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Phenolics Phenolics, the most commonly used thermosets, are often used as adhe-
sives, coatings, laminates, and molded components for electrical or motor applications.
Bakelite
TM
is one of the common phenolic thermosets. A condensation reaction
joining phenol and formaldehyde molecules produces the initial linear phenolic resin.
This process continues until a linear phenol-formaldehyde chain is formed. How-
ever, phenol is trifunctional. After the chain has formed, there is a third location on
each phenol ring that provides a site for cross-linking with the adjacent chains.
Amines Amino resins, produced by combining urea or melamine monomers with
formaldehyde, are similar to the phenolics. The monomers are joined by a form-
aldehyde link to produce linear chains. Excess formaldehyde provides the cross-linking
needed to give strong, rigid polymers suitable for adhesives, laminates, molding mate-
rials for cookware, and electrical hardware such as circuit breakers, switches, outlets,
and wall plates.
Urethanes Dependi ng on the degree of cross-linking, the urethanes behave as ther-
mosetting polymers, thermoplastics, or elastomers. These polymers find application as
fibers, coatings, and foams for furniture, mattresses, and insulation.
Polyesters Polyester s form chains from acid and alcohol molecules by a conde nsation
reaction, giving water as a byproduct. When these chains contain unsaturated bonds, a
styrene molecule may provide cross-linking. Polyesters are used as molding or casting
materials for a variety of electrical applications, decorative la minates, boats and other
marine equipment, and as a matrix for composites such as fiberglass.
Epoxies Epoxies are thermosetting polymers formed from molecules containing a
tight CaaOaaC ring. During polymerization, the CaaOaaC rings are opened and the
bonds are rearranged to join the molecules. The most common of the commercial ep-
oxies is based on bisphenol A, to which have been added two epoxide units. These
molecules are polymerized to produce chains and then co-reacted with curing agents
that provide cross-linking. Epoxies are used as adhesives, rigid molded parts for elec-
trical applications, automotive components, circuit boards, sporting goods and a matrix
for high-performance fiber-reinforced composite materials for aerospace.
Polyimides Polyimides display a ring structure that contains a nitrogen atom. One
special group, the bismaleimides (BMI), is important in the aircraft and aerospace
industry. They can operate continuously at temperatures of 175
C and do not decom-
pose until reaching 460
C.
Interpenetrating Polymer Networks Some special polymer materials can be produced
when linear thermoplastic chains are intertwined through a thermosetting framework,
forming interpenetrating polymer networks. For example, nylon, acetal, and poly-
propylene chains can penetrate into a cross-linked silicone thermoset. In more advanced
systems, two interpenetrating thermosetting framework structures can be produced.
16-10 Adhesives
Adhesives are polymers used to join other polymers, metals, ceramics, composites, or
combinations of these materials. The adhesives are used for a variety of applications.
The most critical of these are the ‘‘structural adhesives,’’ which find use in the auto-
motive, aerospace, appliance, electronics, construction, and sporting equipme nt areas.
CHAPTER 16 Polymers530