ELECTROLESS PLATING
223
The CO-P and CO-B coatings obtained are of particular interest due to their magnetic
properties.
Electroless iron plating is more difficult, and only one sufficiently effective iron
plating solution is known,
in
which Fe ions form a complex with tartrate and NaBHJ is
used as
a
reducer. Fe-B coatings (about
6%
B) are obtained in an alkaline solution (pH
12) at
a
temperature of 40°C and deposition rates of about 2
pd.
It is rather difficult to realize an autocatalytic tin deposition process.
A
sufficiency
effective tin deposition method is based on the tin(I1) disproportionation reaction
in
an
alkaline medium." In l-SM NaOH solutions at 80-90"C, it is possible to obtain a deposi-
tion rate of
a
few micrometers per hour.
7.4
Deposition
of
Precious Metals
Electroless silver plating is the oldest electroless metallization process: its present perfor-
mance however, lags behind nickel or copper plating.' Unstable single-use ammonia silver
plating solutions (with glucose, tartrate. formaldehyde, etc., as reducers) are usually em-
ployed. The thickness
of
coatings from such solutions is not great
(<
1
pm). Such unstable
solutions are more suitable for aerosol spray.
More effective electroless silver plating solutions have been developed using cyanide
Ag(1) complex and aminoboranes or hydrazine as reducers: at temperatures of 40-S0"C,
the deposition rate is
3-4
pndh, and in the presence of stabilizers these solutions are quite
stable. Sufficiently stable electroless silver plating solutions may be obtained using metal
ions such as Co(I1) compounds as reducers.
Gold coatings may be deposited employing various reducers: however, the solutions
are usually unstable. Solutions
of
sufficient stability have been developed with borohydride
or DMAB as reducers using a stable gold cyanide complex.'" At temperatures of 70-80°C,
the gold deposition rate reaches
S
Am/h and gold coatings of sufficient purity are obtained.
Thin gold coatings may be deposited on plastics by an aerosol spray method: gold
complexes with amines are employed with hydrazine as a reducer, and
a
relatively thick
coat (deposition rate as high as
0.4
pndmin) may be obtained.
Palladium coatings are easily deposited with hypophosphite as
a
reducer in alkaline
solutions, in which Pd" ions are bound in
a
complex with ammonia, EDTA, or ethylenedi-
amine. Palladium plating
is
performed at 40-S0°C, the deposition rate of the Pd-P
(4-8
P) coat being in the range of 2-S
p&.
Coatings of platinum, ruthenium, and rhodium may be deposited using borohydride
or hydrazine as
a
reducing agent. The process rate in a stable solution is low
(OS-2
pm/
h).
7.5
Deposition of Metal
Alloys
About
60
coatings of a different qualitative composition containing two or more metals
may be deposited. Such metals as copper. iron. zinc, tin, rhenium, tungsten, molybdenum,
manganese, thallium, and platinum group metals may be introduced into nickel and cobalt
coats, and nickel, cobalt, tin. zinc. cadmium, antimony, bismuth, lead. and gold into copper
coats.
In the electroless deposition of metal alloys, the same thermodynamic relationships
as
those of alloy deposition by electroplating techniques are valid;
it
is clear that it is
difficult to introduce into coatings metals that are difficult to reduce, such
as
chromium
and manganese. Besides, in the case of chemical reduction, an additional factor-catalytic
properties of metals-becomes apparent. Great amounts of additional metal may be intro-