defects as dislocations, grain boundaries (GBs), and interfaces.
Consequently, diffusion occurred only in the lattice due to equilibrium
point defects such as vacancies, interstitial atoms, and divacancies.
Engineering materials, however, are polycrystalline in nature and contain
non-equilibrium extended defects. Sutton and Balluffi provide a compre-
hensive treatment of the nature of grain boundaries and their kinetic
behavior.
[45]
Diffusion along these defects is commonly six or more orders
of magnitude more rapid than in monocrystalline samples. In thin-film
packages used in the ultra-large-scale integration (ULSI) of microelec-
tronic devices, the density of the structural defects, notably the GBs, is
very high. Because the temperatures of device fabrication and perform-
ance are low, ≈100°C, the diffusive process in thin films may be largely
controlled by the grain boundaries. In recent years, interfaces in the
microelectronic back-end metallization/dielectric packages have also
been considered paths for fast diffusion (see, for example, Chapter 9).
Because an interface is sandwiched between two materials, it may be
termed a heterogeneous boundary as opposed to the homogeneous grain
boundary, which consists of the same material on either side. We use the
interface and grain boundary terms interchangeably because their analyt-
ical treatment is almost identical, with only a small adjustment to account
for lattice diffusion in differing materials in the case of the former.
In polycrystalline materials, in general, the diffusion within the
grains and along GBs occurs simultaneously. The coupling of these
processes takes place at the GBs, which have an effective thickness d, of
the order of atomic width ∼0.5 nm. The extent to which the lattice atoms
make excursions into the GBs, or vice versa, determines the diffusion
kinetic regime that prevails in the sample as a whole. Harrison
[46]
desig-
nated three types of kinetic regimes known as A, B, and C, which are
shown in Fig. 1.9.
The distinguishing feature of type-A kinetics is the extensive lattice
diffusion, which causes the diffusion fields from the adjoining grains to
overlap. The boundaries are shown here as parallel slabs with spacing 2L.
In essence, the atoms in the lattice have made some excursions into the
GBs so that their transport has been accelerated. The measurements in
type-A kinetics would show enhanced apparent diffusivities (D
app
) with
lower activation energies, which can be described by Hart’s equation:
[47]
D
app
D
1
gD
b
, (60)
where the l and b refer to the lattice and GB, respectively, and g is the site
occupancy factor at the GBs so that g 4dL. The value of g in bulk
materials is ∼10
5
, but in thin films, values of 10
2
are not uncommon.
Consequently, the second term becomes dominant in thin films.
28 DIFFUSION PROCESSES IN ADVANCED TECHNOLOGICAL MATERIALS