“burn-in,” which permanently degrades the screen. On the other hand, LCD screens
are expensive to produce and often lack the response time required to view
fast-paced sporting events/movies without blur. In contrast to popular belief, the
new ‘LED TVs’ available at the high end of the HDTV market are not truly LEDs.
These displays are in fact LCDs that simply use LEDs instead of cold cathode
fluorescent lamps as the backlight; in contrast, true LED TVs would not require a
backlight, since each LED pixel would be self-illuminating.
[180]
Hence, as far as
picture quality is concerned, traditional CRT displays are still among the finest
quality. The replacement of this technology with CNTs is a logical step in the
evolution of display panels. Rather than a single electron gun, CNT-based screens
will contain a separate nanotube electron gun for each indivi dual pixel in the
display – dramatically enhancing the resolution and clarity of the picture. Further,
in contrast to current large flat-panel televisions, the overall weight of CNT-based
analogues will be significantly lower, and they will consume far less power. This
concept has already been proven in prototypes
[181]
and is scheduled to reach the
commercial market wi thin <5 years.
Another electronic application for CNTs is for next-generation field-effect
transistor (FET) designs. The “proof-of-concept” for CNTFETs was demonstrated
in the late 1990s, with a simple bridging of two noble metal electrodes with a
SWNT (Figure 6.67 – top). However, the electrical characteristics of this new
FET design were less than desirable, with high contact resistanc e (>1MO) and
low drive currents. Researchers at IBM have since modified the original design
wherein the semiconducting SWNTs are placed directly onto an oxidized Si
wafer, followed by the deposit ion of the source and drain (Co or Ti) electrodes
(Figure 6.67 – bottom). Through subsequent annealing, a stronger interaction is
afforded between the electrodes and CNT channel, which reduces the contact
resistance.
Though CNTFETs are in a relatively early stage of development, Avouris at IBM
provided a recent comparison of the output from a top-gate CNTFET (Figure 6.67 –
bottom) and existing Si-based FETs.
[182]
For CNTs with an average diameter of
1.4 nm, the ON current for a top-gated CNTFET is on the order of 2,100 mAmm
1
at
V
DS
(drain voltage) ¼ V
GS
(gate voltage)–V
T
(threshold voltage) ¼ 1.3 V. In com-
parison, the highest drive current in a p-CMOS under the same conditions is 650
mAmm
1
for a gate length of 50 nm. The transconductance (ratio of the output
current variation to the input voltage variation) of the CNTFET is 2,300 mSmm
1
;
the value for an analogous Si p-CMOS is 650 mSmm
1
. Hence, the values obtained
thus far show that CNTFETs outperform Si-based FETs. As improvements continue
to be made to the design of nanotube-based transistors, this technology should be
ready for the market just as the “glass ceiling” of Si CMOS devices is reached. It
should be noted that the extremely efficient thermal conductivity of CNTs will also
be exploited for cooling applications for future computers – of increasing concern as
the chip density continues to soar.
In addition to the above tunable conductive properties, CNTs are the strongest and
stiffest materials known to date (Table 6.6). The hollow, closed morphology of
536 6 Nanomaterials