ASM Metals HandBook Vol. 8 - Mechanical Testing and Evaluation

Подождите немного. Документ загружается.

Test Driving force for

delamination

Sample

preparation

Analysis Mode

mixity

Applicability Requirements Advantages

Disadvantages

Sandwich

(Ref 65,

67, 68, 69)

External load Diffusion

bonding

Relatively

simple,

analytical

solutions

available

Between 0

and 90°,

depending

on a

particular

sample

geometry

All types of

interfaces

Film thickness

small with any

in-plane

dimension

In situ

testing; film

residual

stresses not

required.

Sample

preparation may

change interfacial

properties.

Peel test

(Ref 70,

71, 72, 73)

External load Simple partial

delamination

needs to be

introduced.

A variety of

dissipational

processes to

account for

… Thick films;

relatively

weak adhesion

… …

Mode mixity

range out of

practical interest

range; not

directly

applicable to very

brittle and/or

very thin films

Blister

(Ref 74,

75, 76, 77,

78)

Pressurization-

environmental

effects may be

evaluated by

pressurization

with the media of

interest.

Complex

removing a

“window” of a

substrate

(direct) or a fil

(invert)

… -60° to -30° … … … Challenging

sample

preparation; a

direct method is

not suitable for

brittle films.

Table 2 Summary of indentation (contact mechanics) methods for adhesion testing

Test Driving force

for

delamination

Sample

preparation

Analysis Mode

mixity

Applicability Requirements Advantages

Disadvantages

Axisymmetric

indentation

(Ref 81, 82,

83)

Film residual

stress plus

stress due to

indentation-

induced plastic

deformation in

a film

None Analytical … Plastically

deforming

films on

harder

substrates

More accurate

for indentation

depth smaller

than film

thickness

Simple sample

preparation,

procedure, and

analysis

In general, not

applicable for

very ductile

films and/or

strong adhesion.

Residual stress

measurements

are required.

Microwedge

indentation

(Ref 84, 85)

Indentation-

induced plastic

deformation in

a film; or

indentation-

induced plastic

deformation in

a substrate

May involve

microlithography

Analytical -37° to -

53°

Fine lines of

ductile

material on a

brittle

substrate and

brittle films on

ductile

substrates

… Directly

applicable for

microelectronic

structures

…

Superlayer

and

axisymmetric

indentation

(Ref 86, 87,

88)

Same as above

plus an

additional

driving force

from a

superlayer

None Numerical … Ductile films

on brittle

substrates

… Simple

procedure; may

be applied for

very ductile

film and/or

strong interfaces

Challenges in

analysis.

Residual stress

measurements

are required.

Axisymmetric

indentation

(Ref 89, 90)

Indentation-

induced plastic

deformation of

a substrate

None Analytical

approximation

utilizing fem

results

Pure

mode II

assumed

Brittle films

on ductile

substrates

Indentation

depth much

smaller than

film thickness

Simple

procedure

Not applicable

for very

strongly

adherent films

where very

large

penetration

depth with the

associated

pileup are

required. Here,

film might

experience out

of plane bending

Microwedge

scratch (Ref

84)

… Microlithography

or may be applied

directly to fin

lines

Analytical … Same as above

Same as above Simple

procedure

…

Scratch (Ref

91, 92, 93, 94)

… None Crude

analytical

approximations

Close to

mode II

… Thin films Simple

procedure may

be applied to

films on very

ductile

substrates

Very

challenging

analysis

Sandwich Specimen Testing. A thin film is sandwiched between two halves of a different material to make a

fracture specimen tested either in tension or flexural bending. With the crack growing along an interface of

interest, fracture toughness can be determined (Ref 65, 67, 68, 69).

Peel Test. A film is detached from a substrate under a fixed angle (Ref 70, 71). Elastic-plastic dissipation losses

for a fixed-arm peel test have been analyzed by Kinloch et al. (Ref 72). The symmetrical double-peel

arrangement for peel testing at variable angle and constant rate has been described in Ref 73.

Blister Test. A window in a substrate (direct method) (Ref 74, 75, 76, 77) or in a film (invert method) (Ref 78)

is removed, and a remaining counterpart is pressurized by a liquid or a gas. An environmental effect may be

evaluated by pressurization with the media of interest. With the electrolytic hydrogen charging of a thin

metallic film, spontaneous blisters may form. Interfacial toughness may be estimated in this case, providing

hydrogen fugacity is known.

Shear test under uniform plane stress loading along an interface (Ref 79, 80).

Contact Mechanics Testing. In this test, an indenter is driven into film/substrate system in order to induce film

debonding. The driving force for delamination in contact mechanics methods is indenter-induced deformation.

Little or no sample preparation is required (Table 2) and so there are no interfacial property changes from

sample preparation. Based on the load and delamination dimensions, adhesion strength may be evaluated (Ref

81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95).

References cited in this section

61. Y.-H. Lai and D.A. Dillard, Using Fracture Efficiency to Compare Adhesion Tests, Int. J. Solids Struct.,

Vol 34, 1997, p 509–525

62. V. Tvergaard and J.W. Hutchinson, Toughness of an Interface along a Thin Ductile Layer Joining

Elastic Solids, Philos. Mag. A, 1994, p 641–656

63. Y. Wei and J.W. Hutchinson, Models of Interface Separation Accompanied by Plastic Dissipation at

Multiple Scales, Int. J. Fract., Vol 95, 1999, p 1–17

64. K.J. Hsia, Z. Suo, and W. Yang, Cleavage due to Dislocation Confinement in Layered Materials, J.

Mech. Phys. Sol., Vol 42, 1994, p 877–896

65. R.H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, Adhesion and Debonding of Multi-Layer Thin Film

Structures, Eng. Fract. Mech., Vol 61, 1998, p 141–162

66. W.W. Gerberich. A.A. Volinsky, N.I. Tymiak, and N.R. Moody, A Brittle to Ductile Transition in

Adhered Thin Films, Fall MRS 1999 (Boston), Vol 594, 2000

67. P.G. Charlambides, J. Lund, A.G. Evans, and R.M. McMeeking, A Test Specimen for Determining the

Fracture Resistance of Bimaterial Interfaces, J. Appl. Mech., Vol 101, 1989, p 77–82

68. A.G. Evans and B.J. Dalgleish, The Fracture Resistance of Metal-Ceramic Interfaces, Acta Metall.

Mater., Vol 40, Suppl. Issue, 1992, p S295–306

69. G. Elssner, T. Suga, and M. Turwitt, Determination of the Fracture Energy and the Fracture Resistance

of Interfaces, J. Phys. Coll. (Orsay), Vol 46, 1985, p 657–663

70. R.M. Cannon, V. Jayaram, B.J. Dalgleish, and R.M. Fisher, MRS Symp. Proc., Vol 72, 1986, p 121

71. T.S. Oh, R.M. Cannon, and R.O. Ritchie,J. Am. Ceram. Soc., Vol 70, 1987, p C532

72. A.J. Kinloch, C.C. Lau, and J.G. Williams, The Peeling of Flexible Laminates, Int. J. Fract., Vol 66,

1994, p 45–70

73. A.P. Jackson, The Peeling of Surgical Pressure-Sensitive Adhesives at Different Angles, J. Mater. Sci.

Lett., Vol 7, 1988, p 1368–1370

74. E.H. Andrews and A. Stevenson, Fracture Energy of Epoxy Resin under Plane Strain Conditions, J.

Mater. Sci., Vol 13, 1978, p 1680–1688

75. H.M. Jensen, The Blister Test for Interface Toughness Measurement, Eng. Fract. Mech., Vol 40, 1991,

p 475–486

76. R.J. Hohlfelder, H. Luo, J.J. Vlassak, C.E.D. Chidsey, and W.D. Nix, Measuring Interfacial Fracture

Toughness with the Blister Test, Thin Films: Stresses and Mechanical Properties VI. Symposium,

Materials Research Society, 1997, p 115–120

77. M. Dupeux, A. Bosseboeuf, and D. Buttard, Investigation of the Mechanical Properties and Adhesion of

P.V.D. Tungsten Films on Si and Si Compounds by Bulge and Blister Tests, MRS Spring Meeting (San

Francisco), 13–17 April 1998

78. K.R. Jiang and L.S. Penn, Use of the Blister Test to Study the Adhesion of Brittle Materials, J. Adhes.,

Vol 32, 1990, Part I, p 203–216; Part II, p 217–226

79. L. Arcan, Y.M. Aravot, M.E. Arcan, and A. Albu-Yaron, Ultramicroscopy, Vol 23, 1987, p 234

80. Y.M. Aravot and A. Albu-Yaron, Ultramicroscopy, Vol 26, 1991, p 6423

81. D.B. Marshal and A.G. Evans, Measurement of Adherence of Residually Stressed Thin Film by

Indentation. I. Mechanics of Interface Delamination, J. Appl. Phys., Vol 56, 1984, p 2632–2638

82. M.J. Matthewson, Axi-Symmetric Contact on Thin Compliant Coatings, J. Mech. Phys. Solids, Vol 29,

1981, p 89–113

83. L.G. Rosenfeld, J.E. Ritter, T.J. Larner, and M.R. Lin, Use of the Microindentation Technique for

Determining Interfacial Fracture Energy, J. Appl. Phys., Vol 67, 1990, p 3291–3296

84. M. De Boer and W.W. Gerberich, Microwedge Indentation of the Thin Film Fine Line, I. Mechanics,

Acta Mater., Vol 44, 1996, p 3169–3175

85. J.J. Vlassak, M.D. Drory, and W.D. Nix, A Simple Technique for Measuring the Adhesion of Brittle

Films to Ductile Substrates with Applications to Diamond-Coated Titanium, J. Mater. Res., Vol 12,

1997, p 1900–1910

86. M.D. Kriese, W.W. Gerberich, and. N.R. Moody, Quantitative Adhesion Measures of Multilayer Films.

Part I. Indentation Mechanics, J. Mater. Res., Vol 14, 1999, p 3007–3018

87. N.I. Tymiak, A.A. Volinsky, M.D. Kriese, S.A. Downs, and W.W. Gerberich, The Role of Plasticity in

Bi-Material Fracture with Ductile Underlayers, Metall. Trans. A, Vol 31, 2000, p 863–871

88. A.A. Volinsky, N.I. Tymiak, M.D. Kriese, W.W. Gerberich, and J.W. Hutchinson, Qualitative

Modelling and Measurement of Copper Thin Film Adhesion, Fall 1998 MRS (Boston), Vol 539, 1998, p

277–290

89. M.D. Drory and J.W. Hutchinson, Measurement of Brittle-Film Adhesion on a Ductile Substrate by

Indentation, Proc. R. Soc. (London) A, 1996, p 2319–2341

90. D.F. Bahr and W.W. Gerberich, Effect of In and Out of Plane Stresses during Indentation of Diamond

Films on Metal Substrates, Thin Films, Stresses and Mechanical Properties VI, Symposium. Mater. Res.

Soc., 1997, p 85–90

91. P.R. Chalker, S.J. Bull, and D.S. Rickerby, A Review of the Methods for the Evaluation of Coating-

Substrate Adhesion, Mat. Sci. & Engng., A, Vol A140, 1991, p 583–592

92. S.V. Hainsworth, S.J. Bull, and T.F. Page, Scratch Deformation Response of Thin CN

Coatings at

Ultra-Low Loads, Fundamentals of Nanondentation and Nanotribology, Symposium. Mater. Res. Soc.,

1998, p 433–438

93. T.W. Wu, Microscratch and Load Relaxation Tests for Ultra-Thin Films, J. Mater. Res., Vol 6, 1991, p

407–426

94. S. Venkataraman, D.L. Kohlstedt, and W.W. Gerberich, Continuous Microscratch Measurements of the

Practical and True Works of Adhesion for Metal/Ceramic Systems, J. Mater. Res., Vol 11, 1996, p

3133–3145

95. J.E. Ritter, T.J. Lardner, L.G. Rosenfeld, and M.R. Linn, Measurement of Adhesion of Thin Polymer

Coatings by Indentation, J. Appl. Phys., Vol 66, 1989, p 3627–3634

Adhesion Testing

Surface and Adhesive Energies

Surface energies of fracture surfaces for environmentally exposed and nonexposed interfaces can be evaluated

with the contact angle method (Ref 96, 97). Measured values may be compared to these for corresponding bulk

material (Ref 98). Contact mechanics approaches provide an alternative measure of adhesive strength between

flat and spherical surfaces (Ref 99, 100). Swadener et al. (Ref 98) measured adherence of an epoxy sphere to

both pure glass surface and that obtained after fracture along an interface with epoxy. Similarly, environmental

effects on interfacial fracture surfaces may be evaluated. Finally, an alternative way to measure adhesion

strength using fracture surface examination was proposed by Sharma and coworkers (Ref 101). The method is

based on digital image processing. A special sample preparation involving microlithography is required here.

References cited in this section

96. J.M. Howe, Bonding, Structure, and Properties of Metal/Ceramic Interfaces: Part 1 Chemical Bonding,

Int. Mater. Rev., Vol 38, 1993, p 233–256

97. A. Carre and J. Shultz, Polymer-Aluminum Adhesion. I. The Surface Energy of Aluminum in Relation

to its Surface Treatment, J. Adhes., Vol 15, 1983, p 151–162

98. J. Swadener, K.M. Liechti, and A.L. de Lozanne, The Intrinsic Toughness and Adhesion Mechanisms of

a Glass/Epoxy Interface, J. Mech. Phys. Solids, Vol 47, 1999, p 223–258

99. K.L. Johnson, K. Kendall, and A.D. Roberts, Surface Energy and the Contact of Elastic Solids, Proc. R.

Soc. (London) A, Vol 324, 1971, p 301–313

100. D. Maugis and M. Barquins, Fracture Mechanics and the Adherence of Viscoelastic Bodies, J.

Phys. D., Appl. Phys., Vol 11, 1978, p 1989–2023

101. R. Sharma, J.-K. Lin, and J. Drye, A New Method to Evaluate Thin Film Adhesion, J. Adhes.,

Vol 40, 1993, p 257–265

Adhesion Testing

References

1. P.J. Blau, Glossary of Terms, Friction, Lubrication, and Wear Technology, Vol 18, ASM Handbook,

ASM International, 1992

2. K.L. Mittal, Ed., Adhesion Measurements of Films and Coatings, VSP, 1995

3. K.L. Mittal, Ed., Adhesive Joints, Plenum Press, 1984

4. G.L. Schneberger, Ed., Adhesives in Manufacturing, Marcel Dekker, 1983

5. G.P. Anderson, S.J. Bennett, and K.L. DeVries, Analysis and Testing of Adhesive Bonds, Academic

Press, 1977

6. K.L. Mittal, Ed., Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, STP 640,

ASTM, 1978

7. J.N. Israelachvili, Intermolecular and Surface Forces, Academic Press, London, 1985

8. R.G. Horn, Surfaces Forces and Their Action in Ceramic Materials, J. Am. Ceram. Soc., Vol 73, 1990, p

1117–1135

9. R.G. Horn, Measurement of Surface Forces and Adhesion, Friction, Lubrication, and Wear Technology,

Vol 18, ASM Handbook, ASM International, 1992, p 399

10. D. Tabor and R.H.R. Winterton, The Direct Measurement of Normal and Retarded van der Waals

Forces, Proc. R. Soc. (London) A, Vol 312, 1969, p 435–450

11. J.N. Israelachvili and G.E. Adams, Measurement of Forces between Two Mica Surfaces in Aqueous

Electrolyte Solutions in the Range 0 to 100 nm, J. Chem. Soc. Faraday Trans. I, Vol 74, 1978, p 975–

1001

12. K.B. Lodge, Techniques for the Measurement of Forces between Solids, Adv. Colloid Interface Sci., Vol

19, 1983, p 27–73

13. J.N. Israelachvili, Thin Film Studies Using Multiple-Beam Interferometry, J. Colloid Interface Sci., Vol

44, 1973, p 259–272

14. R.G. Horn and D.T. Smith, Analytic Solution for the Three-Layer Multiple Beam Interferometer, Appl.

Opt., Vol 30, 1991, p 59–65

15. D.Y.C. Chan and R.G. Horn, The Drainage of Thin Liquid Films between Solid Surfaces, J. Chem.

Phys., Vol 83, 1985, p 5311–5324

16. J. Peachey, J. Van Alsten, and S. Granick, Design of an Apparatus to Measure the Shear Response of

Ultrathin Liquid Films, Rev. Sci. Instrum., Vol 62, 1991, p 463–473

17. A.M. Homola, J.N. Israelachvili, M.L. Gee, and P.M. McGuiggan, Measurement of and Relation

between the Adhesion and Friction of Two Surfaces Separated by Molecularly Thin Liquid Films, J.

Tribol., Vol 111, 1989, p 675–682

18. D.H. Buckley, Surface Effects in Adhesion, Friction, Wear and Lubrication, Elsevier, Amsterdam, 1981

19. F.M. Orr, L.E. Scriven, and A.P. Rivas, Pendular Rings between Solids: Meniscus Properties and

Capillary Force, J. Fluid Mech., Vol 67, 1975, p 723–742

20. W.D. Bascom, P.F. Becher, J.L. Bitner, and J.S. Murday, Use of Fracture Mechanics Concepts in

Testing of Film Adhesion, Adhesion Measurement of Thin Films, Thick Films and Bulk Coatings, STP

640, K.L. Mittal, Ed., ASTM, 1978, p 63–81

21. D.B. Marshall and A.G. Evans, Measurement of Adherence of Residually Stressed Thin Films by

Indentation. Mechanics of Interface Delamination, J. Appl. Phys., Vol 56, 1984, p 2632–2638

22. A. Carre and J. Shultz, Polymer-Aluminum Adhesion. III. Effect of a Liquid Environment, J. Adhesion,

Vol 18, 1984, p 171–184

23. J.D. Venables, Review: Adhesion and Durability of Metal-Polymer Bonds, J. Mater. Sci., Vol 19, 1984,

p 2431–2453

24. H. Wu, J.T. Dickinson, and S.C. Langford, Dynamic Measurements of Humidity Attack on

Polymer/Glass Interfaces under Stress, J. Adhes. Sci., Vol 11, 1997, p 695–717

25. S.X. Mao and A.G. Evans, The Influence of Blunting on Crack Growth at Oxide/Metal Interfaces, Acta

Mater., Vol 45, 1997, p 4263–4270

26. T.S. Oh, J. Rodel, R.M. Cannon, and R.O. Ritchie, Ceramic/Metal Interfacial Crack Growth

Toughening by Controlled Microcracks and Interfacial Geometries, Acta Metall., Vol 36, 1988, p 2083–

2093

27. N.R. Moody, S.K. Venkataraman, B. Bastaez, J.E. Angelo, and W.W. Gerberich, Hydrogen Effects on

the Fracture of Thin Tantalum Nitride Films, Mater. Res. Soc. Symp. Proc., Vol 356, 1995, p 827–832

28. N.I. Tymiak, M. Li, A. Volinsky, Y. Katz, and W.W. Gerberich, The Role of Plasticity in Bi-material

Fracture with Ductile Interlayers, Metall. Trans. A, Vol 31, 2000, p 863–871

29. Y.Y. Wang, F.P. Chiang, and R.S. Barsoum, A Photoelastic Study of Extending Cracks in Adhesion

Joints, J. Adhes., 1995

30. A.G. Evans and J.W. Hutchinson, Effects of Non-Planarity on the Mixed Mode Fracture Resistance of

Bi-material Interfaces, Acta Met. Mater., Vol 37, 1989, p 909–916

31. F.M. Fowkes, D.W. Dwight, and D.A. Cole, Acid-Base Properties of Glass Surfaces, J. Non-Cryst.

Solids, Vol 120, 1990, p 47–60

32. J.T. Dickinson, L.C. Jensen, S. Lee, L. Scuderio, and S.C. Langford, Fracto-Emission and Electrical

Transients due to Interfacial Failure, J. Adhes. Sci. Technol., Vol 8, 1994, p 1285–1309

33. A. Dupre, Theorie Mechanique de la Chaleur, Paris, 1989

34. A. Bagchi and A.G. Evans, Measurements of the Debond Energy for Thin Metallization Lines on

Dielectrics, Thin Solid Films, Vol 286, 1996, p 203–212

35. R.G. Stringfellow and L.B. Freund, The Effect of Interfacial Friction on the Buckle-Driven Spontaneous

Delamination of a Compressed Thin Film, Int J. Solid Structures, Vol 30, 1993, p 1379–1395

36. A. Needleman, An Analysis of Tensile Decohesion along an Interface, J. Mech. Phys. Solids, Vol 38,

1990, p 289–324

37. W.D. Bascom, R.L. Cottington, R.C. Jones, and P. Peyster, Fracture of Epoxy and Elastomer Epoxy

Polymers in Bulk and as Adhesives, Organic Coat. Plast. Chem., Vol 34, 1974, p 300

38. J.N.B. Sutton, McGary, Polym. Eng. Sci., Vol 13, 1973, p 29

39. J.W. Hutchinson and Z. Suo, Adv. Appl. Mech., Vol 29, 1992, p 63

40. K.M. Liechti and Y.S. Chai, Biaxial Loading Experiments for Determining Interfacial Fracture

Toughness.J. Appl. Mech., Vol 58, 1991, p 680–687

41. V. Tvergaard V and J.W. Hutchinson, The Influence of Plasticity on Mixed Mode Interface Toughness,

J. Mech. Phys. Solids, Vol 41, 1993, p 1119–1135

42. P.A. Mataga and P. Ponte Castaneda, Stable Crack Growth along a Brittle/Ductile Interface-II Small

Scale Yielding Solutions and Interfacial Toughness, Int. J. Solids Struct., Vol 36 (No. 1), 1998, p 1–35

43. K.W. Allen, A Review of Contemporary Views of Theories of Adhesion, J. Adhes., Vol 21, 1987, p

261–277

44. J.W. Severin, R. Hokke, H. Van der Wel, and G. de With, The Influence of Thermal Treatments on the

Adhesion of Electrolessly Deposited Ni(P) Layers on Alumina Ceramic, J. Electrochem. Soc., Vol 141,

1994, p 816–824

45. Y.M. Aravot and A. Albu-Yaron, The Effect of Environmental Moisture on the Adhesion Toughness of

Epoxy-Coated Phosphated Steels, J. Mater. Sci. Lett., Vol 12, 1993, p 1437–1438

46. A. Leng, H. Streckel, and M. Stratman, The Delamination of Polymeric Coatings from Steel, Parts 1–4,

Corros. Sci., Vol 41, 1999, p 547–620

47. H. Wu, J.T. Dickinson, and S.C. Langford, Dynamic Measurements of Humidity Attack on

Polymer/Glass Interfaces under Stress, J. Adhes. Sci. Technol., Vol 11, 1997, p 695–717

48. D.-C. Hu and H.-Ch. Chen, Humidity Effect on Polyimide Film Adhesion, J. Mater. Sci., Vol 27, 1992,

p 5262–5268

49. K. Suganuma, K. Niihara, T. Fujita, and T. Okamoto, Metal-Ceramic Joints, Vol 8, Proc. MRS Int.

Meeting (Pittsburgh, PA), Doyamma et al., Ed., Materials Research Society, 1989, p 113

50. J.M. Howe, Bonding, Structure, and Properties of Metal/Ceramic Interface: Part 2, Interface Fracture

Behavior and Property Measurement, Int. Mater. Rev., Vol 38, 1993, p 257–271

51. N.I. Tymiak, M. Li, A.A. Volinsky, Y. Katz, and W.W. Gerberich, Environmental Effects on Cu/SiO

and Cu/Ti/SiO

Thin Film Adhesion, Reliability in Microelectronics MRS Proc., 1999

52. W.W. Gerberich, D.E. Kramer, N.I. Tymiak, A.A. Volinsky, D.F. Bahr, and M.D. Kriese,

Nanoindentation-Induced Defect-Interface Interactions: Phenomena Methods and Limitations Acta

Mater., Vol 47, 1999, p 4115–4123

53. Y. Katz, N.I. Tymiak, and W.W. Gerberich, Nano-mechanical Probes as New Approaches to

Hydrogen/Deformation Interaction Studies, An Invited Paper for Recent Advances in the Engineering

Aspects of Hydrogen Embrittlement, Eng. Fract. Mech., 2000

54. C.M. Baldwin and J.D. Mackenzie, Flame Sprayed Alumina on Stainless Steel for Possible Prosthetic

Application, J. Biomed. Mater. Res., Vol 10, 1976, p 445–453

55. M.K. Ferber and S.D. Brown, Delayed Failure of Plasma-Sprayed Al

Applied to Metallic Substrates,

J. Am. Ceram. Soc., Vol 64, 1981, p 737–741

56. D. Avigdor and S.D. Brown, Delayed Failure of a Porous Alumina, J. Am. Ceram. Soc., Vol 61, 1978, p

97–99

57. G. Xu, M.Y. He, and D.R. Clarke, The Effect of Moisture on the Fracture Energy of TiN/SiO

Interfaces in Multi-layer Thin Films, Acta Mater., Vol 47, 1999, p 4131–4141

58. M. Lane and R.H. Dauskardt, Subcritical Debonding of Multilayer Interconnect Structures: Temperature

and Humidity Effects, Reliability in Microelectronics, MRS Proc., Spring meeting, 1999

59. G. Xu, T. Mates, and D.R. Clarke, Moisture Diffusivity Measurement along SiO

/TiN Interface Using

Secondary Ion Mass Spectroscopy (SIMS), Reliability in Microelectronics, MRS Proc., 1999

60. N.R. Moody, S.K. Venkataraman, B. Bastaez, J.E. Angelo, and W.W. Gerberich, Hydrogen Effects on

the Fracture of Thin Tantalum Nitride Films, Mater. Res. Soc. Symp. Proc., Vol 356, 1995, p 827–832

61. Y.-H. Lai and D.A. Dillard, Using Fracture Efficiency to Compare Adhesion Tests, Int. J. Solids Struct.,

Vol 34, 1997, p 509–525

62. V. Tvergaard and J.W. Hutchinson, Toughness of an Interface along a Thin Ductile Layer Joining

Elastic Solids, Philos. Mag. A, 1994, p 641–656

63. Y. Wei and J.W. Hutchinson, Models of Interface Separation Accompanied by Plastic Dissipation at

Multiple Scales, Int. J. Fract., Vol 95, 1999, p 1–17

64. K.J. Hsia, Z. Suo, and W. Yang, Cleavage due to Dislocation Confinement in Layered Materials, J.

Mech. Phys. Sol., Vol 42, 1994, p 877–896

65. R.H. Dauskardt, M. Lane, Q. Ma, and N. Krishna, Adhesion and Debonding of Multi-Layer Thin Film

Structures, Eng. Fract. Mech., Vol 61, 1998, p 141–162

66. W.W. Gerberich. A.A. Volinsky, N.I. Tymiak, and N.R. Moody, A Brittle to Ductile Transition in

Adhered Thin Films, Fall MRS 1999 (Boston), Vol 594, 2000

67. P.G. Charlambides, J. Lund, A.G. Evans, and R.M. McMeeking, A Test Specimen for Determining the

Fracture Resistance of Bimaterial Interfaces, J. Appl. Mech., Vol 101, 1989, p 77–82

68. A.G. Evans and B.J. Dalgleish, The Fracture Resistance of Metal-Ceramic Interfaces, Acta Metall.

Mater., Vol 40, Suppl. Issue, 1992, p S295–306

69. G. Elssner, T. Suga, and M. Turwitt, Determination of the Fracture Energy and the Fracture Resistance

of Interfaces, J. Phys. Coll. (Orsay), Vol 46, 1985, p 657–663

70. R.M. Cannon, V. Jayaram, B.J. Dalgleish, and R.M. Fisher, MRS Symp. Proc., Vol 72, 1986, p 121

71. T.S. Oh, R.M. Cannon, and R.O. Ritchie,J. Am. Ceram. Soc., Vol 70, 1987, p C532

72. A.J. Kinloch, C.C. Lau, and J.G. Williams, The Peeling of Flexible Laminates, Int. J. Fract., Vol 66,

1994, p 45–70

73. A.P. Jackson, The Peeling of Surgical Pressure-Sensitive Adhesives at Different Angles, J. Mater. Sci.

Lett., Vol 7, 1988, p 1368–1370

74. E.H. Andrews and A. Stevenson, Fracture Energy of Epoxy Resin under Plane Strain Conditions, J.

Mater. Sci., Vol 13, 1978, p 1680–1688

75. H.M. Jensen, The Blister Test for Interface Toughness Measurement, Eng. Fract. Mech., Vol 40, 1991,

p 475–486

76. R.J. Hohlfelder, H. Luo, J.J. Vlassak, C.E.D. Chidsey, and W.D. Nix, Measuring Interfacial Fracture

Toughness with the Blister Test, Thin Films: Stresses and Mechanical Properties VI. Symposium,

Materials Research Society, 1997, p 115–120

77. M. Dupeux, A. Bosseboeuf, and D. Buttard, Investigation of the Mechanical Properties and Adhesion of

P.V.D. Tungsten Films on Si and Si Compounds by Bulge and Blister Tests, MRS Spring Meeting (San

Francisco), 13–17 April 1998

78. K.R. Jiang and L.S. Penn, Use of the Blister Test to Study the Adhesion of Brittle Materials, J. Adhes.,

Vol 32, 1990, Part I, p 203–216; Part II, p 217–226

79. L. Arcan, Y.M. Aravot, M.E. Arcan, and A. Albu-Yaron, Ultramicroscopy, Vol 23, 1987, p 234

80. Y.M. Aravot and A. Albu-Yaron, Ultramicroscopy, Vol 26, 1991, p 6423

81. D.B. Marshal and A.G. Evans, Measurement of Adherence of Residually Stressed Thin Film by

Indentation. I. Mechanics of Interface Delamination, J. Appl. Phys., Vol 56, 1984, p 2632–2638

82. M.J. Matthewson, Axi-Symmetric Contact on Thin Compliant Coatings, J. Mech. Phys. Solids, Vol 29,

1981, p 89–113

83. L.G. Rosenfeld, J.E. Ritter, T.J. Larner, and M.R. Lin, Use of the Microindentation Technique for

Determining Interfacial Fracture Energy, J. Appl. Phys., Vol 67, 1990, p 3291–3296

84. M. De Boer and W.W. Gerberich, Microwedge Indentation of the Thin Film Fine Line, I. Mechanics,

Acta Mater., Vol 44, 1996, p 3169–3175

85. J.J. Vlassak, M.D. Drory, and W.D. Nix, A Simple Technique for Measuring the Adhesion of Brittle

Films to Ductile Substrates with Applications to Diamond-Coated Titanium, J. Mater. Res., Vol 12,

1997, p 1900–1910

86. M.D. Kriese, W.W. Gerberich, and. N.R. Moody, Quantitative Adhesion Measures of Multilayer Films.

Part I. Indentation Mechanics, J. Mater. Res., Vol 14, 1999, p 3007–3018