Wiley. 2001. 355 p.
The six chapters of this volume treat various topics associated with electrochemical deposition of a solid phase.
In the ®rst chapter, on electrochemical atomic layer epitaxy, Stickney provides a review of experimental methodology and current accomplishments in the electrodeposition of compound semiconductors. The experimental procedures and detailed fundamental background associated with layer-by-layer assembly are summarized for various compounds. The surface chemistry associated with the electrochemical reactions that are used to form the layers is discussed, along with challenges and issues associated with device formation by this method.
Kolb describes in detail the use of Scanning Tunneling Microscopy to study the metal/electrolyte interfaces, currently one of the main techniques for gaining microscopic understanding of the early stages of deposit nucleation and growth. The key points associated with the experimental methodology are discussed in a strategic yet helpful manner including vibration damping, tip preparation, and cell design. Results are presented on the role of underpotential deposition, surface defects, pseudomorphic growth, additives, and deposition on chemically modi®ed surfaces.
Barkey reviews the spontaneous emergence of structure during deposition and the controlled exploitation of natural pathways of the process in order to produce highly organized and functional pattes. The discussion is organized by the physical scale of the electrodeposited structure, including patte formation, instability and shape selection, kinetic roughening, and crystal growth and nucleation. In addition, applications and associated mathematical modeling needed for control of structure at multiple scales is described.
Stojak, Fransaer and Talbot provide a summary of current experimental capabilities and mathematical modeling approaches associated with electrocodeposition of particles in a metallic matrix. The deposition of alumina particles in a copper matrix on rotating disk and rotating cylinder electrodes emerges as a widely-studied and well-characterized system for understanding the e?ect of process variables. The challenge of understanding and predicting behavior of such systems arises from the wide range of scales involved, which span from short-range interactions and adhesion forces to larger-scale convective ?ow ®elds. On the other hand, the technological use of electrocodeposition o?ers unique advantages for fabricating structures having unique properties.
O'Sullivan describes the fundamental theory, mechanistic aspects and practical issues associated with autocatalytic electroless metal deposition processes. Current approaches for gaining fundamental understanding of this complex process are described, along with results for copper, nickel and various alloys. Emphasis is placed on microelectronic applications that include formation of structures that are smaller than the di?usion layer thickness which in?uences structure formation.
The electrodeposition of transition metal ± aluminum alloys from chloroaluminate molten salts is reviewed by Sta?ord and Hussey. The chemical, electrochemical, and physical properties of the most commonly used chloroaluminate melts are reviewed.
The review provides detailed discussion of fundamental issues associated with electrodeposition of transition metal alloys formed by underpotential as well as by overpotential co-deposition with aluminum. Also presented are the main analytical methods used for characterization of electrodeposited Al alloys.
Contents
Electrochemical Atomic Layer Epitaxy (EC-ALE): Nanoscale Control in the Electrodeposition of Compound Semiconductors
The Initial Stages of Metal Deposition as Viewed by Scanning Tunneling Microscopy
Structure and Patte Formation in Electrodeposition
Review of Electrocodeposition
Fundamental and Practical Aspects of the Electroless Deposition Reaction
Electrodeposition of Transition Metal-Aluminum Alloys from Chloroaluminate Molten Salts
The six chapters of this volume treat various topics associated with electrochemical deposition of a solid phase.
In the ®rst chapter, on electrochemical atomic layer epitaxy, Stickney provides a review of experimental methodology and current accomplishments in the electrodeposition of compound semiconductors. The experimental procedures and detailed fundamental background associated with layer-by-layer assembly are summarized for various compounds. The surface chemistry associated with the electrochemical reactions that are used to form the layers is discussed, along with challenges and issues associated with device formation by this method.
Kolb describes in detail the use of Scanning Tunneling Microscopy to study the metal/electrolyte interfaces, currently one of the main techniques for gaining microscopic understanding of the early stages of deposit nucleation and growth. The key points associated with the experimental methodology are discussed in a strategic yet helpful manner including vibration damping, tip preparation, and cell design. Results are presented on the role of underpotential deposition, surface defects, pseudomorphic growth, additives, and deposition on chemically modi®ed surfaces.
Barkey reviews the spontaneous emergence of structure during deposition and the controlled exploitation of natural pathways of the process in order to produce highly organized and functional pattes. The discussion is organized by the physical scale of the electrodeposited structure, including patte formation, instability and shape selection, kinetic roughening, and crystal growth and nucleation. In addition, applications and associated mathematical modeling needed for control of structure at multiple scales is described.
Stojak, Fransaer and Talbot provide a summary of current experimental capabilities and mathematical modeling approaches associated with electrocodeposition of particles in a metallic matrix. The deposition of alumina particles in a copper matrix on rotating disk and rotating cylinder electrodes emerges as a widely-studied and well-characterized system for understanding the e?ect of process variables. The challenge of understanding and predicting behavior of such systems arises from the wide range of scales involved, which span from short-range interactions and adhesion forces to larger-scale convective ?ow ®elds. On the other hand, the technological use of electrocodeposition o?ers unique advantages for fabricating structures having unique properties.
O'Sullivan describes the fundamental theory, mechanistic aspects and practical issues associated with autocatalytic electroless metal deposition processes. Current approaches for gaining fundamental understanding of this complex process are described, along with results for copper, nickel and various alloys. Emphasis is placed on microelectronic applications that include formation of structures that are smaller than the di?usion layer thickness which in?uences structure formation.
The electrodeposition of transition metal ± aluminum alloys from chloroaluminate molten salts is reviewed by Sta?ord and Hussey. The chemical, electrochemical, and physical properties of the most commonly used chloroaluminate melts are reviewed.
The review provides detailed discussion of fundamental issues associated with electrodeposition of transition metal alloys formed by underpotential as well as by overpotential co-deposition with aluminum. Also presented are the main analytical methods used for characterization of electrodeposited Al alloys.
Contents
Electrochemical Atomic Layer Epitaxy (EC-ALE): Nanoscale Control in the Electrodeposition of Compound Semiconductors
The Initial Stages of Metal Deposition as Viewed by Scanning Tunneling Microscopy
Structure and Patte Formation in Electrodeposition
Review of Electrocodeposition
Fundamental and Practical Aspects of the Electroless Deposition Reaction
Electrodeposition of Transition Metal-Aluminum Alloys from Chloroaluminate Molten Salts