476 Chapter 10
(4) The final cool-down stage
In the final stage, thermal conduction increases the hot area but the temperature decreases, and
with it the electron emission ceases exponentially; see the temperature dependence of the
Richardson equation (10.6). The explosively formed plasma has expanded, its density is
lowered, therefore the cathode sheath thickness has increased, and the electric surface field is
also reduced. Yet, this stage can be important to the overall cathode erosion since the hot
surface may still deliver metal vapor, especially when the cathode material is of high vapor
pressure.
This qualitative description of the stages of an emission center does not really address why the
intense emission of this site cannot be maintained. We need to consider: What are the driving
forces for the inevitable dynamics of the emitting system?
There are several factors, as follows. First, and this is perhaps most easily to understand, heat
conduction leads to an increase in the area of the emission site, and this means that the
dissipated power is spread over a larger area, hence the areal power density decreases with
time.
Second, owing to the increase in resistance with temperature for all metals, dρ/dT > 0, the
region of the cathode bulk directly under the cathode spot is more resistive than all other areas
or parts of the cathode. Hence, if there was an alternative, less resistive way for the current to
flow, the current would switch to the new path.
Third, and most importantly, and somewhat ironically, the emission center itself builds a
highly resistive barrier against current flow. In the explosive stage, the cathode matter
transitions from the solid to the plasma phase, and it may initially bypass the gas phase by
circumnavigating the critical point in the phase diagram [23]. At this stage, the most resistive
zone for the current path is the non-ideal plasma phase. However, as time passes (and here we
consider some tens of nanoseconds!), the reduced areal power density leads to a change of the
path in the phase diagram: the material has now the time to transition through all conventional
phases: solid–liquid–gas–plasma. From those four phases, the gas phase is by far the most
resistive phase. Solid and liquid metal, and metal plasma are good conductors, but metal gas
(vapor) is not! The metal vapor chokes the flow of electricity. As the growth of the emission
area continues, the power density and related local surface temperature are reduced, electron
emission decreases rapidly, though there may be still significant evaporation from the hot
crater left by the explosion. At this point, the composition of the gas or plasma in front of the
site becomes increasingly influenced by neutral vapor, and indeed the current transfer
capability suffers greatly.
Fourth, in this situation, competition kicks in! The dense plasma near the emission site may
have started a microexplosion at a new site. Now, the new site and the older, much larger site
are electrically in parallel, and the path of lower resistance (i.e. where less metal vapor is