144 10 Concluding Remarks
value of β reported in the literature is more spread out. For CVD, the stick-
ing coefficient can vary significantly depending on the materials used and the
temperature at which the materials are deposited.
Mound formation tends to dominate when the sticking coefficient s
0
is
larger than 0.5. The growth of the separation of mounds λ for both sput-
ter deposition and chemical vapor deposition in the large sticking coefficient
regime exhibits a power-law behavior, λ ∼ t
p
. There is a strong indication
that the exponent associated with this length scale is p ≈ 0.5, and is univer-
sal. It would be interesting to investigate this prediction in future experiments
utilizing a diverse set of materials. For oblique angle deposition, severe shad-
owing occurs to give a variety of isolated nanostructures where the β value
appears to be always 1. In this case, wavelength selection also gives p ≈ 0.5
[123, 156].
Although most of these predictions are based on the results of solid-on-
solid models because of their simplicity, models including overhang structures
may be more realistic when films grow thicker than a few microns. Due to
the challenge in defining the surface profile for a surface with overhangs, as is
observed in a ballistic aggregation model, fewer attempts to quantify such a
surface profile and compare results to experimental works have been reported
in the literature. For a thicker film, an overhang structure can effectively
serve as a smoothing mechanism, similar to the effect of a nonunity sticking
coefficient. Research in this direction would be of interest. It may even shine
some light on a possible quantitative description of the structural zone models
[159] that have often been used to qualitatively describe sputter deposited
films that are typically tens of microns thick, especially in Zone I, the low-
temperature regime where diffusion is not excessive.
Most of the discussions in this monograph have focused on growth that
occurs far-from-equilibrium. However, for many realistic systems and espe-
cially chemical vapor deposition, the deposition may occur at a sufficiently
high temperature that the system is not far-from-equilibrium and microscopic
energetics may come into play. A common growth phenomenon controlled by
energetics is the process of nucleation and growth, where the surface energy be-
comes important. The surface energy competition between the substrate and
depositing materials leads to the well-known three modes of film growth [163]:
layer-by-layer growth (Frank–Van der Merwe growth mode), island growth
(Volmer–Weber growth mode), and intermediate growth (Stranski–Krastanov
growth mode). These are of course a separate area of research.
We hope that the discussions and examples provided in this monograph
have given the reader a comprehensive overview of thin film growth modeling,
and aid in the many new discoveries waiting to be found in the field.