
504 CHAPTER 10 Introduction to Power Electronics
gate-source voltages are positive, while in a p-channel device current flows from the
source to the drain when the drain-source and gate-source voltages are negative.
Note the following features of the MOSFET and IGBT characteristics:
m In the case of the MOSFET, for positive drain-source voltage vDS, no drain
current will flow for values of VGS less than a
threshold voltage
which we will
refer to by the symbol VT. Once vGS exceeds VT, the drain current iD increases
as VGS is increased.
In the case of the IGBT, for positive collector-emitter voltage vCE, no
collector current will flow for values of VGE less than a threshold voltage VT.
Once VGE exceeds VT, the collector current ic increases as VGE is increased.
l In the case of the MOSFET, no drain current flows for negative drain-source
voltage.
In the case of the IGBT, no collector current flows for negative collector-
emitter voltage.
m Finally, the MOSFET will fail if the drain-source voltage exceeds its
breakdown limits; in Fig. 10.12a, the forward breakdown voltage is indicated
by the symbol (VDS)FB while the reverse breakdown voltage is indicated by the
symbol ( VDS)RB.
Similarly, the IGBT will fail if the collector-emitter voltage exceeds its
breakdown values; in Fig. 10.12b, the forward breakdown voltage is indicated
by the symbol (VcE)FB while the reverse breakdown voltage is indicated by the
symbol (VcE)R B .
m Although not shown in the figure, a MOSFET will fail due to excessive
gate-source voltage as well as excessive drain current which leads to excessive
power dissipation in the device. Similarly an IGBT will fail due to excessive
gate-emitter voltage and excessive collector current.
Note that for small values of 1)CE , the IGBT voltage approaches a constant value,
independent of the drain current. This
saturation voltage,
labeled (
VCE)sat
in the figure,
is on the order of a volt or less in small devices and a few volts in high-power devices.
Correspondingly, in the MOSFET, for small values of Vos, VDS is proportional to the
drain current and the MOSFET behaves as a small resistance whose value decreases
with increasing vGS.
Fortunately, for our purposes, the details of these characteristics are not impor-
tant. As we will see in the following example, with a sufficient large gate signal, the
voltage drop across both the MOSFET and the IGBT can be made quite small. In this
case, these devices can be modeled as a short circuit between the drain and the source
in the case of the MOSFET and between the collector and the emitter in the case
of the IGBT. Note, however, these "switches" when closed carry only unidirectional
current, and hence we will model them as a switch in series with an ideal diode. This
ideal-switch model
is shown in Fig. 10.13a.
In many cases, these devices are commonly protected by reverse-biased protec-
tion diodes connected between the drain and the source (in the case of a MOSFET)
or between the collector and emitter (in the case of an IGBT). These protection