943
CHAPTER
20
PLC Start-Up
and Maintenance
SECTION
6
Installation
and Start-Up
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I/O MODULE INSTALLATION
Placement and installation of the I/O modules is simply a matter of inserting
the correct modules in their proper locations. This procedure involves
verifying the type of module (115 VAC output, 115 VDC input, etc.) and the
slot address as defined by the I/O address assignment document. Each
terminal in the module is then wired to the field devices that have been
assigned to that termination address. The user should remove power to the
modules (or rack) before installing and wiring any module.
installation guidelines, which should have been prepared during the design
phase. A complete set of documents with precise information regarding I/O
placement and connections will ensure that the system is organized properly.
Furthermore, these documents should be constantly updated during every
stage of the installation. The following considerations will facilitate an
orderly installation.
WIRING CONSIDERATIONS
Wire Size. Each I/O terminal can accept one or more conductors of a
particular wire size. The user should check that the wire is the correct gauge
and that it is the proper size to handle the maximum possible current.
Wire and Terminal Labeling. Each field wire and its termination point
should be labeled using a reliable labeling method. Wires should be labeled
with shrink-tubing or tape, while tape or stick-on labels should identify each
terminal block. Color coding of similar signal characteristics (e.g., AC: red,
DC: blue, common: white, etc.) can be used in addition to wire labeling.
Typical labeling nomenclature includes wire numbers, device names or
numbers, and the input or output address assignment. Good wire and terminal
identification simplifies maintenance and troubleshooting.
Wire Bundling. Wire bundling is a technique commonly used to simplify
the connections to each I/O module. In this method, the wires that will be
connected to a single module are bundled, generally using a tie wrap, and then
routed through the duct with other bundles of wire with the same signal
characteristics. Input, power, and output bundles carrying the same type of
signals should be kept in separate ducts, when possible, to avoid interference.
WIRING PROCEDURES
Once the I/O modules are in place and their wires have been bundled, the
wiring to the modules can begin. The following are recommended procedures
for I/O wiring: