REACTIVE PHASE FORMATION, D’HEURLE ET AL. 293
which, for L
2
0, yields:
L
1c
d (1K
2
1K
1
). (18)
Phase 2 cannot grow until the first phase has reached a critical thickness L
1c
,
which increases as d (proportional to D
1
∆G
1
) increases, and decreases as
the initial rate of growth of phase 2, K
2
, increases. (If that rate is infinite, as
in the case of pure diffusion control, then L
1
c 0.) It becomes zero already
if K
1
K
2
; namely, there is no critical thickness for second-phase growth if
the maximum growth rates of the two phases are equal, which is indeed as
anticipated. An increase in K
1
, like an increase in d, increases L
1c
.
The literature on silicide formation relating to the reactions of thin
metallic films deposited either on single-crystal or polycrystalline Si bears
ample witness to the fact that phases do indeed form sequentially.
[15, 16]
With a 200-nm-thick film, growth of the first phase consumes all of the
metal present before a second phase begins to grow, for example, Ni
2
Si or
Pt
2
Si, then NiSi and PtSi, implying that L
1c
is larger than or of the order
of 300 nm.
[17–19]
As was emphasized above, such evidence is no confirma-
tion of a true reaction rate limitation at the beginning, so we should not
argue too much that no apparent activation energies have been determined
for this initial stage of silicide growth. What is certain is that when plot-
ted as in Fig. 6.3, the data show time intercepts that come closer to the ori-
gin as the temperature increases. Thus, if we compare observations made
on thin films, at relatively low temperatures, with observations on bulk
specimens, usually examined on a larger scale and consequently at con-
siderably higher temperatures, in the latter case, the sequential formation
of phases is usually ignored. This is probably more the result of the mode
of observation than of a true difference in behaviors between thin film and
bulk samples, which indeed obey the same laws except in extremely rare
cases (generally with extremely thin layers, below 50 nm). With thin
films, the interfaces tend to be quite clean. Retardation of phase formation
in bulk samples because of interface impurities, such as oxide with Al or
Ti samples, is not discussed here.
In discussing diffusion, the question of whether we refer to lattice or
grain boundary diffusion has been eluded. That was true also when writ-
ing the corresponding equations, which remain the same except for a
change in the value of D. Thus from the kinetics alone, it is difficult to
decide whether growth is due to one or the other of these two diffusion
mechanisms, since if the grain size of the growing layer remains con-
stant, the time exponent 1/n of the growth law remains 12. This ceases
to be true, however, if grain boundary diffusion is dominant and the
grain size increases during compound growth; then 1/n becomes smaller