Protocols of the Time-Triggered Architecture: TTP, TTEthernet, TTP/A 43-11
Generally,.there.are.two.types.of.rounds:
Multipartner round
is
.round.consists.of.a.conguration.dependent.number.of.slots.and.an.assigned.sender.node.for.each.
slot..e.conguration.of.a.round.is.dened.in.a.data.structure.called.“RODL”.(ROund.Descriptor.List)..
e.RODL.denes.which.node.transmits.in.a.certain.slot,.the.operation.in.each.individual.slot,.and.the.
receiving.nodes.of.a.slot..RODLs.must.be.congured.in.the.slave.nodes.prior.to.the.execution.of.the.
corresponding.multipartner.round..An.example.for.a.multipartner.round.is.depicted.in.Figure.43.10.
Master/slave round
A
.master/slave.round.is.a.special.round.with.a.xed.layout.that.establishes.a.connection.between.the.
master.and.a.particular.slave.for.accessing.data.of.the.node’s.IFS,.for.example,.the.RODL.information..
In.a.master/slave.round,.the.master.addresses.a.data.record.using.a.hierarchical.IFS.address.and.species.
an.action.like.reading.of,.writing.on,.or.executing.that.record.
e
.master/slave.rounds.are.used.to.access.the.DM.and.the.CP.interface.to.the.transducer.nodes..
Communication.via.the.RS.interface.is.established.by.periodical. multipartner.rounds..Master/slave.
rounds.are.scheduled.periodically.between.multipartner.rounds.as.depicted.in.Figure.43.11.in.order.to.
enable.maintenance.and.monitoring.activities.during.system.operation.without.a.probe.eect.
acknowledgments
is.survey.was.supported.by.the.Austrian.FWF.project.TTCAR.under.contract.No..P18060-N04.
references
[AFI+00].Alcatel.Corp.,.Fujitsu.Ltd.,.IBM,.NEC.Corp.,.NTT.Corp.,.and.IONA.Tech..Management.of.
event.domains..OMG.TC.Document.telecom/2000-01-01,.January.2000..Available.at.http://www.
omg.org.
[AKG+06]
.A..Ademaj,.H..Kopetz,.P..Grillinger,.K..Steinhammer,.and.A..Hanzlik..Fault-tolerant.time-
triggered
.ethernet.conguration.with.star.topology..In.Dependability and Fault Tolerance Workshop,.
Frankfurt,.Germany,.March.2006.
[BP00]
.G..Bauer.and.M..Paulitsch..An.investigation.of.membership.and.clique.avoidance.in.ttp/c..In.the
IEEE Symposium on Reliable Distributed Systems,
.Nürnberg,.Germany,.October.16–18,.2000.
[DeL99]
.R..DeLine..Resolving.packaging.mismatch,.PhD.thesis,.Computer.Science.Department,.Carnegie.
Mellon.University,.Pittsburgh,.PA,.June.1999.
[DW98]
.P..Dierauer.and.B..Woolever..Understanding.smart.devices..Industrial Computing,.47–50,.October.
1998.
[Ecc98]
.L..H..Eccles..A.brief.description.of.IEEE.P1451.2..In.Sensors Expo,.San.Jose,.CA,.May.1998.
[EHK01]
.W..Elmenreich,.W..Haidinger,.and.H..Kopetz..Interface.design.for.smart.transducers..In.IEEE
Instrumentation and Measurement Technology Conference,
.Budapest,.Hungary,.May.2001,.Vol..3,.
pp..1642–1647.
t
MP round
MP roundMS round
MS round
Real-time
service data
Diagnostics and
management data
FIGURE 43.11 Recommended.TTP/A.schedule.
© 2011 by Taylor and Francis Group, LLC