Sun, Yangyang. Study on the nanocomposite underfill for flip-chip application

  1. Файлы
  2. Академическая и специальная литература
  3. Наноматериалы и нанотехнологии
  4. Наноматериаловедение
Наноматериаловедение
Наноматериалы и нанотехнологии
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Sun, Yangyang. Study on the nanocomposite underfill for flip-chip application
A Thesis Presented to The Academic Faculty . In Partial Fulfillment of the Requirements for the Degree Doctor of Philosophy in the School of Chemistry and Biochemistry
Georgia Institute of Technology, December, 2006. – 216 p.

Nanosilica synthesis and modification
Material properties characterization of the nanocomposite underfill after curing
Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica composites
The hardener effects to colloidal silica dispersion
Photo-polymerization of epoxy nanocomposite for wafer level application
Conclusions and suggested work
Appendix a author’s awards, patents, and publicaitons
Похожие разделы
  1. Академическая и специальная литература
  2. Машиностроение и металлообработка
  3. Конструирование и проектирование в машиностроении
  4. Материаловедение и ТКМ
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