Bhushan B. Nanotribology and Nanomechanics: An Introduction
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Index 1507
passive
linearization 97
structure 1300
patterned
silicon 1249
structures 1257
patterning 1281
Pb on Ge(111) 202
PDP (2-pyridyldithiopropionyl) 283
peak indentation load 870
PECVD (plasma enhanced chemical vapor
deposition) 904, 1245
carbon sample 855
Peierls instability 201
perfluorodecyltricholorosilane (PFTS)
1240
perfluorodecyltriethoxysilane (PFDTES)
1245
perfluoropolyether (PFPE) 960, 1235
performance lubricant 1236
periodic
boundary conditions (PBCs) 660
potential 566
permanent dipole moment 170
perpendicular scan 69
persistence length 296
perturbation approach 144
perylene 166
PFPE (perfluoropolyether) 963
lubricant 960, 971
phase transformation 612, 637
nanoindentation 674
phase transition, shear-induced 548
phenol 909
photoemission spectroscopy (PES) 194
photolithography 1284
physisorbed protein layer 281
physisorption 959
pick-up
SWNT tips 129
tip method 127
piezo
ceramic material 96
effect 95
hysteresis 182
relaxation 182
stacks 98
tube 94, 95
piezoelectric
drive 40
leg 564
positioning elements 180
scanner 113, 182
piezoresistive
cantilever 88
coefficients 89
detection 88, 138
piezoscanner 101, 130
piezotranslator 101
piezotube calibration 43
pile-up
nanoindent 617, 627, 628, 643, 646
nanoindentation 671
surface 674
surface atoms 667
pin-on-disk tribotester 918
pinning 222
planar fabrication 1224
plasma
chemistry 1285
enhanced chemical vapor deposition
(PECVD) 61, 848, 853, 1211
plasmon mode 191
plastic
contact regime 359
deformation 377, 871, 930
plastic deformation 702
surface 668
platinum-iridium 45
pneumatic damping 185
point probes 608
Poisson’s ratio 625
polar
group 913
lubricant 903, 960
polishing 846
polycrystalline SiC 1224
polycrystalline graphite 856
polydimethylsiloxane (PDMS) 905
polyethylene glycol (PEG) 282
polyethylene terephthalate (PET) 381
polymer
“brushes” 706
brush 446, 447, 465, 476
liquids (melts) 444, 476, 477
magnetic tape 386
1508 Index
mushroom 446
polyoxy-methylene (POM) 1206
polypropylene 166
polysilicon 1206, 1231, 1233
fatigue 1318
film 1224, 1231, 1281, 1303
fracture strength 1317
fracture toughness 1317
friction 1318
mechanical properties 1314
micromachined beams 1263
microstructure 1317
residual stress 1315
Young’s modulus 1316
polytetrafluoroethylene (PTFE) 570
pop-ins 612
pop-outs 612
position accuracy 102
potentials 658
power dissipation 597
power spectra, MD simulations 699
pre-crack length 1304
pressure 974
pressure sensor 1210, 1280
probe
FIB-milled 64
fluorophores 544
probe tip 112, 113
performance 115
process gas 853
processing aids 527
propagation of cracks 381
properties of a coating 849
protection of sliding surface 901
protein 282
adhesion 1221
prototype fabrication 1281
protrusion force 418, 447
Pt alloy tip 46
Pt-Ir tip 45
PTCDA 166
PTFE (polytetrafluoroethylene)
coated Si-tip 573
film 903
pull-off adhesion force 531
pull-off force see adhesion force, 562, 963
pulse-etching 124
purified MWNT 122
pyramidal etch 114
PZT (lead zirconate titanate)
scanner 316
tube scanner 42, 51
Q-factor 138, 140, 214
quad photodetector 51
quadrant detector 85
quality factor Q 60, 76, 137, 142
quantum
corrals 199
Hall regime 219
transistor 1204
well 191
wire 1204
quartz crystal microbalance (QCM) 656
quasi-continuum model 674
quasi-elastic light scattering (QELS) 540
quasi-optical experiment 191
quasi-static mode 141
radial cracking 869
radius of gyration 444
Raleigh’s method 75
Raman
spectra 856
spectroscopy 855
randomly oriented polysilicon 1317
ratchet mechanism 693
rate of deformation, simulations 674
rate-dependent slip 524
Rayleigh wave 615
RbBr 156
RC-oscillators 92
reaction kinetics 280
read chip 1213
readout electronics 85
receptor ligand
interaction 280, 418
unbinding force 281
recognition
force microscopy (RFM) 280
force spectroscopy (RFS) 291
imaging 300
rectangular cantilever 60, 599
reduced modulus 612
reflection interference contrast microscopy
(RICM) 426
relative humidity (RH)
Index 1509
effects of 979
influence on 1268
relaxation time 457, 458, 463, 479, 485,
495, 496
relaxation, mechanical 927
release stiction 1223
reliability 901
remote detection system 85
replica molding 905
repulsive
force 287
tip–substrate 673
residual
film stress 1298
stress 615, 626, 643, 861, 864, 874
thickness 933
resistance, temperature-dependent 1213
resisting pushing forces 712
resolution 115
vertical 48
resonance
curve detection 60
frequency 114
mechanical 492
rest time 972
retardation effect 428
Reynolds equation 521
RF magnetron sputtering 847
RF microswitch 1212
rheological characterization 965
rheology, interfacial 537
rheometer 538
rhombhedral R-8 637
rigid disk drive 960, 972
rolling friction 431, 454
root mean square 208
roughness 438, 440, 453, 454, 497
component surface 1261
surface 1226
rule of mixtures 641, 644
rutile TiO
2
(100) 160
s-like tip states 191
sacrificial-layer lithography (SLL) 1281
SAM (scanning acoustic microscopy)
615, 616
SAM (self-assembled monolayer)
adhesive force 1240
coating 1276
melting point of 942
wear resistance 1240
sammicroscopy 615, 616
sample holder 183
scan
area 54
direction 70
frequency 54
head 183
range 95, 97
rate 43
size 56
speed 97
scanner, piezo 214
scanning
acoustic microscopy (SAM) 615
capacitance microscopy (SCM) 38
chemical potential microscopy (SCPM)
38
electrochemical microscopy (SEcM) 38
electron microscopy (SEM) 115, 376
electrostatic force microscopy (SEFM)
38
head 42
ion conductance microscopy (SICM)
38
Kelvin probe microscopy (SKPM) 38
magnetic microscopy (SMM)
38
near field optical microscopy (SNOM)
38
probe microscopy (SPM) 38, 112, 136
speed 54
system 94
thermal microscopy (SThM) 38
tunneling microscopy (STM) 37, 112,
129, 135, 136, 154, 155, 312, 665
velocity 373
scanning force
acoustic microscopy (SFAM)
38
microscopy (SFM) 38, 206
spectroscopy (SFS) 206
scratch
critical load 888
damage mechanism 880, 882
depth 690, 1230
drive actuator 1309
1510 Index
induced damage 875
profile 373
test 374, 875
scratching force 690
scratching measurement 38
self-assembled
growth 189
microscopic vesicles 905
monolayer (SAM) 281, 529, 634, 680,
913, 960, 1208, 1221
monolayers (SAMs) 904
structures 710
self-assembly 189
self-lubrication 593, 594
semiconductor
quantum dots 199
surfaces 146
sensitivity 89, 91, 144, 285, 559
SFM (scanning force microscope) 180
bath cryostat 185
dynamic mode 208, 214
interferometer 185
piezo creep 181
static mode 208
thermal drift 180
thermal noise 181
variable temperature 183
vibration isolation 183
SH group 281
sharpened metal wire tip
129
shear
flow detachment (SFD) 285
force see kinetic friction, static friction,
533
melting 457, 483
modulus 559
motion 532
plane 424
rate 965
strength 583
stress 929
thinning 475, 478, 479, 487
shear stress 524
critical 458, 459, 467, 480, 483
effective 587
shearing force 928
short-cut carbon nanotubes 199
short-range
chemical force 215
electrostatic attraction 158
electrostatic interaction 156
magnetic interaction 155, 162–164
packing 550
shot noise 87
Si 49, 89, 115, 118, 139, 617, 637
accelerometer 1209
adatom 149
cantilever 115, 138, 559
chemistry 284
coated 1231
grain 1315
MEMS 1202
micromotor 967
nanofluidic array 1221
NEMS 1202
nitride 1252
nitride (Si
3
N
4
) 49, 281
cantilever 113
tip 117, 563
nitride adhesion 1252
on-silicon 1265
oxide 281
surface 281
terminated tip 210
tip 115, 147, 150, 210, 563
treated 1231
trimer 151
virgin 1231
wafer 114
Si(001)(2×1) 150
Si(001)(2×1)-H surface 150
Si(100) 357, 374, 880, 885, 962, 968, 969,
972, 981, 984, 986
adhesion 1235
bulk properties 1224
coefficient of friction 1238
hydrophilic properties 1267
wafer 962
Si(111) 373, 387
coefficient of friction 1228
dry-oxidized 1228, 1229
surface 166
surface roughness 1230
Si(111)(7×7) 573
Si(111)-(
√
3×
√
3)-Ag 153
Index 1511
Si–Ag covalent bond 154, 155
Si-SiO
2
stress formation 118
Si
3
N
4
118, 318
cantilever 114
layer 114
tip 61, 115, 918, 966, 967, 974, 988,
1249
SiC
bulk properties 1224
film 1231
silanization 1246
siloxane 904
single asperity 583
AFM tip 970
contact 359
single crystal
Si(100) 962
aluminum (100) 378
silicon 321, 741, 1299
silicon cantilever 61
single crystal silicon 1225
single molecule recognition 282
single-particle wave function 191
single-wall carbon nanotube (SWNT) 65,
120, 212
sink-in 617, 627, 628, 643, 646
sintering 427, 431
SiO
2
114, 118
SiOH groups 284
sliding
contact 592
direction 480
distance 490
induced chemistry 692
of tip 558
surface 1267
velocity 463, 480, 481, 579
work 702
slip 527
at the wall 519
length 522
partial 549
plane 424
slipping and sliding regimes 483
small specimen handling 1299
smooth sliding 480
SnO
2
(110) 160
soft
coatings 641
lithography 904
substrates 686
solid
boundary lubricated surfaces 458, 459,
466, 467, 471, 490, 492
thin films 723
xenon 213
solid–liquid interface 528
solid–liquid–air contact 1255
solid–lubricant interaction 703
solid-like
behavior 495
Z-DOL(BW) 967
solidification 471, 477
incomplete 547
solvation
forces 418, 437, 439, 443, 452, 453
SP-STM 205
sp
3
bonded carbon 875
bonded tip 675
bonding 865
spacer chain 914, 915, 917
length 923
spectroscopic resolution in STS 187
spin
density waves 205
quantization 194
SPM (scanning probe microscopy) 112,
180
spring
instability 533
sheet cantilever 64
system 41
spring constant 121, 137, 138, 142, 143,
148, 208, 287, 290, 560, 1308
calculation 72
changes 181
effective 566, 580
lateral 59, 565
measurement 72
vertical 59
sputtered coatings, physical properties
860
sputtering
deposition 853
power 862
1512 Index
SrF
2
157
SrTiO
3
(100) 160, 161
static
AFM 138, 139, 141
friction 458, 468, 471, 479, 481, 483,
487–490, 497, 548, 1269, 1271, 1313
friction force 967, 1271
friction torque 1271
interactions 420, 479
mode 138, 208
mode AFM 85
statistically stored dislocation (SSD) 797
steady-state sliding see kinetic friction,
706
step tilting 932
stepping motor 564
steric repulsion 418
stick boundary condition 525
stick–slip 458, 468, 473, 479–481, 488,
490, 493, 537, 983
friction 689
mechanism 565
sticking regime 482
stiction 471, 902, 1213, 1270
mechanisms 1276
stiffness 883
continuous measurement (CSM) 870
measurements 1240
torsional 77
Stillinger–Weber potential 659, 673
STM (scanning tunneling microscope) 37,
180
bath cryostat 185
cantilever 45
cantilever material 61
light emission 191
piezo creep 181
principle 40
probe construction 45
spectroscopy 191
spin-polarized 205
thermal drift 180
thermal noise 181
tip 38, 183
variable temperature 183
vibration isolation 183
Stoney equation 1298
storage modulus 632
strain
energy difference 870
gauge, rotating 1301
stray capacitance 91
strength 1297
streptavidin (STA) 284, 1246
mutants 291
stress 1297
field 1299
gradient 1301
maximum 1303
measurement 1300
stress–strain behavior 1306
Stribeck curve 456, 478
strip domain 221
structural
forces 418, 437, 440, 452
material 1304
structure, active 1304
STS 191
energy resolution 193
inelastic tunneling 196
stuck micromirrors 1276
sub-Angstrom deflections 113
submonolayer coverage 965
substrate 913, 915
curvature technique 1298
sum–frequency generation (SFG) 538
super modulus 614
superconducting
gap 203
magnetic levitation 41
matrix 222
superconductivity 188, 203, 205, 221
vortices 203, 221
superconductors 203
type-I 203
type-II 203
superhydrophobic surfaces 1255
superlubric state 703
superlubricity 572
surface
amorphous 420
asperity effect 343
atom layer 140
band 194
charge 437
charge density 434–436
Index 1513
crystalline 420
elasticity 391
energy 845, 935, 1253
energy (tension) 422, 428, 430, 449,
451, 453, 461, 463, 470
film hardness 1228
forces 417
forces apparatus (SFA) 312
friction 688
hydrophilic 528
hydrophobic 419, 442, 528
micromachining 1206, 1209, 1279
micromechanical properties 311
mobility 965
nanomechanical properties 311
nanometer-scale mechanical properties
664
phonon modes 660
potential 188, 434, 435, 437, 851
potential measurement 321
roughness 451, 1226
roughness parameters 1261
state lifetime 194
stiffness 325
structure 420, 438, 439, 451, 452, 457,
483, 493
tension 358, 902, 924, 960, 962
terminal group 914
topography 558
unlubricated 1271
surface force apparatus (SFA) 285, 420,
422, 423, 430, 466, 480, 486, 530,
656, 793, 1263
calibration 541
surface roughness 130, 923, 1253, 1255,
1260
map 337
measurement 314
Si(111) 1230
surface temperature, simulations 674
surface–surface spacing 527
surfactant monolayers 423, 447, 454–456,
467, 469, 470, 474, 484, 490, 492
suspended membrane 1306
SWNT (single-walled nanotube) 212
tapping mode 48, 114, 316
etched silicon probe (TESP) 63
Teflon layer 594
temperature 481
critical 193, 209
dependence of friction 582
effect 979
tensile
load 1303
stress 1301, 1316
test 1317
test environment 888
tether length 293
thermal
drift 181, 183
effect 574
energy 288
expansion coefficient 139
fluctuation 560
fluctuation forces 447
frequency noise 181
noise 288
printhead chip 1210
vibration amplitude 121
thermomechanical
noise 208
recording 1213
thermostats 660
theta condition 444
thick film lubrication see elasto-
hydrodynamic lubrication
thin film 630, 640, 680
lubrication 312
thin liquid films 518
thiol 909
third-body molecules 698
frictional force 698
three-dimensional force field spectroscopy
217
through-thickness cracking 867
Ti atoms 166
TiC grains 336
tilt angle of SAMs 932
TiO
2
196
(110) 168
(110) surface 160
(110) surface simultaneously obtained
with STM and NC-AFM 162
substrate 167
tip 1213
Fe-coated 164
1514 Index
Si
3
N
4
1249
apex 210, 598
artifact 148
atom(s) 182
atomic structure 131
containing antibodies 302
deflection 320
ferromagnetic 223
geometry 121
jumping 697
material 131
mount 43
oscillation 114
oscillation amplitude 595
performance 130
preparation in UHV 563
preparation method 45
properties 130
radius adhesive force 1259
radius effect 60, 356, 875, 983, 984
sample force 140
surface 281
tip–cantilever assembly 119
tip–liquid interface 970
tip–molecule distance 188
tip–sample
distance 140, 155, 212
electric field 599
energy dissipation 142
force 113, 136, 140, 141, 144, 208, 215
force gradient 144, 145
interaction 208, 223, 595
interface 112
potential 144
tip–sample interaction 145
chemical 210
electrostatic 218
exchange force 223
van der Waals 212
tip–surface
interaction 301, 592, 692
interface 666, 1258
potential 565
tip-bound
antigens 292
tip-broadened image 115
tip-induced atomic relaxation 211
tip-induced quantum dot 196
titin 293
Tomlinson model 557, 565
finite temperature 575
one-dimensional 565
two-dimensional 566
topographic images 48
topographical asymmetry 165
topography measurement 52
torsional resonance (TR) 1145
torus model calculation 96
total internal reflection (TIR) 538
microscopy (TIRM) 426
transition metal oxides 162
transitions between smooth and stick–slip
sliding 481
translational diffusion 540
transmission electron microscopy (TEM)
116, 376, 617
transversel piezo-resistive effect 89
traveling direction of the sample 71
Tresca criterion 619
triangular cantilever 60, 77, 86
tribochemical
oxidation 1229
reaction 979, 1267
tribochemistry 700
triboelectric surface potential 1218
triboelectrification 431
tribological
C
60
718
characterization of coating 862
material 1279
performance of coatings 885
problems 1213
problems MEMS devices 1209
properties of SAM 918
triethoxysilane 579
true atomic resolution 142, 146, 210
“true” atomic resolution images of insulators
155
tungsten 45
sphere 560
tip 45
tunneling
current 39, 135, 136, 140, 142, 160, 196
detector 47
tip 205
two-dimensional
Index 1515
electron gas (2-DEG) 219
electron system (2-DES) 201
two-layer-fluid model 525
two-photon excitation 541
UHV environment 569
UHV-AVM 564
ultrahigh vacuum (UHV) 146, 185, 563,
664
ultrasonic lubrication 351
ultrathin DLC coatings 847
unbinding force 280
unconstrained binding 282
unloading curve 670
unlubricated sample 985
unlubricated surfaces see dry surfaces
unperturbed motion 143
V-shaped cantilever 63, 561
van der Waals (vdW) 136, 137, 141, 166,
169, 170
attraction 356
force 113, 156, 418, 419, 427–429, 432,
433, 437, 438
interaction 920, 965
surfaces 212
vanadium carbide 613
variable
force mode 100
temperature STM setup 183
velocity
critical 484, 489, 490, 493
effect 976
of vibration 521
rescaling 661
velocity dependence of friction 579
vertical
coupling 43
nanotube 722
noise 145
rms-noise 209
Verwey transition temperature 220
vibration
amplitude 521
external 43
Vickers hardness 620
vinylidene fluoride 166
viscoelasticity 631, 646
mapping 324, 391
viscosity 424
viscous
drag 528
force 456, 475, 480
voltage bias 131
vortex in superconductor 221
W tip 46
wafer curvature technique 1315
water
capillary force 926
films 532
vapor 613, 620
vapor content 888
wear see damage, 312, 655, 845, 864
Si100 wafer 1264
contribution to friction 590
control 903
damage 888
damage mechanism 887
debris 376
depth 1227, 1233
fullerenes 718
map 1251
measurement 38
mechanism 377, 1276
performance 966
process 885
region 378
resistance 885, 886, 934, 985
resistance SAM 1240
study 985
test 885
tip 697
track 690
wearless friction 702
Weibull statistics 1317
weight function 144
wettability 925, 1236
wetted surface 527
wetting 455, 1253
surfaces 665
wire cantilever 60
work
hardening 634, 643
of adhesion 925
of indentation 630
write/read chip 1213
Wyko surface profiler 1264
1516 Index
xenon 185
yield point 457, 458, 480
load 633
yield strength simulations 674
yield stress 634
Young’s modulus 72, 100, 121, 181, 583,
1297, 1298
measurement 1305
Young–Dupre equation 924
Z-15 960, 961, 980–982, 986, 1235
coefficient of friction 1238
film 987, 1236
lubricant film 969
properties 961
Z-DOL 960, 961, 971
partially bonded film 988
properties 961
Z-DOL(BW) 969, 980, 984, 986, 987,
1235, 1237
coefficient of friction 1238
film 969, 1235
static friction force 1271
zinc 635