Dewetting is a phenomenon in which solder flows over a surface and wets it, but before the solder solidifies, a change
in the relative surface tension forces takes place so that the solder withdraws into ridges and globules similar to water on a
greasy surface. The areas between solder globules retain the color of solder, but they have poor solderability, and this
surface can be made to wet properly only with great effort, if at all. The exact mechanism of dewetting is not well
understood, but dry abrasive cleaning that leaves particles imbedded in copper is one cause.
Nonwetting is more obvious than dewetting because, in most cases, the base metal retains its original color. Like
dewetting, nonwetting is a major flaw because the solder joint is not continuous and is therefore weak. In most cases,
nonwetting in very small amounts scattered across the surface can be tolerated. Typically, nonwetting can be traced to
insufficient flux activity or inadequate time and/or temperature during soldering.
A flaw related to dewetting or nonwetting is the poor filling of capillary spaces, such as the holes on printed circuit
boards. Nonwetting or dewetting may cause the poor fill, or excessive joint clearances may prevent joint completion. If
the latter is the cause, the joint may still be acceptable, depending on the required soldering quality level.
Dull or rough solder surfaces can result from overheating or underheating. Overheating is not so damaging to the
solder itself, but may damage surrounding heat-sensitive materials. Underheating produces poor contact of the solder with
the base metal, but can probably be repaired. A dull, not necessarily rough, surface may also result from vibration or
movement during solidification or from certain solder contaminants. Contamination is often inconsequential, but vibration
could mean that a degree of weakness has been introduced into the joint structure.
Bridging. Bridges of solder spanning the space between solder joints cannot be tolerated, especially in electrical
connections. Assuming that the spacing of the connections is adequate (a design parameter that depends on many factors),
the most likely cause of bridging is contamination of the solder by an element that promotes oxides in the solder, such as
excess cadmium or zinc.
A related phenomenon is icicling, which resembles incomplete bridges. These spikes of material attached to the joints are
normally associated with wave or drag soldering. The same impurity that causes bridging can also cause icicles by
interfering with the drainage of the solder as the printed circuit board is removed. Another possible cause is improper
alignment of the path of the board when exiting the bath.
Porosity in the solder joint, if small and scattered, poses no threat to reliability. Large pores can significantly decrease
the volume of solder in the joint area and therefore the strength of the joint. Pores that break the solder surface can trap
corrosive materials or can extend down to the base metal, allowing local corrosion. Such gross porosity is formed when a
bubble of air, flux vapor, or water vapor is trapped in the solidifying solder. In some cases, such defects can only be found
through sectioning of the soldered joint, but usually there is some other evidence of a problem to alert the inspector.
Excessive Solder. Another discontinuity is excess solder in the joint areas, which may mask other discontinuities.
Obviously, where visual inspection is the only possibility, any condition that interferes with the inspection cannot be
tolerated.
Nondestructive Inspection
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For a few soldering applications, especially those for which the solder forms a fluid seal, pressure or vacuum testing can
be used to check for leakage. The choice is usually determined by the intended application. For example, food cans that
will be vacuum packed are tested by sealing and evacuating the can. The special test machine then monitors for any loss
of vacuum. Vehicle radiators and other heat exchangers that operate under pressure are leak tested by creating an air
pressure inside the part being tested while it is immersed in a water tank. The test pressure is normally selected to be at
least as great as the pressure level to be encountered in use. Plumbing joints are usually checked visually for leaks by test
operation of the system.
For large, flat areas, such as the mounting of photovoltaic cells for solar arrays, x-radiography has been used.
Unfortunately, the design of the soldered joint rarely allows this test method.
New developments include acoustic emission, laser inspection techniques, and acoustic microscopy. Because acoustic
emission requires slight deformation of the solder to generate a signal, there is some risk of damaging the joint during
testing.