Qin Y. Micromanufacturing Engineering and Technology
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Integrated CPFE, 371–74
CPFE Model, 372–75
Gamma distribution, 373
Integrated numerical
procedure, 373–74
Polycrysals, 367–73
Probability, 373–74
Voronoi tessellation,
373–74
Implementation, 371–72
ABAQUS, 371–73, 374
dynamic effect, 371
VUMAT, 371–74
Integrated numerical process,
373–74
ABAQUE/CAE, 373–74
Grain size, 373–75
Orientation, 366, 369,
372–75
Pre-processing, 373–74
Virtural grain structure, 373
Introduction, 366–67
Crystal, 366–76
Crystal orientation, 366, 369,
372–75
Crystal Plasticity Finite Element
(CPFE), 367, 371–75
Dislocation, 366–69
Length-scale, 366, 367
Micro-forming, 366, 367, 371,
374
Micro-parts, 366, 367, 371, 375
Microstructures, 366, 367, 373,
375
Miniaturization, 366
Micro-materials models, 367–371
Constitutive Equations,
370–71
Hardened state, 370
Hooke’s law, 370
Jaumann rates, 370
Latent hardening, 371
Resolved shear stress, 370
Rotate, 370
Schmid stress, 370
Self hardening, 371
Spin, 370
Strain rate, 370
Crystal kinematics, 368
Deformation gradient,
368–69
Rotation, 368–70
Slip direction, 368–69
Slip plane normal, 370
Stretching, 369–70
Physical basis, 367
BCC (Body Centred Cubic),
368
FCC (Face Centred Cubic),
368–69
HCP (Hexagonal Close
Packed), 368
Slip systems, 367–69,
371–72
Process simulation, 374–75
ABAQUS/CAE, 374
CPFE analysis, 374–75
Micropins, 374–75
Micro-/Nano-Fibers by Electrospinning
Technology, 264–86
Applications, 274–82
Biomedical applications,
274–76
Drug carrier and delivery,
276
Tissue engineering, 274
Wound dressings and
healing, 276
Composite reinforcement, 279
Commercial products, 281
Electric and electronic, 278
Enzymes and catalysts, 276
Filters, 278
Micro-nano-fluidic devices,
276–77
Micro-nanomechanical devices,
276–77
Sensors, 277
Textile, 278
Production rate, 280
Centrifugal forces, 281
Multiple Nozzles, 280
Without Nozzles, 280
Characteristics of micro-nano-
fibers, 273–74
Alterations of functionality, 274
Alterations of structure, 274
Molecular orientation, 273
Shapes and sizes, 273
Configuration, 265–69
Electrospinning mechanism,
265–67
Bending instability, 267
Fluid jet, 265–66
Taylor cone, 265–66
Thinning of the fluid jet, 267
Control of morphology,
267–69
Design considerations, 273–74
Operational economics, 282
Processing parameters, 267–69
Ambient conditions, 268
Process conditions, 268
Solution properties, 267
Set-ups of electrospinning,
269–73
Control of the alignment, 270
Control of the orientation, 270
Dry rotary electrospinning,
271
Scanned deposition, 271
Dual syringes set-ups, 270
Novel set-ups, 269
Technological competiviness, 282
Tools of electrospinning, 269–73
Working principle, 265–67
Micro & Nano Machining, 24–38
Applications, 35–37
Competitive technologies, 37
Economic considerations, 37
Fundamentals, 24–27
Chip formation, 25–26
Cutting force, 24–25
Ductile mode cutting, 26–27
Micro-structure, 27
Minimum chip thickness,
25–26
Specific energy, 24–25
Introduction, 24
Micro-tooling, 34–35
CVD diamond cutting tools, 34
Diamond cutting tools, 34
Modelling, 27–30
FE modelling, 28–29
MD modelling, 29
Index 411
Multi-scale modelling, 29–30
Precision machines, 30–34
Micro and meso machines,
33–34
Ultra-precision machine tools,
30–33
Control system, 32
Drive system, 31–32
Feedbacksystem, 32
In-process condition
monitoring, 32
Inspection system, 32
Mechanical structure, 31
Position measurement,32
Spindle, 31–32
Micro-Sheet-Forming, 130–45
Case study, 142–43
Forming machine, 143
Micro-spring, 142
Progressive die, 143
Samples, 143
Design considerations, 141–42
Forming tools, 138–40
Considerations for tool design,
138
Handling, 139
Micro-tooling, 139
Pilot pins, 139
Punch/die clearance, 138
Size-effect, 138
Tool dynamics, 138
Fundamentals, 131–37
Also see Manufacturing
processes, 131
General considerations for
manufacturing, 137–38
Manufacturing processes, 131–37
Bending, 134–35
Bending operation, 134
Bending radius, 134
Bening allowance, 134
Distortion, 134
Forming error compensated,
135
Forming errors, 134–35
Process parameters, 134
Springback, 134–35
Blanking & punching, 131–33
Burr, 133
Burr-free punching, 133
Grain, 132
Laser heating, 133
Micro-structure, 132
Punch-die clearance, 132
Shearing action, 131
Size effect, 132
Deep drawing, 135–37
Drawing ratio, 135–36
Fracturing, 136
Part failure forms, 136
Wrinkles, 136
Other micro-sheet-metal-
forming processes, 137
Operational economics, 144–45
Presses and machines, 140–41
Bench-top, 140
Large scale, 140
Linear-motor driving, 140
Micro-machines, 141
Sheet metal components, 130
Technological competiviness,
144–45
O
Optical Coherence Tomography
(OCT), 324–30
Evaluation of microstructures,
326–29
Birefringence, 328
Optical axis, 329
Residual/internal stress,
328–29
Retardation, 328
Stress-optical coefficient,
328
Drug-eluting medical stent,
327–28
en-face scanning OCT, 327
Microfluidic devices, 329
Photoresist molds, 326–28
Future developments, 329
Introduction, 324
Biomedical diagnostics, 324
Technical applications, 324
Measurement principles, 325–26
Coherence probe microscopy,
326
Fourier-domain OCT, 326
Spectral-domain OCT, 326
Swept-source OCT, 326
Low coherence interferometry,
325
Optical Doppler tomography,
326
Polarization-sensitive OCT, 326
Scanning white-light
interferomtery, 326
Time-domain OCT, 326
Ultra-high resolution OCT, 325
P
Polymer Thin Film, 241–63
Conclusion, 261
Extrusion coating, 242
Adhesion properties, 243
Frozen time, 243
Principle of extrusion coating,
242
Process parameters, 243
Sealing properties, 244
Introduction, 241
Organic coating deposired in
solution, 245
Barrier properties, 251
Dwell time, 249
Optical properties optimisation,
250
Polymer used in roll coating, 246
Principle of organic coating
deposition, 247
Process parameters, 249
Roll coating, 246
Sealing properties, 252
Surface preparation, 247
Various roll coating approaches,
248
Viscosity, 250
Vacuum deposition, 253
Barrier properties, 257, 258
Chemical vapor deposition, 253,
254
Major precursor families, 255,
256
412 Index
Oxygen barrier, 257, 258
Permeability, 259
Physical vapor deposition, 253,
254
Polymerization, 254
Principle of vacuum deposition,
253
Process parameters, 256, 257
Surface properties, 260
R
Robotics, 315–23
Micro-robot examples, 319–22
Hexapod M-850 Micro-robot,
320
MFI Project, 322
Micro-air-vehicle, 320
Open-source Micro-robotic
Project, 320
Strider Micro-robot, 321
Waalbot, 320
Micro-robotics applications,
316–18
Micro-assembly, 317
Micro-handling, 317–18
Robot definitions, 315–16
Sensors and Actuators in micro-
robotics, 318–19
Actuators, 319
Micro-motors, 319
Piezoelectric actuators, 319
Sensors, 318–19
S
Surface Engineering, 221–40
Applications in Micro-
Manufacturing, 230
Cutting tools, 230–33
Micro-forming, 221, 232–36
Tool fabrication, 237
Focussed ion beam (FIB),
237
Electroforming, 235
Photolithography, 235
Chemical vapor deposition (CVD),
225
Diamond like carbon (DLC),
226, 230, 233–37
Plasma Assisted CVD, 225–26
Thermal CVD, 225–26
Electrodeposition, 225, 236
Electroless Ni, 225
Electroplating, 225
Hard Chromium, 225
Ion implantation, 224
Physical vapor Deposition (PVD),
226
Cathodic arc evaporation, 227
Chromium based coatings,
229–30
CrN, 230, 234
CrCN, 230
Duplex, 230
Electron beam, 227
Magnetron sputtering, 227
Ion beam assisted
deposition, 227
Closed field unbalanced
magnetron sputtering,
231
HIPIMS, 227
Titanium based coatings,
228–30, 232, 234
TiN, 228–31
TiAlN, 228–31, 234
(Al,Si)TiN, 228, 230, 232
Plasma nitriding, 222–23, 230
Tribology, 221, 222
Built up edge (BUE), 231
Coefficient of friction, 221, 225,
226, 230, 233, 237
Corrosion, 221, 222, 225
DLC, 226, 227, 230, 234, 235
Galling, 230, 234
Losses due to wear, 221
Low friction coatings, 226, 227,
230, 234, 235
Me:C, 226, 227, 230, 234, 235
MoS2, 226, 227, 230, 234, 235
Sticking, 230, 234
Wear, 221, 222, 224, 228
Sustainability of Micro-manufacturing,
394–404
Application of DFE, 399–400
Carbon nanotubes reinforced
polymer, 399
DFIP, 399
Fibres characteristics in recycled
polymer, 399
Handling and assembly use, 399
Integration of functions, 399
Material selection, 399–400
Micro factories, 400
Design for Environment (DEF),
397–98
DFD - design for de-assembly,
398
DFMA - design for
manufacturing and assembly,
398
DFR - design for recycling, 398
DFRm - design for
remanufacturing, 398
EBM - environment benign
manufacturing, 398
ReUse, 397
EcoDesign, 397
Ethical Issues, 401
LCA for micro components,
396
Clean room classes, 396
Types of micro components, 396
Life Cycle Assessment, 394–96
DFE, 394
EcoDesign rules, 394
Environmental impact, 394
Functional unit, 395
Goal and scope, 395
LCA theory, 394
Material-use data, 396
Process data, 395
Product directives, 395
System boundaries, 395
T
Testing and Diagnosis for Micro-
manufacturing Systems, 344–65
Micro-devices and machines,
360–64
Precision measurement systems,
347–53
Mixed qualitative-quantitative
analysis systems, 352
SEM, AFM and STM, 352
Index 413
Surface-texture analysis, 352
Mono- and multi-dimensional
measurement, 348
Thickness measurement, 348
Vibration measurement and
analysis, 351
2D profile and shape
measurement, 350
Testing and diagnosis methods,
353–60
Quantitative model-based
testing, 355
The Kalman Estimator, 359
Tooling and Process Chains, 287–97
Applications, 295–297
Die/mold fabrication, 295–96
Aluminum, 296
Etching, 296
Micro-bulk-forming,
114–29, 295–96
Micro-EDM, 39–58, 296
Nickel, 296
Silicone replica, 297
Polymer micro-fluidics, 295
Process chain, 288, 291–95
Definition, 288
Selection criteria, 291
Basic process chains, 292
Features, 294
Inserts, 293–94
Material selection, 294
Micro-structuring processes,
294–95
Tool requirements, 293
Tooling, 287–88
Definition, 287–88
Injection moulding, 90–113,
288
Laser ablation, 59–67, 288
Micro-EDM, 39–58, 288
Precision milling, 24–38, 287
Tooling concepts, 288
Additive processes, 289
CVD, 221–40, 290
Deposition, 290
Electrochemical deposition,
290–91also see
Eletroforming
Electroforming, 235,
290–91
Material capability, 289–90
PVD, 221–40, 290
Tooling technologies,
287–88
414 Index