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temperature range was from 380 to 420
C. The typical growth rate was 1–2 mmh
1
.
Because unintentionally doped ZnO film prepared by MOCVD generally exhibits n-type
conduction due to oxygen vacancies or Zn interstitials, NH
3
(500 sccm) was used as a
nitrogen compensation doping source to reduce the electron concentration. A 500 nm ZnO
epilayer was grown with carrier concentration of about 10
16
cm
3
.
UV photodetectors were designed and fabricated using both circular and IDT MSM
structures. For the circular structure, the outer diameter is 320 mm, the inner diameter is
150 mm, and the gap is 10 mm. For the IDT structure, the fingers are 10 mm wide and
180 mm long, with a 10 mm gap. Aluminum and silver were used to form ohmic and
Schottky contacts, respectively. The formation of Schottky contacts is greatly influenced
by chemical reactions at the metal and semiconductor interface and diffusion of the metal
into the semiconductor. This effect is much more pronounced for II–VI oxides as
compared with III–V nitrides. In the case of ZnO, the less reactive metal Ag is used
to form Schottky contacts for the UV photodetectors. The Ag-ZnO-Al circular structures
were used for Schottky diode studies, while the Ag-ZnO-Ag structures served as Schottky-
type MSM photodetectors. For comparison, the Al-ZnO-Al structures were also fabricated
as MSM photoconductive detectors. e-beam evaporation was utilized for metal deposition.
The thickness of Al and Ag layers was 2000 A
. For the Schottky contact, a 500 A
thick Au
layer was finally deposited on the top of the Ag layer, to act as an oxide-resistant layer. It is
well known that in fabrication of Schottky contacts, the surface states, contaminants and
defects of the surface layer significantly affect the barrier height and leakage current.
Oxygen plasma was used to clean the surface before and after the metallization process in
order to minimize such effects.
Photoresponse measurements were performed using an Oriel optical system. The
photoresponse speed of the detector was also measured. The optical excitation source
was the 337.1 nm line of a N
2
pulse laser, with a pulse width of 2 ns at a repetition rate of
40 Hz. A Xe arc lamp and monochromator combination provided the light source. The
signal from the detector was monitored by a lock-in amplifier. Neutral density filters were
used to control the optical power on the detector. Optical energy on the detector was about
10 nJ per pulse. The signal from a 50 W load resistor was recorded by a digital scope with a
time resolution better than 1 ns. The bias voltage was 9 V.
Shown in Figure 11.13 are the I–V characteristics of ZnO MSM circular devices,
including both Schottky and ohmic types. The linear I–V relationship from the Al-ZnO-Al
structure clearly indicates the ohmic behavior of the Al on n-type ZnO contact. On the
other hand, the rectified I–V relationship from the Ag-ZnO-Al confirms Schottky junction
formation between Ag and n-type ZnO. In a Schottky diode, the general I–V characteristics
are represented by:
J ¼ J
o
expð
qV
ZkT
Þ1
; ð11:14Þ
J
o
¼ A
T
2
expðF
B
=kTÞ; ð11:15Þ
where J
o
is the saturation current density, Z is the ideality factor, k is Boltzmann’s constant,
T is the absolute temperature, A
is the effective Richardson coefficient, and F
B
is the
barrier height. The Schottky contact area is 1.77 10
4
cm
2
. The values of Z ¼1.50 and
302 ZnO-Based Ultraviolet Detectors