394 B. Z. Mansurov
Method of Differential Magnetron Sputtering
The pressure of the saturated carbon vapours at a temperature of 500 K is
P = 10
-35
Torr. In contrast, the typical background pressure in the deposition
chamber in the process of plasma-chemical vapour deposition is P ≈ 10
-5
Torr. This pressure should be lower than the pressure of the carbon vapour
(a molecular stream) by 2 to 3 order of magnitude, i.e. P
C
≈ 10
-2
-10
-3
Torr.
Then, mass chaotic crystallization occurs at such (10
32
) oversaturation.
For the artificial reduction of the carbon oversaturation the essentially
new technique of the differential magnetron sputtering, which is based on
the balancing of streams of carbon from two magnetrons, is offered. This
technique will allow to solve the basic problem of the gas-phase synthesis
of diamond - the problem of irreversibility of the diamond growth process.
It will enable to grow diamond and diamond-like films with instrument
quality. Moreover, such tool enables the improvement of recipes for
epitaxial film growth in the presence of passivating gases with methods of
hydrocarbon decomposition, and also technological methods used for the
doping of film with well defined doping concentration.
On the basis of our theoretical calculations the technological apparatus
for the growth of carbon films by the method of differential magnetron
sputtering has been developed and designed. Figure 5 show a cross-
sectional view of the deposition apparatus. Two magnetrons (1) are located
symmetrically with respect to the copper anode (6). The experimental study
of the influence of the symmetry of external fields on the nucleation and
growth of the carbon films is carried out with three forms of anodes, which
have various axes of symmetry (3-fold, 4-fold, ∞). Laser irradiation of the
substrate comes from a source (7) located outside of the chamber by means
of the window VUP-5M (Vacuum Universal Post) and the mirror (9).
At the first stage, for depositing a copper buffer layer, copper atoms are
sputtered from the target (8) by Ar ions. On the second magnetron the
substrate (3) is located. The electrostatic field determines the energy of the
surface bombardment of a nucleus and a film, and, hence, it determines the
temperature of an adsorption layer and the speed at which the film is etched
away. The heaters (2) set the substrate temperature.
The deposition process of copper has to be performed in a mixed argon -
hydrogen atmosphere.
At
the second stage there is a change from the copper target to a
graphite one and then the carbon deposition is carried out in an argon
atmosphere.
Change of the voltage applied between the target and the
anode as well as between the substrate and the anode controls the streams
of carbon onto the substrate and from it.