238 7 Models of Various Forms of Batching
characterized as worthless (waste), bad and in need of rework, good wafers but low
cycle speeds, and excellent with high cycle speeds. Product 1 is made from the low
cycle speed processors that are immediately packaged and shipped. The high-speed
units are processed further by a second sequence through the basic operational steps
(using the same machines as previously) and then a final test is performed. Units
again are characterized as waste, rework and completed units (no low speed units
can come out of the second test). The completed units are then packaged and shipped
as the company’s high-grade product.
Microprocessor chips are produced by a process that starts with pure silicon
wafers that are fragile, flat, thin circular objects that look similar to glass. Patterns
are placed on the wafers by covering them with a photo-resist material and then ex-
posing the images onto the resist by shining light through a template or mast of the
desired image. The images are hardened by baking the wafer in an oven. A pattern
of holes is then etched into the mask layer by removing the exposed material. This
allows the dopants to be diffused into selected areas of the wafer. Specific ion atoms
(dopants) are implanted on the exposed surface (boron, phosphorous, and arsenic)
by diffusion processes. These processes are repeated hundreds of times to produce
a state of the art microprocessor. Then a wafer probe is used to functionally test the
individual processors on the wafer and characterize their performance potential. The
completed wafers are diced into single chips with a diamond saw and then attached
via glue to a package. The package provides the contact leads to the chip. Wire
bonding, generally with gold leads, is used to connect the package leads to the wire
connections within the chip. Then the package containing the chip is encapsulated
with a plastic coating for mechanical and environmental protection.
The MicroTex wafer fab is a state-of-the-art pilot facility with the latest cluster
tool technology. These fabrication processes are performed in three basic steps. The
first set of processing steps is performed in Workstation 1 with a pair of identical sin-
gle wafer processing equipment (machines). At the second workstation, the remain-
ing set of operations is performed in a batch mode using a single large capacity (up
to eight lots simultaneously) processor (similar to an oven operation). A third work-
station contains a single testing machine used to determine the wafer performance
characteristics. Workstation 4 consists of the packaging operations also performed
using a single piece of equipment. All of the completed products received the same
general processing using the same equipment, although the processing times vary
for the second production pass. The wafer units that have graded out as high quality
and speed are processed further.
To prepare for the second layer, the second time through the processing steps, a
separate distinct set of processing must be performed. This preparation processing
step is distinct from previous processing and, therefore, these operations are per-
formed on a separate machine in Workstation 5. When completed, these units are
sent back through the first three workstations for another sequence of processes. The
second sequence of processing has distinct times from those of the first sequence,
except for the batch operations of Workstation 2. This is fortunate, allowing batch-
ing at Workstation 2 to be indiscriminate of the type of wafers being processed.
That is, batches can consist of either or both types of wafers. If the high quality