© Woodhead Publishing Limited, 2011
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Reflection high-energy electron diffraction
(RHEED) for in situ characterization of
thin film growth
G. Koster, University of twente, the Netherlands
Abstract: In this chapter reection high-energy electron diffraction
(rHeeD) is described in combination with pulsed laser deposition (PLD).
Both the use of RHEED as a real-time rate-monitoring technique as well
as methods to study the nucleation and growth during PLD are discussed.
After a brief introduction of rHeeD and demonstration of typical surface
diffraction patterns, a case will be made for the step-density model to
describe the intensity variations encountered during deposition. Finally,
an overview of these intensity variations, the intensity response during a
RHEED experiment as a result of various kinetic growth modes, will be
given.
Key words: thin lms, pulsed laser deposition, surface electron diffraction,
reection high-energy electron diffraction (RHEED).
1.1 Reflection high-energy electron diffraction
(RHEED) and pulsed laser deposition (PLD)
Reection high-energy electron diffraction (RHEED) was limited to low
background pressures only until the development of high-pressure RHEED,
which made it possible to monitor the surface structure in situ during the
deposition of oxides at higher pressures, presented new possibilities (Rijnders
et al., 1997). Figure 1.1 is a schematic picture of a typical high-pressure
RHEED set-up. Besides observed intensity oscillations due to layer-by-layer
growth, enabling accurate growth rate control, it has become clear that intensity
relaxation observed due to the typical pulsed way of deposition leads to a
wealth of information about growth parameters (Blank et al., 1998).
Pulsed laser deposition (PLD) has become an important technique in the
fabrication of novel materials. Starting in the mid-1960s (Ready, 1963), when
the rst attempts to produce high-quality thin lms showed the promise of
this technique, it has taken the discovery of high-T
c
superconductors for PLD
to become widespread. The main advantages of PLD are the relatively easy
stoichiometric transfer of material from the target to the substrate and an
almost free choice of (relatively high) background pressure. For instance,