Popov K.I., Djokic S.S., Grgur B.N. Fundamental Aspects of Electrometallurgy
Подождите немного. Документ загружается.
This page intentionally left blank
acceptor mechanism 235
activity 15
adatoms 31, 78, 161
additievs 65, 202
adsorption 24, 206
of impurities 24
of the additive 46
alkyl benzene electrolytes 225
alloys 201, 210
alumina-cryolite melts 282
aminoboranes 259
anionic surfactants 218
anode 11
insoluble 13
soluble 11
effect 292
anodic Tafel slope 15
anodic transfer coefficient 15
anodizing 241
anomalous codeposition 203, 204
atomic hydrogen mechanism 264
autocatalytic 254
borohydride 258
boron-containing reducing agents
258
boulder deposits 29, 41, 43
capacitance effect 154
carrot forms 59
cathode 11
cathodic transfer coefficient 15
cathodic Tafel slope 15
cationic surfactants 218
cauliflower forms 57
cell self driving 7
cell driven 10
cell voltage 18
cementation 10, 255
charge-transfer coupled
codeposition 213
chronoamperometry 286
chronopotentiometry 286
codeposition 203, 209, 210
coloring 245
complexing 95, 127, 202, 256
composite 214
conducting melts 279
contact deposition 254
corner weakness 133
critical overpotential
of dendritic growth initiation 80
instantaneous dendrite growth
80
current efficiency 14
current density 14
current distribution 101
cyanide solutions 303
cyclic voltammetry 286
decomposition voltage 10
degreasing 301
dendritic deposit 78
diffusion current density
limiting 15, 30, 50
303
304
Index
diffusion layer 16, 51, 58
dimethylamineborane (dmab) 259
displacement 254
double-bath technique 211
dusting problems 299
electrochemical 240, 201
electrochemical cell 5
electrochemical circuit 5
electrochemical double layer 6
electrochemical machining 238
electrochemical mechanism 264
electrochemical reaction 5, 7
electrocrystallization 20
electrode 5
electrode profile 232
electrodeposition 201,214
electroforming 1, 133, 220
electroless deposition 254
electroless deposition of
composite coatings 272
electrolysis 10
electromachining 238
electrometallurgy 1
electroplating 1, 191, 201, 223,
300
electrorefining 1, 181, 297
electrowinning 1, 175, 297
environmental issues 297
equilibrium codeposition 203
equilibrium potential 8, 11, 20,
43, 107
eutectic 202
exchange current density 15
Faraday’s law 14
fluoride emission 299
formaldehyde 261
gold electroless 271
granular deposits 92
hydrazine 262
hydride ion mechanism 262
hydrocarbon fumes 299
hydrolysis 260
hypophosphite 257
immersion plating 254
induced codeposition 203, 208
irregular codeposition 203
leveling 63, 233
macroprofile 62
macrostep 25
mandrel 220, 221
mechanistic aspects of electroless
deposition 231
metal hydroxide mechanism 267
metal matrix 215
metallization 271
microprofile 62, 169
microroughness 231
microstep 22
microthrowing power 44, 61, 62
mold 220
molten salts 228, 277, 299
multilayer films 210
Nernst equation 7
non-aqueous electrolytes 223
non-conductive surfaces 271
non-consumable anodes 293
non-interactive codeposition 213
non-ionic surfactants 218
nucleation exclusion zone 34
nucleation rate 38
ohmic resistance 20
organic electrolytes 227
Index
305
oxidation 201
oxide film 243
oxide matrices 219, 220
overpotential 14
particle 215
periodically changing current 207
pickling 301
plating through mask 222
polarisation curve 32, 41, 52
polymer matrix 219
porosity 195
powdered deposits 89
protrusions 231
pulsating current 146, 202, 208
pulsating overpotential 148
reducing agent 256
reentrant grove 21
regular codeposition 203
reversing current 145, 202, 208
rinsing 301
room-temperature molten salt 228
salt-film mechanism 235
sealing 247
silver mirror 66
simultaneous 201
single-bath technique 211
specific energy consumption 20
spongy deposits 72, 158
stabilizer 256
standard electrode potential 7, 184
surface coarseness 49
surface energy 16, 54, 159
surface metal film 30, 161
surface roughness 49
surfactants 217
symmetry factor 17, 80
transport coupled deposition 213
triangular surface profile 234
universal mechanism 270
whisker deposits 93
Wagner number 102