryogenic temperatures. NASA’s

solution was the use of Indium bump bond pads to connect the shutter array to the

substrate. A picture of the shutter array mounted into one of the quadrants is shown

in Fig. 12.8.

12.12 Summary

This chapter has emphasized the differences between the heritage microcircuit

packaging world and the still evolving MEMS packaging arena. The packaging

schemes for these devices owe their infrastructure base to the body of knowledge

12 MEMS Packaging Materials 919

Fig. 12.7 Exploded view of the MSA radiator assembly

surrounding semiconductors and microcircuits. However, the MEMS device yields

new complexities which drive new packaging solutions. As opposed to traditional

microcircuit chips, MEMS often include moving structures along with the need to

have contact with the external environment, driving the requirements for packaging

such components. Thus, some functions include interaction with the surrounding

environment, such as pressure sensors. This imposes new requisites on packaging,

since in regular microelectronics the chip must be protected completely from any

920 A.G. Darrin and R. Osiander

Fig. 12.8 8 JWST shutter array mounted into one quadrant (NASA)

impact from the environment. Packaging also provides mechanical support to the

sensitive chip, facilitating the handling of the chip, and simplifying assembly. It will

be many years until standardized packaging is the rule rather than the exception with

MEMS components.

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